Removable lid for flip chip-ball grid array (FC-BGA) packages
Assemblies, systems, and methods are described herein for a removable lid for flip chip-ball grid array (FC-BGA) packages. An example removable lid assembly for an integrated circuit (IC) package includes at least one pedestal configured to be attached to a substrate, a lid configured to be reversibly secured to the at least one pedestal, and a plurality of fasteners configured to reversibly secure the lid to the at least one pedestal. In an installed state of the removable lid assembly in which the removable lid assembly is attached to the substrate, the lid is spaced from the substrate and the electrical components of the substrate. In the installed state, the removable lid assembly enhances a stiffness of the substrate, thereby reducing warpage of the substrate during a reflow process applied to the substrate. Corresponding systems and methods are also provided.
1 . A removable lid assembly for an integrated circuit (IC) package comprising:
at least one pedestal configured to be attached to a substrate, wherein the substrate is configured to support electrical components;
a lid configured to be reversibly secured to the at least one pedestal; and
a plurality of fasteners configured to reversibly secure the lid to the at least one pedestal,
wherein, in an installed state of the removable lid assembly in which the removable lid assembly is attached to the substrate, the lid is spaced from the electrical components of the substrate, and
wherein, in the installed state, the removable lid assembly enhances a stiffness of the substrate, thereby reducing warpage of the substrate during a reflow process applied to the substrate.
2 . The removable lid assembly of claim 1 , wherein the lid at least partially covers the substrate in the installed state.
3 . The removable lid assembly of claim 2 , wherein the lid defines a central body and a plurality of support members extending from the central body, wherein the plurality of support members is configured to extend to an outer edge of the substrate in the installed state.
4 . The removable lid assembly of claim 3 , wherein the central body of the lid defines an opening configured to overlie and allow access to a central portion of the substrate in the installed state.
5 . The removable lid assembly of claim 3 , wherein the central body of the lid is configured to constrain warpage of a central portion of the substrate in the installed state through direct contact.
6 . The removable lid assembly of claim 1 , wherein the lid fully covers the substrate in the installed state.
7 . The removable lid assembly of claim 1 , wherein the at least one pedestal comprises a plurality of pedestals.
8 . The removable lid assembly of claim 1 , wherein the at least one pedestal is configured to be bonded to the substrate prior to the lid being reversibly secured to the at least one pedestal.
9 . The removable lid assembly of claim 1 , wherein the at least one pedestal is configured to be removed from the substrate following application of the reflow process.
10 . The removable lid assembly of claim 1 , wherein the removable lid assembly is compatible with co-packaged optic (CPO) and co-packaged copper (CPC) packages.
11 . The removable lid assembly of claim 1 , wherein the reflow process is a ball grid array (BGA) reflow process.
12 . A method for manufacturing an electronic apparatus, comprising:
providing a substrate;
assembling an integrated circuit (IC) package by:
connecting electrical components to the substrate;
attaching at least one pedestal to the substrate;
using a plurality of fasteners to reversibly secure a lid to the at least one pedestal, wherein the at least one pedestal, the lid, and the plurality of fasteners form a removable lid assembly; and
installing the IC package on a printed circuit board (PCB) using a reflow process,
wherein the removable lid assembly enhances a stiffness of the substrate, thereby reducing warpage of the substrate during the reflow process that is applied to the substrate.
13 . The method of claim 12 , wherein the reflow process comprises a reflow process for co-packaged optics (CPO) and co-packaged copper (CPC).
14 . The method of claim 12 , wherein the removable lid assembly is configured to constrain warpage of the IC package.
15 . The method of claim 12 further comprising removing the plurality of fasteners and the lid following completion of the reflow process.
16 . The method of claim 12 , wherein the lid defines a central body and a plurality of support members extending from the central body, wherein the plurality of support members is configured to extend to an outer edge of the substrate.
17 . The method of claim 12 , wherein the at least one pedestal is configured to be bonded to the substrate prior to the lid being reversibly secured to the at least one pedestal.
18 . A system configured to enable ball grid array (BGA) reflow on an IC package, the system comprising:
a substrate;
electrical components supported by the substrate; and
a removable lid assembly attached to the substrate, wherein the removable lid assembly comprises:
at least one pedestal configured to be attached to the substrate;
a lid configured to be reversibly secured to the at least one pedestal; and
a plurality of fasteners configured to reversibly secure the lid to the at least one pedestal,
wherein the substrate, the electrical components, and the removable lid assembly form an IC package,
wherein the lid is spaced from the electrical components, and
wherein the removable lid assembly enhances a stiffness of the IC package, thereby reducing warpage of the substrate during a reflow process applied to the IC package.
19 . The system of claim 18 further comprising a printed circuit board (PCB), wherein the IC package is configured to be attached to and in electrical communication with the PCB.
20 . The system of claim 18 , wherein the lid is removed from the removable lid assembly following attachment of the IC package to the PCB.