Substrate processing apparatus
Disclosed is a manufacturing method of a semiconductor device. The manufacturing method may include: a closing operation of seating a substrate on a support member provided in a chamber, and closing the chamber to seal a treating space provided by the chamber; a clamping operation of clamping the chamber by moving a clamping body in a direction facing the chamber after the closing operation; a close-contact operation of making the chamber be in contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying supercritical fluid into the treating space.
1 . An apparatus for processing a substrate, the apparatus comprising:
a chamber defining a treating space in which a substrate is processed, wherein the chamber includes a first chamber body provided with a support member for supporting the substrate, and a second chamber body that is coupled with the first chamber body to define a treating space in which the substrate is processed;
a moving unit for moving any one of the first chamber body and the second chamber body;
a clamping body for clamping the chamber;
a moving module for moving the clamping body between a clamping position for clamping the chamber and an unclamping position for unclamping the chamber; and
a controller configured to control the moving unit and the moving module,
wherein the controller is configured to control the moving unit such that one of the first chamber body or the second chamber body is in contact with the clamping body when the first chamber body and the second chamber body are in a closed position for sealing the treating space, that the other of the first chamber body or the second chamber body has a gap with and is separated from the clamping body when the first chamber body and the second chamber body are in the closed position for sealing the treating space, and that the clamping body is in the clamping position.
2 . The apparatus of claim 1 , wherein the controller is configured to control the moving unit such that among the first chamber body and the second chamber body, the first chamber body is in contact with the clamping body when the first chamber body and the second chamber body are in the closed position for sealing the treating space.
3 . The apparatus of claim 2 , further comprising:
a fluid supply unit for supplying a treatment fluid to the treating space,
wherein the controller is further configured to control the fluid supply unit, and configured to control the fluid supply unit to supply the treatment fluid to the treating space after the first chamber body is in contact with the clamping body.
4 . The apparatus of claim 2 , further comprising:
a housing having an interior space in which the chamber is disposed,
wherein the first chamber body is fastened to the housing, and
a buffer is installed between the first chamber body and the housing.
5 . The apparatus of claim 4 , wherein the buffer is configured such that a position of the first chamber body is not changed when the first chamber body and the second chamber body are in close contact with each other, and
a position of the first chamber body is changed in a direction close to the housing when the moving unit makes the first chamber body be in contact with the clamping body.
6 . The apparatus of claim 4 , wherein the buffer includes a spring.
7 . The apparatus of claim 4 , wherein the buffer includes:
a first magnetic element installed in the housing; and
a second magnetic element installed in the first chamber body and facing the first magnetic element, and
the first magnetic element and the second magnetic element have the same polarity as each other so as to generate repulsive force between the first magnetic element and the second magnetic element.
8 . The apparatus of claim 4 , wherein the buffer includes:
a first magnetic element installed in the housing;
a second magnetic element installed in the first chamber body and facing the first magnetic element;
a first current source for supplying current to the first magnetic element; and
a second current source for supplying current to the second magnetic element.
9 . The apparatus of claim 1 , wherein the second chamber body is located below the first chamber body, and
the moving unit is configured to move the second chamber body in an up and down direction.
10 . The apparatus of claim 1 , wherein the second chamber body is located below the first chamber body, and
the moving unit is configured to move the first chamber body in an up and down direction.
11 . The apparatus of claim 1 , wherein at least one of the moving unit and the moving module is configured to move the chamber or the clamping body in a magnetic levitation manner.
12 . The apparatus of claim 1 , wherein at least one of the moving unit and the moving module is configured to include any one selected from an air cylinder, a hydraulic cylinder, and a motor.
13 . The apparatus of claim 1 , wherein the clamping body has one surface having a shape recessed in a direction away from the chamber such that an edge portion of the chamber in the state where the treating space is sealed is inserted.
14 . The apparatus of claim 1 , wherein first chamber body has a first protrusion portion, and an upper surface of the first protrusion portion is in contact with the clamping body when the first chamber body and the second chamber body are in the closed position.
15 . The apparatus of claim 14 , wherein the second chamber body has a second protrusion portion, and a lower surface of the first protrusion portion is separated from the clamping body when the first chamber body and the second chamber body are in the closed position.
16 . The apparatus of claim 15 , wherein a first sidewall of the first chamber body is separated from a neighboring second sidewall of the clamping body when the first chamber body and the second chamber body are in the closed position.