Method for producing a cooling element, and cooling element produced using such a method
A method of manufacturing a cooling element, including: providing at least one first metal layer and at least one second metal layer, oxidizing the at least one first metal layer and/or the at least one second metal layer, structuring the at least one first metal layer and/or the at least one second metal layer to form at least one recess, joining the at least one first metal layer and the at least one second metal layer to form the cooling element, wherein, in the joined state, at least a partial section of a cooling channel in the cooling element is formed by the recess in the at least one first metal layer and/or the at least one second metal layer, and wherein, prior to the joining, an inner side of the recess is provided at least in sections free of an oxidized surface.
1 . A method of manufacturing a cooling element ( 1 ), the method comprising: providing at least one first metal layer ( 11 ) and at least one second metal layer ( 12 ), oxidizing ( 101 ) the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ), structuring ( 102 ) the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) to form at least one recess ( 21 , 22 ), and performing a direct metal bonding to join the at least one first metal layer ( 11 ) and the at least one second metal layer ( 12 ) to form the cooling element ( 1 ), wherein, in a joined state, at least a partial section of a cooling channel is formed in the cooling element ( 1 ) by the recess ( 21 , 22 ) in the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) and wherein, while performing the direct metal bonding, an inner side of the recess ( 21 , 22 ) is provided completely free of an oxidized surface.
2 . The method according to claim 1 , wherein the oxidizing ( 101 ) is performed temporally prior to the structuring ( 102 ).
3 . The method according to claim 1 , wherein the structuring ( 102 ) of the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) comprises etching, lasering, laser assisted structuring and/or eroding.
4 . The method according to claim 1 , wherein prior to the joining ( 103 ) a region of an upper side and/or a lower side of the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) adjacent to the recess ( 21 , 22 ) is provided freed from an oxidized surface.
5 . The method according to claim 1 , wherein in addition to the recess ( 21 , 22 ) in the at least one first metal layer ( 21 ) and/or the at least one second metal layer ( 22 ) a region of reduced thickness is realized.
6 . The method according to claim 1 , wherein the oxidizing ( 101 ) is carried out thermally and/or wet-chemically.
7 . The method according to claim 1 , wherein the manufactured cooling element ( 1 ) has an upper covering layer ( 15 ) and/or a lower covering layer ( 14 ), wherein, viewed in the stacking direction(S), the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) and/or an at least one third metal layer ( 13 ) is arranged below the upper covering layer ( 15 ) and/or above the lower covering layer ( 14 ), the upper covering layer ( 15 ) and/or the lower covering layer ( 14 ) having a terminal area ( 30 ) for connecting a component to be cooled.
8 . The method according to claim 7 , wherein the component to be cooled is a laser diode.
9 . The method according to claim 1 , wherein the recess ( 21 , 22 ) has an extension, a width, in a direction parallel to a main extension plane (HSE) up to 0.8 mm.
10 . The method according to claim 9 , wherein, the width is up to 0.4 mm.
11 . The method according to claim 1 , wherein the direct metal bonding is at a temperature between 850° C. and 1080° C.
12 . The method according to claim 1 , wherein the joining is by bonding.
13 . The method according to claim 1 , wherein prior to the joining ( 103 ), an inner side of the recess ( 21 , 22 ) is provided at least in sections completely free of an oxidized surface.
14 . The method according to claim 1 , wherein the direct metal bonding comprises direct copper bonding (DCB) or direct aluminum bonding (DAB).
15 . A method of manufacturing a microcooling element ( 1 ), the method comprising:
providing at least one first metal layer ( 11 ) and at least one second metal layer ( 12 ), oxidizing ( 101 ) the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ), after oxidizing, structuring ( 102 ) the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) to form at least one recess ( 21 , 22 ), and performing a direct metal bonding at a temperature between 850° C. and 1080° C. to join the at least one first metal layer ( 11 ) and the at least one second metal layer ( 12 ) to form the cooling element ( 1 ), wherein, in a bonded state, at least a partial section of a cooling channel is formed in the cooling element ( 1 ) by the recess ( 21 , 22 ) in the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ), and wherein, while performing the direct metal bonding, an inner side of the recess ( 21 , 22 ) is provided completely free of an oxidized surface.
16 . The method of claim 15 , wherein prior to the joining ( 103 ) a region of an upper side and/or a lower side of the at least one first metal layer ( 11 ) and/or the at least one second metal layer ( 12 ) adjacent to the recess ( 21 , 22 ) is provided freed from an oxidized surface.
17 . The method according to claim 15 , wherein in addition to the recess ( 21 , 22 ) in the at least one first metal layer ( 21 ) and/or the at least one second metal layer ( 22 ) a region of reduced thickness is realized.
18 . Method of claim 15 , wherein the recess ( 21 , 22 ) has an extension, a width, in a direction parallel to a main extension plane (HSE) up to 0.8 mm.