Cooling unit, apparatus for processing a substrate and method of processing a substrate

1 . A cooling unit comprising:

a top wall;

a bottom wall opposite the top wall;

lateral walls connecting the top wall and the bottom wall;

a conveyor on the bottom wall and configured to transfer a substrate;

a first cooling part on the top wall and above the conveyor, the first cooling part being configured to cool the substrate while the substrate is being transferred on the conveyor, and the first cooling part being configured to provide a first cooling atmosphere relative to the substrate over the conveyor; and

a second cooling part adjacent to the lateral walls and adjacent to lateral sides of the conveyor, the second cooling part being configured to provide cool air on lateral sides of the substrate while the substrate is being transferred on the conveyor.

2 . The cooling unit of claim 1 , wherein the first cooling part is configured to provide cool air on the substrate that is on the conveyor.

3 . The cooling unit of claim 1 , further comprising a third cooling part on the bottom wall and below the conveyor, the third cooling part being configured to provide a second cooling atmosphere relative to the substrate under the conveyor.

4 . The cooling unit of claim 3 , wherein the second cooling part is configured to provide a third cooling atmosphere relative to the substrate at the lateral sides of the conveyor.

5 . The cooling unit of claim 4 , wherein the third cooling part is configured to allow a cooling fluid to flow under the substrate.

6 . An apparatus for processing a substrate, the apparatus comprising:

a heating plate configured to heat the substrate placed thereon;

a cooling conveyor including a conveyor configured to transfer a heated substrate, and a first cooling part configured to cool the heated substrate while the heated substrate on the conveyor and configured to provide a first cooling atmosphere relative to the heated substrate over the conveyor; and

a transfer part configured to transfer the heated substrate from the heating plate onto the conveyor.

7 . The apparatus of claim 6 , wherein the heating plate has a multi stage structure including at least two plates and the transfer part has a multi stage structure including at least two blades corresponding to the at least two plates.

8 . The apparatus of claim 7 , wherein, when a substrate is not placed on a first plate of the at least two plates and a process of heating the substrate placed on a second plate of the at least two plates is completed, a first blade of the at least two blades is configured to load a substrate on the first plate and a second blade of the at least two blades is configured to unload the heated substrate from the second plate.

9 . The apparatus of claim 6 , wherein the first cooling part is configured to provide cool air onto the substrate over the conveyor.

10 . The apparatus of claim 6 , further comprising:

a second cooling part configured to provide a second cooling atmosphere relative to the substrate under the conveyor; and

a third cooling part configured to provide a third cooling atmosphere relative to the substrate at a side of the conveyor.

11 . The apparatus of claim 10 , wherein the second cooling part is configured to allow a cooling fluid to flow under the substrate and the third cooling part is configured to provide cool air onto a side of the substrate.

12 . A method of processing a substrate, the method comprising:

heating the substrate in a stationary state at a first position,

transferring a heated substrate from the first position to a second position adjacent to the first position,

transferring the heated substrate from the second position to a third position relatively away from the first position, and

cooling the heated substrate while transferring the heated substrate from the second position to the third position.

13 . The method of claim 12 , wherein two first positions are provided in an apparatus for processing the substrate, and

wherein substrates are sequentially loaded at the two first positions and the substrates are sequentially unloaded from the two first positions.

14 . The method of claim 13 , wherein, when a substrate is not loaded at one first position of the two first positions and a process of heating the substrate loaded at a second first position of the two first positions is completed, a substrate is loaded at the one first position and the heated substrate is unloaded from the second first position.

15 . The method of claim 14 , wherein the two first positions exist on two plates, respectively, and the substrates are sequentially transferred from the two plates using two blades corresponding the two plates, respectively.

16 . The method of claim 12 , wherein the heated substrate is transferred from the second position to the third position using a conveyor.

17 . The method of claim 16 , wherein the heated substrate is cooled by providing cool air onto the heated substrate while the heated substrate from the second position to the third position.

18 . The method of claim 17 , wherein cooling atmospheres are provided at a side of the conveyor and under the conveyor while transferring the heated substrate from the second position to the third position.

19 . The method of claim 18 , further comprising providing the cool air onto a side of the heated substrate and allowing a cooling fluid to flow under the conveyor.

20 . The method of claim 12 , further comprising coating a chemical liquid including a photoresist on the substrate or providing a chemical liquid including a developing solution onto the substrate.