Phase change material radio-frequency device and methods for forming the same
A heater material layer is over a substrate. A reactive sputtering process is performed while the substrate and the heater material layer are placed in a process chamber. Sputtered aluminum atoms and reactive nitrogen-containing molecules react inside the process chamber to form a continuous inhomogeneous aluminum nitride layer on the heater material layer. The continuous inhomogeneous aluminum nitride layer is formed such that a top surface portion of the aluminum nitride layer has a higher atomic concentration of nitrogen than a bottom surface portion of the aluminum nitride layer contacting a top surface of the heater line. The continuous inhomogeneous aluminum nitride layer and the heater material layer are patterned into an inhomogeneous aluminum nitride layer and a heater line. A phase change material (PCM) line is formed over the aluminum nitride layer to provide a radio-frequency switch.
1 . A method of forming a device structure, the method comprising:
forming a combination of a heater line and an inhomogeneous aluminum nitride layer over a substrate, wherein a top surface portion of the inhomogeneous aluminum nitride layer has a higher atomic concentration of nitrogen than a bottom surface portion of the inhomogeneous aluminum nitride layer; and
forming a phase change material (PCM) line over the top surface portion of the inhomogeneous aluminum nitride layer, wherein the inhomogeneous aluminum nitride layer is formed by:
forming a continuous inhomogeneous aluminum nitride layer by performing a reactive sputtering process while the substrate and the heater material layer are placed in a process chamber, and by subsequently patterning a deposited inhomogeneous aluminum nitride material, wherein sputtered aluminum atoms and reactive nitrogen-containing molecules react inside the process chamber; and
patterning the continuous inhomogeneous aluminum nitride layer into the inhomogeneous aluminum nitride layer.
2 . The method of claim 1 , wherein a partial pressure of the reactive nitrogen-containing molecules is changed during the reactive sputtering process such that a terminal partial pressure of the reactive nitrogen-containing molecules at an end of the reactive sputtering process is greater than an initial partial pressure of the reactive nitrogen-containing molecules at a beginning of the reactive sputtering process.
3 . The method of claim 2 , wherein the partial pressure of the reactive nitrogen-containing molecules increases strictly or stepwise throughout duration of the reactive sputtering process.
4 . The method of claim 2 , wherein the partial pressure of the reactive nitrogen-containing molecules as a function of time during the reactive sputtering process comprises at least two local peaks.
5 . The method of claim 4 , wherein a last local peak selected from the at least two local peaks has a greater magnitude than a local peak that is first in time selected from the at least two local peaks.
6 . The method of claim 2 , wherein:
the partial pressure of the reactive nitrogen-containing molecules as a function of time during the reactive sputtering process comprises at least three local peaks; and
a peak-to-peak time between neighboring peaks selected from the at least three local peaks is less for a local peak selected from the at least three local peaks that is last in time than for a local peak selected from the at least three local peaks that is first in time.
7 . The method of claim 2 , wherein:
the partial pressure of the reactive nitrogen-containing molecules as a function of time during the reactive sputtering process comprises at least three local peaks; and
minimum partial pressures of the reactive nitrogen-containing molecules between neighboring pairs of local peaks selected from the at least three local peaks increase over time during the reactive sputtering process.
8 . The method of claim 1 , further comprising:
forming a first electrode on a first end portion of the PCM line;
forming a second electrode on a second end portion of the PCM line;
forming a first electrode contact via structure over the first electrode;
forming a second electrode contact via structure over the second electrode;
forming a first heater contact via structure over a first end portion of the heater line; and
forming a second heater contact via structure over a second end portion of the heater line.
9 . The method of claim 1 , wherein:
the heater material layer comprises aluminum and nitrogen;
an atomic percentage of nitrogen within the heater material layer is in a range from 0.001% to 50.000%; and
the heater material layer is formed by performing an additional reactive sputtering process while the substrate is placed in the process chamber and prior to performing the reactive sputtering process.
