System and method for thermal management of hardware components
Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have a limited thermal operating range. To retain the temperatures of hardware components within their operating ranges, the data processing system may include heat sinks fitted to the hardware components that are both able to cool and warm the fitted hardware components.
1 . A data processing system, comprising:
a hardware component;
a fan adapted to generate a flow of gas to cool the hardware component; and
a heatsink positioned with the hardware component, the heatsink comprising:
a base adapted to establish a thermal condition path with the hardware component;
plates, in thermal communication with the base, adapted to exchange heat with the flow of the gas to cool the hardware component;
an edge connector that bridges a gap between a first edge of a first plate of the plate and a second edge of a second plate of the plates, the edge connector defining a portion of an interconnected surface that interconnects a portion of the plates;
a heating assembly positioned on the interconnected surface and adapted to selectively warm the hardware component substantially through conduction heating via the base, the plates, and the edge connector; and
a heat pipe that places the base in thermal communication with the plates,
wherein the heat pipe is positioned such that vapor inside the heat pipe ascends from the base to the plates due to heat and liquid inside the heat pipe returns from the plates to the base due to gravity.
2 . The data processing system of claim 1 ,
wherein the plates are arranged in a stack and the plates do not directly contact the base.
3 . The data processing system of claim 1 , wherein the heatsink further comprises:
edge connectors comprising the edge connector, the edge connectors being positioned to maintain predetermined distances between edges of the plates.
4 . The data processing system of claim 3 , wherein the edge connectors are positioned to maintain the predetermined distances on two sides of the plates.
5 . The data processing system of claim 4 , wherein the edge connectors further define a portion of a second interconnected surface that interconnects the portion of the plates, the interconnected surface being on a first of the two sides of the plates and the second interconnected surface being on a second side of the two sides of the plates.
6 . The data processing system of claim 5 , wherein the heatsink further comprises:
a second heating assembly positioned on the second interconnected surface and adapted to selectively warm the hardware component substantially through conduction heating via the base, the plates, and the edge connector.
7 . The data processing system of claim 6 , wherein the heatsink further comprises:
gas flow channels through which gases may flow to cool the plates, the gas flow channels being delimited on four sides by the plates and the edge connectors.
8 . The data processing system of claim 7 , wherein lengths of the gas flow channels are aligned with a direction of the flow of the gas generated by the fan.
9 . The data processing system of claim 3 , wherein the edge connectors are positioned to maintain the predetermine distances on a first side of the plates.
10 . The data processing system of claim 9 , wherein a second side of each of the plates is directly connected to the base.
11 . A heat sink for a hardware component, comprising:
a base adapted to establish a thermal condition path with the hardware component;
plates, in thermal communication with the base, adapted to exchange heat with gases in an ambient environment;
an edge connector that bridges a gap between a first edge of a first plate of the plate and a second edge of a second plate of the plates, the edge connector defining a portion of an interconnected surface that interconnects a portion of the plates; and
a heating assembly positioned on the interconnected surface and adapted to selectively warm the hardware component substantially through conduction heating via the base, the plates, and the edge connector; and
a heat pipe that places the base in thermal communication with the plates,
wherein the heat pipe is positioned such that vapor inside the heat pipe ascends from the base to the plates due to heat and liquid inside the heat pipe returns from the plates to the base due to gravity.
12 . The heat sink of claim 11 ,
wherein the plates are arranged in a stack and the plates do not directly contact the base.
13 . The heat sink of claim 11 , further comprising:
edge connectors comprising the edge connector, the edge connectors being positioned to maintain predetermined distances between edges of the plates.
14 . The heat sink of claim 13 , wherein the edge connectors are positioned to maintain the predetermine distances on two sides of the plates.
15 . The heat sink of claim 14 , wherein the edge connectors further define a portion of a second interconnected surface that interconnects the portion of the plates, the interconnected surface being on a first of the two sides of the plates and the second interconnected surface being on a second side of the two sides of the plates.
16 . The heat sink of claim 15 , further comprising:
a second heating assembly positioned on the second interconnected surface and adapted to selectively warm the hardware component substantially through conduction heating via the base, the plates, and the edge connector.
17 . The heat sink of claim 16 , further comprising:
gas flow channels through which gases may flow to cool the plates, the gas flow channels being delimited on four sides by the plates and the edge connectors.
18 . The heat sink of claim 13 , wherein the edge connectors are positioned to maintain the predetermine distances on a first side of the plates.
19 . The heat sink of claim 18 , wherein a second side of each of the plates is directly connected to the base.
20 . The heat sink of claim 19 , further comprising:
gas flow channels through which gases may flow to cool the plates, the gas flow channels being delimited on four sides by the plates, the edge connectors, and the base.