Die edge protection to eliminate die chipping
Disclosed is a device that includes a die and a protection layer surrounding the die. The protection layer is applied at a backend process prior to dicing a wafer to individual dies. The protection layer protects the die from chips and cracks during and after dicing the wafer.
1 . A device comprising:
a die; and
a protection layer formed on sidewalls of the die, the protection layer surrounding all sidewalls of the die,
wherein the protection layer comprises:
a sidewall protection layer surrounding all sidewalls of the die, the sidewall protection layer covering an entirety of a vertical height of the sidewalls of the die;
an upper edge protection layer formed on one or more upper edge portions of the die and on an upper surface of the sidewall protection layer,
wherein the upper edge protection layer is formed on all upper edge portions of the die, all upper edges and corners of the die being covered by the protection layer, and
wherein a center portion of the die is not covered by the upper edge protection layer.
2 . The device of claim 1 , wherein a material of the protection layer is less brittle than a material of an edge portion of the die.
3 . The device of claim 1 , wherein the protection layer is formed from one or more oxides, one or more nitrides, one or more metals, or any combination thereof.
4 . The device of claim 1 , wherein the sidewall protection layer and the upper edge protection layer are formed from a same material.
5 . The device of claim 1 , wherein the device is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.
6 . A device comprising:
a die; and
a protection layer formed on sidewalls of the die, the protection layer surrounding all sidewalls of the die,
wherein the protection layer comprises:
a sidewall protection layer surrounding all sidewalls of the die, the sidewall protection layer covering an entirety of a vertical height of the sidewalls of the die; and
a lower surface protection layer formed on a lower surface of the die and on a lower surface of the sidewall protection layer,
wherein the protection layer is formed from one or more oxides, one or more nitrides, or any combination thereof,
wherein the lower surface protection layer covers an entirety of the lower surface of the die, all lower edges and lower corners of the die being covered by the protection layer, and
wherein the sidewall protection layer and the lower surface protection layer are formed from a same material.
7 . The device of claim 6 , wherein a material of the protection layer is less brittle than a material of an edge portion of the die.
8 . The device of claim 6 , wherein the device is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.
9 . A device comprising:
a die; and
a protection layer formed on sidewalls of the die, the protection layer surrounding all sidewalls of the die,
wherein the protection layer comprises:
an upper sidewall protection layer surrounding upper portions of all sidewalls of the die; and
a lower sidewall protection layer surrounding lower portions of all sidewalls of the die, and
wherein middle portions of all sidewalls of the die are not covered by either the upper sidewall protection layer or by the lower sidewall protection layer.
10 . The device of claim 9 ,
wherein an upper surface of the upper sidewall protection layer is planar with an upper surface of the die, or
wherein a lower surface of the lower sidewall protection layer is planar with a lower surface of the die, or
both.
11 . The device of claim 9 , wherein the upper sidewall protection layer and the lower sidewall protection layer are formed from a same material.
12 . The device of claim 9 , wherein a material of the protection layer is less brittle than a material of an edge portion of the die.
13 . The device of claim 9 , wherein the protection layer is formed from one or more oxides, one or more nitrides, one or more metals, or any combination thereof.
14 . The device of claim 9 , wherein the device is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.