In-vehicle device
An in-vehicle device includes a circuit board on which a heat generating component (electronic component) is mounted, a first housing (base member) that faces the heat generating component, and a thermal conductive material that fills a space between the heat generating component and the first housing. The first housing includes a first surrounding portion and a second surrounding portion. The first surrounding portion is formed inside a region of the first housing that overlaps with the heat generating component while having the thermal conductive material interposed therebetween, and surrounds a point in the region of the first housing that faces the center of the heat generating component. The second surrounding portion is formed outside the region of the first housing, and surrounds the first surrounding portion.
1 . An in-vehicle device comprising:
a circuit board on which a heat generating component is mounted;
a first housing that faces the heat generating component; and
a thermal conductive material that fills a space between the heat generating component and the first housing,
wherein the first housing includes a first surrounding portion that is formed inside a region of the first housing that overlaps with the heat generating component while having the thermal conductive material interposed therebetween and surrounds a point in the region of the first housing that faces a center of the heat generating component,
wherein the first surrounding portion comprises at least one groove extending through the first surrounding portion to allow controlled outflow of excess thermal conductive material of the thermal conductive material from an inner side of the first surrounding portion to an outer side of the first surrounding portion during assembly and is configured to control the excess thermal conductive material outward during the assembly while maintaining the thermal conductive material centered over the heat generated component, and
wherein a second surrounding portion that is formed outside the region of the first housing and surrounds the first surrounding portion,
wherein a depth dimension of the at least one groove is smaller than a maximum value of a height dimension of the first surrounding portion.
2 . The in-vehicle device according to claim 1 , wherein an inner wall of the second surrounding portion is positioned outside a side surface of the heat generating component.
3 . The in-vehicle device according to claim 2 , wherein an upper end of the second surrounding portion is positioned between a surface of the heat generating component that faces the first housing and a surface of the circuit board that faces the first housing.
4 . The in-vehicle device according to claim 1 , wherein a height dimension of the second surrounding portion is larger than a height dimension of the first surrounding portion.
5 . The in-vehicle device according to claim 1 , wherein the first surrounding portion has a polygonal shape.
6 . The in-vehicle device according to claim 5 , wherein the first surrounding portion has a quadrangular shape.
7 . The in-vehicle device according to claim 5 , wherein the first surrounding portion and the second surrounding portion are arranged in such a way to be parallel to each side of the heat generating component.
8 . The in-vehicle device according to claim 1 , wherein the first surrounding portion has a circular shape.
9 . The in-vehicle device according to claim 1 , wherein the first housing includes a gate that adjusts an opening area of the at least one groove.
10 . The in-vehicle device according to claim 1 , wherein the heat generating component has a rectangular shape with respect to a surface of the circuit board, and
a number of grooves facing a short side of the heat generating component is larger than a number of grooves facing a long side of the heat generating component.
11 . The in-vehicle device according to claim 1 , wherein the heat generating component has a rectangular shape with respect to a surface of the circuit board, and
a depth dimension of the at least one groove facing a short side of the heat generating component is larger than a depth dimension of the at least one groove facing a long side of the heat generating component.
12 . The in-vehicle device according to claim 1 , wherein the first surrounding portion has an inclination for preventing air bubbles from entering the thermal conductive material.
13 . The in-vehicle device according to claim 1 , further comprising a second housing that is fitted to the first housing and covers the circuit board.
14 . The in-vehicle device according to claim 1 , wherein the at least one groove is configured to guide excess thermal conductive material outward during assembly to reduce void formation at an interface between the heat generating component and the first housing.
15 . The in-vehicle device according to claim 1 , wherein the at least one groove is configured to allow a crushed shape of the thermal conductive material in an X-Y plane of the in-vehicle device.
16 . The in-vehicle device according to claim 1 , wherein the first surrounding portion is positioned between the heat generating component and the second surrounding portion and is spaced apart from the second surrounding portion to define a space therebetween.
17 . The in-vehicle device according to claim 1 , wherein the first surrounding portion has an inclination configured to prevent air bubbles from entering the thermal conductive material by providing a sloped surface that guides a flow of the thermal conductive material and eliminates air entrapment during assembly.
18 . The in-vehicle device according to claim 1 , wherein the at least one groove comprises a gate structure that reduces an opening area of the groove to control a flow rate of the thermal conductive material flowing through the groove, wherein a depth dimension of the groove is smaller than a maximum value of a height dimension of the first surrounding portion to create the gate structure.