10 . A method of forming a device structure, the method comprising:
forming a heater material layer over a substrate;
performing a reactive sputtering process while the substrate and the heater material layer are placed in a process chamber, wherein sputtered aluminum atoms and reactive nitrogen-containing molecules react inside the process chamber to form a continuous inhomogeneous aluminum nitride layer on the heater material layer, and a profile of a partial pressure of the reactive nitrogen-containing molecules as a function of time has multiple local peaks during the reactive sputtering process;
patterning the continuous inhomogeneous aluminum nitride layer and the heater material layer into an inhomogeneous aluminum nitride layer and a heater line; and
forming a phase change material (PCM) line over the inhomogeneous aluminum nitride layer.
11 . The method of claim 10 , wherein each of the multiple local peaks other than an initial local peak has a respective magnitude that is greater than a magnitude of a preceding local peak selected from the multiple local peaks.
12 . The method of claim 11 , wherein the multiple local peaks have a same magnitude.
13 . The method of claim 10 , wherein:
the multiple local peaks comprise least three local peaks; and
a peak-to-peak time between neighboring peaks selected from the at least three local peaks is less for a last local peak selected from the at least three local peaks than for an initial local peak selected from the at least three local peaks.
14 . The method of claim 10 , further comprising:
patterning the continuous inhomogeneous aluminum nitride layer and the heater material layer, wherein a patterned portion of the continuous inhomogeneous aluminum nitride layer comprises the inhomogeneous aluminum nitride layer, and a patterned portion of the heater material layer comprises the heater line; and
forming a dielectric matrix layer around the inhomogeneous aluminum nitride layer and the heater line, wherein the PCM line is formed over the dielectric matrix layer.
15 . A method of forming a device structure, the method comprising:
depositing a heater material layer and a continuous inhomogeneous aluminum nitride layer over a substrate;
patterning the continuous inhomogeneous aluminum nitride layer and the heater material layer into an inhomogeneous aluminum nitride layer and a heater line, wherein a top surface portion of the inhomogeneous aluminum nitride layer has a higher atomic concentration of nitrogen than a bottom surface portion of the inhomogeneous aluminum nitride layer; and
forming a phase change material (PCM) line over the top surface portion of the inhomogeneous aluminum nitride layer, wherein:
the continuous inhomogeneous aluminum nitride layer is deposited by performing a reactive sputtering process; and
a partial pressure of the reactive nitrogen-containing molecules is changed during the reactive sputtering process such that a terminal partial pressure of the reactive nitrogen-containing molecules at an end of the reactive sputtering process is greater than an initial partial pressure of the reactive nitrogen-containing molecules at a beginning of the reactive sputtering process.
16 . The method of claim 15 , wherein the partial pressure of the reactive nitrogen-containing molecules increases strictly or stepwise throughout duration of the reactive sputtering process.
17 . The method of claim 15 , wherein the partial pressure of the reactive nitrogen-containing molecules as a function of time during the reactive sputtering process comprises at least two local peaks.
18 . The method of claim 15 , wherein:
the partial pressure of the reactive nitrogen-containing molecules as a function of time during the reactive sputtering process comprises at least three local peaks; and
a peak-to-peak time between neighboring peaks selected from the at least three local peaks is less for a local peak selected from the at least three local peaks that is last in time than for a local peak selected from the at least three local peaks that is first in time.
19 . The method of claim 15 , further comprising:
patterning the continuous inhomogeneous aluminum nitride layer and the heater material layer, wherein a patterned portion of the continuous inhomogeneous aluminum nitride layer comprises the inhomogeneous aluminum nitride layer, and a patterned portion of the heater material layer comprises the heater line; and
forming a dielectric matrix layer around the inhomogeneous aluminum nitride layer and the heater line, wherein the PCM line is formed over the dielectric matrix layer.
20 . The method of claim 15 , wherein:
the heater material layer comprises aluminum and nitrogen; an atomic percentage of nitrogen within the heater material layer is in a range from 0.001% to 50.000%; and
the heater material layer is formed by performing an additional reactive sputtering process while the substrate is placed in the process chamber and prior to performing the reactive sputtering process.