Heat exchanger and small cell radio node incorporating the same
A heat exchanger includes a roll-bond evaporator having a heatpipe channel network spanning a primary panel area and at least one secondary multiple panel area, and at least one plurality of fins joined to at least one secondary panel area. The primary panel area is configured to receive electronic circuitry, heat transfer fluid is evaporated in heatpipe channels of the primary panel area, the heat transfer fluid is condensed in heatpipe channels in the secondary panel area(s), and heat is dissipated by the fins into an ambient environment. Secondary panel areas may be bent to bound a cavity and/or assume a generally cylindrical shape. The heat exchanger may be incorporated into a small cell radio node for 5G telecommunications.
1 . An electronic device comprising:
electronic circuitry; and
a heat exchanger comprising a roll-bond evaporator that comprises:
a first metallic sheet and a second metallic sheet distinct from the first metallic sheet, the second metallic sheet overlapping and bonded to the first metallic sheet, the sheets jointly defining a primary panel area and at least one secondary panel area, wherein the at least one secondary panel area is one of a plurality of secondary panel areas, and
a heatpipe channel network arranged along an interface between the bonded first and second metallic sheets, wherein the heatpipe channel network comprises first heatpipe channels arranged in the primary panel area and second heatpipe channels arranged in the at least one secondary panel area, the second heatpipe channels being in fluid communication with the first heatpipe channels; and
at least one plurality of fins joined to the at least one secondary panel area, wherein the at least one plurality of fins are joined by a plurality of folds with fin faces extending in a vertical direction; wherein the electronic circuitry is mounted on the primary panel area and within a cavity formed by the primary panel area in combination with the plurality of secondary panel areas to permit heat generated by the electronic circuitry to be conveyed into the first heatpipe channels.
2 . The electronic device of claim 1 , wherein the at least one secondary panel area is non-coplanar with the primary panel area.
3 . The electronic device of claim 2 , wherein the roll-bond evaporator comprising at least one bend area arranged between the primary panel area and the at least one secondary panel area.
4 . The electronic device of claim 3 , wherein the heatpipe channel network extends through the at least one bend area and provides fluid communication between the first heatpipe channels and the second heatpipe channels.
5 . The electronic device of claim 3 , wherein the heat exchanger further comprises a conduit external to the first and second metal sheets, and wherein the conduit provides fluid communication between the first heatpipe channels and the second heatpipe channels.
6 . The electronic device of claim 1 , wherein:
the at least one secondary panel area comprises first and second secondary panel areas; and
the at least one plurality of fins comprises a first plurality of fins joined to the first secondary panel area and comprises a second plurality of fins joined to the second secondary panel area.
7 . The electronic device of claim 1 , wherein each fin of the at least one plurality of fins comprises a thickness of no greater than 2 mm.
8 . The electronic device of claim 1 , wherein the primary panel area includes at least one cutout configured to receive components associated with the electronic circuitry.
9 . The electronic device of claim 1 , wherein the at least one plurality of fins is configured to dissipate at least 5 watts into an ambient air environment in which the heat exchanger is located.
10 . The electronic device of claim 1 , wherein the at least one secondary panel area is provided in a substantially cylindrical configuration around a longitudinal axis, and the at least one plurality of fins comprises multiple fins that are radially arranged around the longitudinal axis, with each fin having a face extending in a direction generally parallel to the longitudinal axis.
11 . The electronic device of claim 1 , wherein the at least one secondary panel area comprises the plurality of secondary panel areas that are non-coplanar with the primary panel area.
12 . The electronic device of claim 1 , wherein the heatpipe channel network contains a heat exchange fluid, the primary panel area comprises an evaporator region configured to evaporate the heat exchange fluid, and the at least one secondary panel area comprises a condenser region configured to condense the heat exchange fluid.
13 . A radio node comprising the electronic device of claim 1 wherein:
the electronic circuitry comprises radio circuitry configured to distribute wireless communication signal streams to multiple wireless client devices.
14 . An electronic device fabrication method comprising:
defining a heatpipe channel network along an interface between bonded first and second planar metallic sheets to produce a roll-bond evaporator, the heatpipe channel network comprising first heatpipe channels arranged in a primary panel area of the roll-bond evaporator, and comprising second heatpipe channels arranged in at least one secondary panel area of the roll-bond evaporator, wherein the at least one secondary panel area is one of a plurality of secondary panel areas;
joining at least one plurality of fins to the at least one secondary panel area, wherein the at least one plurality of fins are joined by a plurality of folds with fin faces extending in a vertical direction; and
mounting electronic circuitry on the primary panel area and within a cavity formed by the primary panel area in combination with the plurality of secondary panel areas to permit heat generated by the electronic circuitry to be conveyed into the first heatpipe channels.
15 . The electronic device fabrication method of claim 14 , further comprising forming at least one bend area in the roll-bond evaporator arranged between the
primary panel area and the at least one secondary panel area, to cause the at least one secondary panel area to be non-coplanar with the primary panel area.
16 . The electronic device fabrication method of claim 15 , further comprising providing a conduit external to the first and second metal sheets, the conduit providing fluid communication between the first heatpipe channels and the second heatpipe channels.
17 . The electronic device fabrication method of claim 14 , wherein the joining of the at least one plurality of fins to the at least one secondary panel area is performed by one or more of brazing, thermal bonding, and adhesive bonding.
18 . The electronic device fabrication method of claim 14 , wherein the method further comprises:
providing bend areas between the plurality of secondary panel areas and the primary panel area to form the cavity bounded by the plurality of secondary panel areas and the primary panel area.
19 . The electronic device fabrication method of claim 14 , further comprising:
shaping the at least one secondary panel area into a substantially cylindrical configuration around a longitudinal axis; and
causing the at least one plurality of fins to be radially arranged around the longitudinal axis, with each fin having a face extending in a direction generally parallel to the longitudinal axis.
20 . The electronic device fabrication method of claim 14 , wherein the electronic circuitry comprises radio circuitry configured to distribute wireless communication signal streams to multiple wireless client devices.