Thermoelectric module

1 . A thermoelectric module comprising:

a cooling jacket having through holes through which a fluid flows;

a first thermoelectric element disposed on the cooling jacket; and

a first shield member disposed on the first thermoelectric element and having thermal conductivity,

wherein the first thermoelectric element includes:

a first substrate;

a semiconductor device disposed on the first substrate;

a second substrate disposed on the semiconductor device;

a first electrode disposed between the first substrate and the semiconductor device; and

a second electrode disposed between the second substrate and the semiconductor device, and

wherein the first shield member includes an overlapping portion disposed in a region in which the first electrode and the second electrode overlap.

2 . The thermoelectric module of claim 1 , further comprising thermal grease disposed between the cooling jacket and the first thermoelectric element.

3 . The thermoelectric module of claim 1 , wherein the first thermoelectric element and the first shield member are coupled to each other.

4 . The thermoelectric module of claim 1 , further comprising a bonding layer disposed between the first thermoelectric element and the first shield member.

5 . The thermoelectric module of claim 4 , wherein the bonding layer includes solder.

6 . The thermoelectric module of claim 1 , further comprising a wiring portion electrically connected to the first thermoelectric element,

wherein the first shield member includes a stepped portion configured to form a stepped portion with the overlapping portion, and

the second substrate of the first thermoelectric element is disposed between the cooling jacket and the overlapping portion, and the wiring portion is disposed between the cooling jacket and the stepped portion.

7 . The thermoelectric module of claim 6 , further comprising:

a fluid inlet disposed at one end of the cooling jacket; and

a fluid outlet disposed at an other end of the cooling jacket,

wherein the through hole extends from the fluid inlet to the fluid outlet, and

the wiring portion is disposed between the fluid inlet and the first thermoelectric element or between the fluid outlet and the first thermoelectric element.

8 . The thermoelectric module of claim 7 , further comprising a dummy guide disposed between the cooling jacket and the stepped portion,

wherein the dummy guide is disposed between the fluid inlet and the wiring portion or between the fluid outlet and the wiring portion.

9 . The thermoelectric module of claim 8 , further comprising a first shield tube disposed on the fluid inlet and the stepped portion of the first shield member, and a second shield tube disposed on the fluid outlet and the stepped portion of the first shield member.

10 . The thermoelectric module of claim 9 , further comprising a sealing material disposed between the fluid inlet and the dummy guide under the first shield tube or between the fluid outlet and the dummy guide under the second shield tube.

11 . The thermoelectric module of claim 1 , wherein the first shield member further includes a first extension portion disposed on one side surface of the cooling jacket and a second extension portion disposed on an other side surface of the cooling jacket, and further includes an insulating member disposed between the one side surface of the cooling jacket and the first extension portion and between the other side surface of the cooling jacket and the second extension portion.

12 . The thermoelectric module of claim 11 , wherein the one side surface of the cooling jacket and the first extension portion, and the other side surface of the cooling jacket and the second extension portion are coupled by fastening members.

13 . The thermoelectric module of claim 1 , wherein:

the first thermoelectric element is disposed on a first surface of the cooling jacket,

the thermoelectric module further includes a second thermoelectric element disposed on a second surface of the cooling jacket opposite to the first surface, and a second shield member disposed on the second thermoelectric element and having thermal conductivity.

14 . The thermoelectric module of claim 13 , wherein the first shield member includes a first extension portion disposed on one side surface of the cooling jacket and a second extension portion disposed an other side surface of the cooling jacket, the second shield member includes a third extension portion disposed on the one side surface of the cooling jacket and a fourth extension portion disposed on the other side surface of the cooling jacket, the first extension portion and the third extension portion are disposed to overlap each other, and the second extension portion and the fourth extension portion are disposed to overlap each other.

15 . The thermoelectric module of claim 14 , wherein a distance between the first extension portion and the second extension portion is different from a distance between the third extension portion and the fourth extension portion.

16 . The thermoelectric module of claim 15 , wherein the third extension portion is disposed between the first extension portion and one side surface of the cooling jacket, and the fourth extension portion is disposed between the second extension portion and the other side surface of the cooling jacket.

17 . The thermoelectric module of claim 1 , wherein the second substrate is covered by the overlapping portion.

18 . The thermoelectric module of claim 17 , wherein the second substrate includes a plurality of split substrates disposed apart from each other.

19 . The thermoelectric module of claim 1 , wherein the first thermoelectric element is disposed on an inner surface of the overlapping portion.

20 . The thermoelectric module of claim 19 , wherein the second substrate is soldered to the inner surface of the overlapping portion.