Image sensor and method of fabricating the same

1 . An image sensor, comprising:

a substrate including a pixel area and an optically black area, and having a first surface and a second surface that are opposite to each other, wherein the second surface has a first recess formed therein in the optically black area;

a plurality of color filters on the second surface of the substrate on the pixel area;

a first optically black pattern in the first recess; and

a second optically black pattern on the optically black area and between the first optically black pattern and the substrate,

wherein, in the first recess, the second optically black pattern covers lateral surfaces and a bottom surface of the first optically black pattern,

wherein the first optically black pattern is formed of a material that is the same as a material forming a color filter of the plurality of color filters, and

wherein top surfaces of the plurality of color filters and a top surface of the first optically black pattern are at the same level.

2 . The image sensor as claimed in claim 1 , wherein an uppermost end of the second optically black pattern is at a level that is the same as or lower than the level of the top surface of the first optically black pattern.

3 . The image sensor as claimed in claim 1 , wherein the second optically black pattern includes a material that is different from the material of the first optically black pattern and materials of the plurality of color filters.

4 . The image sensor as claimed in claim 1 , wherein the second optically black pattern includes tungsten (W).

5 . The image sensor as claimed in claim 1 , wherein the substrate further includes a pad area, and

wherein the image sensor further comprises a conductive pad in a second recess on the second surface of the substrate on the pad area.

6 . The image sensor as claimed in claim 5 , wherein a bottom surface of the second recess is at a level that is the same as or lower than a level of a bottom surface of the first recess.

7 . The image sensor as claimed in claim 5 ,

wherein the second optically black pattern extends onto the pad area, and in the first recess, covers lateral surfaces and a bottom surface of the first optically black pattern.

8 . The image sensor as claimed in claim 1 , further comprising a planarization pattern on the second surface of the substrate on the pixel area and the optically black area,

wherein the planarization pattern covers the plurality of color filters and the first optically black pattern, and

wherein a top surface of the planarization pattern is flat.

9 . The image sensor as claimed in claim 1 , further comprising:

an interlayer dielectric layer on the first surface of the substrate;

a wiring line in the interlayer dielectric layer; and

a via plug that penetrates the substrate and a portion of the interlayer dielectric layer to electrically connect the second optically black pattern to the wiring line.

10 . An image sensor, comprising:

a substrate that includes a pixel area, an optically black area, and a pad area;

a first recess on a top surface of the substrate on the optically black area;

a second recess on the top surface of the substrate on the pad area;

a plurality of color filters on the substrate on the pixel area;

a first optically black pattern that conformally covers a bottom surface and inner lateral surfaces of the first recess on the optically black area;

a second optically black pattern that fills an unoccupied portion of the first recess on the optically black area; and

a conductive pad on the substrate on the pad area,

wherein the second optically black pattern includes a material that is the same as a material of a color filter of the plurality of color filters, and

wherein the first optically black pattern includes a material that is different from the material of the second optically black pattern and the materials of the plurality of color filters.

11 . The image sensor as claimed in claim 10 , wherein top surfaces of the plurality of color filters and a top surface of the second optically black pattern are at the same level.

12 . The image sensor as claimed in claim 10 , wherein the bottom surface of the first recess and a bottom surface of the second recess are at the same level.

13 . The image sensor as claimed in claim 10 , wherein an uppermost end of the first optically black pattern is at a level that is the same as or lower than a level of a top surface of the second optically black pattern.

14 . The image sensor as claimed in claim 10 , wherein the first optically black pattern includes tungsten.

15 . The image sensor as claimed in claim 10 , wherein the first optically black pattern extends onto the pad area, and in the second recess, is between the conductive pad and the second recess.

16 . The image sensor as claimed in claim 10 , further comprising a planarization pattern on the top surface of the substrate on the pixel area and the optically black area,

wherein the planarization pattern covers the plurality of color filters and the second optically black pattern, and

wherein a top surface of the planarization pattern is flat.

17 . The image sensor as claimed in claim 10 , further comprising:

an interlayer dielectric layer on a bottom surface of the substrate;

a wiring line in the interlayer dielectric layer; and

a via plug that penetrates the substrate and a portion of the interlayer dielectric layer to electrically connect the first optically black pattern to the wiring line.

18 . An image sensor, comprising:

a substrate that includes a pixel area and an optically black area;

a plurality of color filters on a top surface of the substrate on the pixel area;

a first optically black pattern in a recess on the top surface of the substrate on the optically black area;

a protection layer on the pixel area and the optically black area, the protection layer covering the plurality of color filters and the first optically black pattern on the top surface of the substrate; and

a color separation lens array layer on the protection layer,

wherein the color separation lens array layer has sections which each correspond to a respective color filter of the plurality of color filters and the color separation lens array layer includes a plurality of nano-posts disposed therein, the nano-posts of the plurality of nano-posts being arranged to branch rays of light included in incident light from the color separation lens array layer toward the plurality of color filters, the rays of light having differing wavelengths from one another,

wherein the first optically black pattern includes a material that is the same as a material of a first color filter of the plurality of color filters, and

wherein top surfaces of the plurality of color filters and a top surface of the first optically black pattern are on one plane.

19 . The image sensor as claimed in claim 18 , further comprising a second optically black pattern on the optically black area and between the first optically black pattern and a bottom surface of the recess,

wherein the second optically black pattern includes a material that is different from the material of the first optically black pattern and the materials of the plurality of color filters, and

wherein the top surfaces of the plurality of color filters and the top surface of the first optically black pattern are at the same level from the top surface of the substrate.