Light-emitting device and method of manufacturing light-emitting device
A light-emitting device includes: a light-emitting element having a first surface serving as a light extracting surface, a second surface located on a side opposite the first surface, and a lateral surface connecting the first surface and the second surface, wherein the light-emitting element includes an element electrode located at the second surface; a substrate comprising a wiring electrically connected to the element electrode; a metal post located between the element electrode and the wiring; a transmissive member configured to allow light from the light-emitting element to pass therethrough; and an adhesive resin located between the first surface of the light-emitting element and the transmissive member. A portion of the adhesive resin is located on the lateral surface of the light-emitting element and on a peripheral edge of the second surface of the light-emitting element.
1 . A light-emitting device comprising:
a light-emitting element having an upper surface serving as a light extracting surface, a lower surface located on a side opposite the upper surface, and a lateral surface connecting the upper surface and the lower surface, wherein the light-emitting element comprises an element electrode located at the lower surface;
a substrate comprising a wiring electrically connected to the element electrode;
a metal post located between the element electrode and the wiring;
a transmissive member configured to allow light from the light-emitting element to pass therethrough; and
an adhesive resin located between the upper surface of the light-emitting element and the transmissive member, wherein:
a portion of the adhesive resin is located on the lateral surface of the light-emitting element and on a peripheral area of the lower surface of the light-emitting element,
an outer edge of the transmissive member is sized so as to be located outward of an outer edge of the light-emitting element in a plan view, and
the adhesive resin forms a curved line protruding outward in a cross-sectional view at a lower surface of the transmissive member and the lateral surface of the light-emitting element, and is located so as to continue from the lateral surface of the light-emitting element to the peripheral area of the lower surface of the light-emitting element.
2 . The light-emitting device according to claim 1 , wherein:
the adhesive resin is further located so as to continue from the lower surface of the light-emitting element to a lateral surface of the metal post.
3 . The light-emitting device according to claim 1 , wherein:
in a plan view, a lateral surface of the metal post extends along and is spaced from the lateral surface of the light-emitting element, and
at least a portion of the lateral surface of the metal post includes a recessed portion.
4 . The light-emitting device according to claim 3 , wherein:
the element electrode is a first element electrode,
the light-emitting element further comprises a second element electrode located at the lower surface,
the metal post includes a first metal post located between the first element electrode and the wiring, and a second metal post located between the second element electrode and the wiring, and
the recessed portion is located on a lateral surface of the first metal post that is at an outer edge side of the light-emitting element and a lateral surface of the second metal post that is at an outer edge side of the light-emitting element.
5 . The light-emitting device according to claim 3 , wherein:
the recessed portion is one of a plurality of recessed portions provided on the lateral surface of the metal post.
6 . The light-emitting device according to claim 1 , wherein:
a distance between the lower surface of the light-emitting element and the substrate is in a range of 20 μm to 110 μm.
7 . The light-emitting device according to claim 1 , wherein:
the transmissive member includes a wavelength conversion layer containing a phosphor, and a light-transmissive layer having transmissivity, and
the wavelength conversion layer faces the upper surface of the light-emitting element.
8 . The light-emitting device according to claim 1 , wherein:
the light-emitting device further includes a light reflective member that covers an upper surface of the substrate, a lateral surface of the adhesive resin, a lateral surface of the transmissive member, and a lateral surface of the metal post, and
the light reflective member is located such that an upper surface of the transmissive member is exposed.
9 . The light-emitting device according to claim 8 , wherein:
the light-emitting device further comprises a lens having a curved surface protruding upward and located on the upper surface of the transmissive member.
10 . The light-emitting device according to claim 1 , wherein:
on the lower surface of the light-emitting element, the adhesive resin is located so as to have a thickness, in a vertical direction parallel to a thickness direction of the light-emitting element, equal to or less than 1/10 of a maximum value of a length, in the vertical direction, of the lateral surface of the light-emitting element.
11 . A method of manufacturing a light-emitting device, the method comprising steps of:
preparing a light-emitting element mounted substrate that comprises:
a light-emitting element having an upper surface serving as a light extracting surface, a lower surface located on a side opposite the upper surface, and a lateral surface connecting the upper surface and the lower surface, wherein the light-emitting element comprises an element electrode located on the lower surface, and
a substrate,
wherein the element electrode and the substrate are electrically joined through a metal post;
depositing an adhesive resin on the upper surface of the light-emitting element;
mounting a transmissive member on the adhesive resin; and
forming a light reflective member that directly or indirectly covers the substrate and the light-emitting element, wherein:
in the step of mounting the transmissive member, the adhesive resin is located between the upper surface of the light-emitting element and the transmissive member, on the lateral surface of the light-emitting element, and on a peripheral area of the lower surface of the light-emitting element,
in the step of preparing the light-emitting element mounted substrate, the metal post includes a recessed portion on at least a portion of a lateral surface of the metal post, and
in the step of mounting the transmissive member, the adhesive resin is located at a position that enters the recessed portion of the metal post so as to continue from the peripheral area of the lower surface of the light-emitting element or at the lateral surface of the metal post so as to continue from the peripheral area of the lower surface of the light-emitting element.
12 . The method of manufacturing a light-emitting device according to claim 11 , further comprising:
after the step of forming the light reflective member, mounting a lens having a curved surface protruding upward on an upper surface of the transmissive member.
13 . The method of manufacturing a light-emitting device according to claim 11 , wherein:
in the step of preparing the light-emitting element mounted substrate, a distance between the lower surface of the light-emitting element and the substrate is in a range of 20 μm to 110 μm.
14 . The method according to claim 11 , wherein:
the step of preparing the light-emitting element mounted substrate comprises forming the metal post on the element electrode before electrically joining the element electrode and the substrate through the metal post.
15 . The method according to claim 11 , wherein:
the step of preparing the light-emitting element mounted substrate comprises forming the metal post on the wiring before electrically joining the element electrode and the substrate through the metal post.
16 . A light-emitting device comprising:
a light-emitting element having an upper surface serving as a light extracting surface, a lower surface located on a side opposite the upper surface, and a lateral surface connecting the upper surface and the lower surface, wherein the light-emitting element comprises an element electrode located at the lower surface;
a substrate comprising a wiring electrically connected to the element electrode;
a metal post located between the element electrode and the wiring;
a transmissive member configured to allow light from the light-emitting element to pass therethrough; and
an adhesive resin located between the upper surface of the light-emitting element and the transmissive member, wherein:
a portion of the adhesive resin is located on the lateral surface of the light-emitting element and on a peripheral area of the lower surface of the light-emitting element, and
the adhesive resin is further located so as to continue from the lower surface of the light-emitting element to a lateral surface of the metal post.