Heatsink with phase changing plugs and extinguishing coolant
An apparatus and method for extinguishing a thermal runaway in an electronic component is provided. The apparatus comprises a heatsink affixed to the electronic component, a reservoir containing coolant, and one or more Phase Change Material (PCM) plugs blocking coolant contained in the reservoir, where the PCM plugs, in response to the electronic component being at an approximate temperature of the Phase Change Temperature (PCT) of the PCM plugs, melt, thereby causing coolant to being dispersed onto the electronic component. The method comprises, in response to the electronic component reaching a temperature indicative of a thermal runaway event occurring in the electronic component, melting one or more phase change material (PCM) plugs, wherein the PCM plugs block coolant from draining out of a reservoir. In response to the PCM plugs melting, releasing the coolant from the reservoir onto the electronic component to extinguish the thermal runaway event.
1 . An apparatus for dispersing localized coolant to an electronic component to protect in an event of thermal runaway, the apparatus comprising:
a heatsink affixed to the electronic component;
a reservoir in the heatsink, the reservoir containing the coolant and having a drain;
a Phase Change Material (PCM) plug located close to the electronic component, the PCM plug being affixed to the drain and blocking release of the coolant contained in the reservoir; and
diverting channels, wherein at least one diverting channel directs at least a portion of the coolant directly to a side of the electronic component,
wherein:
in response to a temperature of the electronic component being at a Phase Change Temperature (PCT) of the PCM plug, the PCM plug melting thereby allowing release of the coolant to pass through the drain and to disperse via the diverting channels onto the electronic component.
2 . The apparatus of claim 1 , wherein the PCT of the PCM plugs is a temperature that would cause a thermal runaway event in the electronic component.
3 . The apparatus of claim 1 , the apparatus further comprising:
a perimeter wall, wherein the perimeter wall surrounds the electronic component.
4 . The apparatus of claim 3 , wherein the perimeter wall contains the coolant within an area surrounding the electronic component.
5 . The apparatus of claim 1 , the apparatus further comprising:
a plurality of microcapsules mixed with the coolant, wherein the microcapsules rupture at the PCT of the PCM plugs.
6 . A method for extinguishing a thermal runaway event in an electronic component, the method comprising:
affixing a heatsink to the electronic component, the heatsink including:
a reservoir containing a coolant,
a drain for releasing the coolant from the reservoir,
a phase change material (PCM) plug blocking the drain from releasing the coolant, and
diverting channels connected to the drain for directing released coolant wherein at least one diverting channel is configured to direct at least a portion of the released coolant to a side of the electronic component;
in response to the electronic component reaching a temperature indicative of the thermal runaway event in the electronic component, melting the PCM plug; and
in response to the PCM plug melting, releasing the coolant through the drain and dispersing at least a portion of the released coolant through the at least one diverting channel onto the side of the electronic component, the dispersing of the coolant through the diverting channels thereby extinguishing the thermal runaway event.
7 . The method of claim 6 , wherein a phase change temperature (PCT) of the PCM plug is the temperature indicative of the thermal runaway event in the electronic component.
8 . The method of claim 6 , wherein the reservoir is enclosed by the heatsink affixed to the electronic component.
9 . The method of claim 6 , further comprising:
providing a perimeter wall surrounding the electronic component.
10 . The method of claim 9 , wherein the perimeter wall contains the released coolant within an area surrounding the electronic component.
11 . The method of claim 6 , wherein the coolant includes a plurality of microcapsules configured to rupture at a phase change temperature PCT) of the PCM plugs.