Baffles for electronic circuits immersed in cooling fluid in a tank
Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.
1 . A system comprising:
at least one baffle cover; and
a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers along a side of the container to hold the at least one baffle cover,
wherein the at least one baffle cover is configured to form an enclosure for the container, the at least one baffle cover being positioned proximate to an edge of the at least one PCB mounted on the chassis, and
wherein the container is configured to be immersed in a cooling fluid in a tank, and the at least one baffle cover comprises one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB when the container is immersed in the cooling fluid in the tank.
2 . The system of claim 1 , further comprising the at least one PCB, wherein the at least one PCB is immersed in the cooling fluid in the tank when the container is immersed in the cooling fluid in the tank, the at least one PCB being mounted on the chassis with the edge of the at least one PCB proximate to the side of the container, the at least one baffle cover enclosing the at least one PCB within the container, and the container being immersed in the cooling fluid in the tank with its side facing a surface of the cooling fluid.
3 . The system of claim 1 , wherein the at least one PCB comprise one or more integrated circuit (IC) chips that are coupled to a boilerplate, and wherein a thermal interface material (TIM) is applied to surfaces of the one or more IC chips that face the boilerplate.
4 . The system of claim 3 , wherein the at least one PCB comprises a plurality of PCBs, and wherein:
each of the plurality of PCBs comprise one or more IC chips that are coupled to a respective boilerplate with TIM in between the one or more IC chips and the respective boilerplate;
the container comprises a plurality of chassis for mounting the plurality of PCBs;
the at least one baffle cover encloses the plurality of PCBs within the container, the at least one baffle cover positioned along respective edges of the plurality of PCBs; and
the one or more openings of the at least one baffle cover are configured to control an agitation of the cooling fluid proximate to the respective edges of the plurality of PCBs.
5 . The system of claim 1 , wherein the container is immersed in the cooling fluid in the tank in a vertical orientation, wherein the at least one baffle cover is positioned along a top edge of the at least one PCB that is proximate to an upper surface of the cooling fluid.
6 . The system of claim 1 , wherein the at least one PCB is immersed in the cooling fluid in the tank in a vertical orientation, wherein the at least one baffle cover is coupled to a top side of the container that is proximate to an upper surface of the cooling fluid.
7 . The system of claim 1 , wherein controlling the agitation of the cooling fluid proximate to the edge of the at least one PCB comprises preventing TIM from being displaced by movement of the cooling fluid proximate to the edge of the at least one PCB.
8 . The system of claim 1 , wherein the at least one baffle cover comprises a first baffle cover and a second baffle cover that are in parallel and that are positioned at two opposing sides of the container, and wherein the at least one PCB is positioned between the first baffle and the second baffle.
9 . The system of claim 1 , wherein the one or more openings of the at least one baffle cover comprises at least one of:
one or more slits,
one or more slots, or
one or more holes.
10 . The system of claim 1 , wherein the at least one baffle cover comprise a thermally conductive material.
11 . A system comprising:
at least one baffle cover; and
a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers along a side of the container to hold the at least one baffle cover,
wherein the at least one baffle cover is configured to form an enclosure for the container, wherein the container is immersed in a cooling fluid in a tank in a vertical orientation, and wherein the at least one baffle cover is positioned along a top edge of the at least one PCB that is proximate to an upper surface of the cooling fluid, and
wherein the container is configured to be immersed in a cooling fluid in a tank, and the at least one baffle cover comprises one or more openings that are configured to control an agitation of the cooling fluid proximate to the top edge of the at least one PCB when the container is immersed in the cooling fluid in the tank.
12 . The system of claim 11 , further comprising the at least one PCB, wherein the at least one PCB is immersed in the cooling fluid in the tank when the container is immersed in the cooling fluid in the tank, the at least one PCB being mounted on the chassis with the top edge of the at least one PCB proximate to the side of the container, the at least one baffle cover enclosing the at least one PCB within the container, and the container being immersed in the cooling fluid in the tank with its side facing a surface of the cooling fluid.
13 . The system of claim 11 , wherein the at least one PCB comprise one or more integrated circuit (IC) chips that are coupled to a boilerplate, and wherein a thermal interface material (TIM) is applied to surfaces of the one or more IC chips that face the boilerplate.
14 . The system of claim 13 , wherein the at least one PCB comprises a plurality of PCBs, and wherein:
each of the plurality of PCBs comprise one or more IC chips that are coupled to a respective boiler plate with TIM in between the one or more IC chips and the respective boilerplate;
the container comprises a plurality of chassis for mounting the plurality of PCBs;
the at least one baffle cover encloses the plurality of PCBs within the container, the at least one baffle cover positioned along respective edges of the plurality of PCBs; and
the one or more openings of the at least one baffle cover are configured to control an agitation of the cooling fluid proximate to the respective edges of the plurality of PCBs.
15 . The system of claim 11 , wherein the at least one PCB is immersed in the cooling fluid in the tank in a vertical orientation, wherein the at least one baffle cover is coupled to a top side of the container that is proximate to an upper surface of the cooling fluid.
16 . The system of claim 11 , wherein controlling the agitation of the cooling fluid proximate to the top edge of the at least one PCB comprises preventing TIM from being displaced by movement of the cooling fluid proximate to the top edge of the at least one PCB.
17 . The system of claim 11 , wherein the at least one baffle cover comprises a first baffle cover and a second baffle cover that are in parallel and that are positioned at two opposing sides of the container, and wherein the at least one PCB is positioned between the first baffle and the second baffle.
18 . The system of claim 11 , wherein the one or more openings of the at least one baffle cover comprises at least one of:
one or more slits,
one or more slots, or
one or more holes.
19 . The system of claim 11 , wherein the at least one baffle cover comprise a thermally conductive material.
20 . A system comprising:
a first baffle cover and a second baffle cover; and
a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers,
wherein the first baffle cover and the second baffle cover are placed in parallel and are positioned at two opposing sides of the container, wherein the at least one PCB is positioned between the first baffle and the second baffle, and wherein the one or more couplers are placed along the two opposing sides of the container to hold the first baffle cover and the second baffle cover,
wherein the first baffle cover and the second baffle cover are configured to form an enclosure for the container, the first baffle cover and the second baffle cover being respectively positioned proximate to a top edge and a bottom edge of the at least one PCB mounted on the chassis, and
wherein the container is configured to be immersed in a cooling fluid in a tank, and each of the first baffle cover and the second baffle comprises one or more openings configured to control an agitation of a cooling fluid proximate to the top edge or bottom edge of the at least one PCB when the container is immersed in the cooling fluid in a tank.