Semiconductor device package
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.
1 . A semiconductor device package, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
an optical device disposed over the substrate; and
an electronic device disposed under the substrate;
a case disposed under the substrate and defining a space for accommodating the electronic device; and
a thermal paste connecting the case and the electronic device;
wherein a vertical projection of the optical device on the first surface overlaps with a vertical projection of the case on the second surface of the substrate.
2 . The semiconductor device package of claim 1 , wherein a power of the electronic device is greater than a power of the optical device.
3 . The semiconductor device package of claim 2 , further comprising an electronic component disposed adjacent to the first surface of the substrate, wherein either the power of first component or the power of the optical device is greater than a power of the electronic component.
4 . The semiconductor device package of claim 1 , wherein the case includes two portions separated from each other by the thermal paste in a cross-sectional view.
5 . The semiconductor device package of claim 1 , wherein the vertical projection of the optical device on the first surface is spaced apart from the vertical projection of the electronic device on the second surface by a horizontal distance greater than zero.
6 . The semiconductor device package of claim 1 , wherein the case includes at least one opening.
7 . The semiconductor device package of claim 6 , wherein the thermal paste contacts the at least one opening of the case.
8 . The semiconductor device package of claim 3 , wherein the electronic component overlaps the electronic device vertically.
9 . The semiconductor device package of claim 6 , wherein the at least one opening of the case vertically overlaps the electronic device.