Protection of integrated circuits
A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.
1 . An assembly, comprising:
a substrate;
a first integrated circuit chip having a front side and a back side, and including a first plurality of electrical contacts present at the front side of the first integrated circuit chip, wherein the back side of the first integrated circuit chip includes a single cavity peripherally surrounded by a peripheral portion including a peripheral edge;
wherein the front side of the first integrated circuit chip is mounted to the substrate;
a second integrated circuit chip having a front side and a back side, and including a second plurality of electrical contacts present at the front side of the second integrated circuit chip;
binder material filling the single cavity;
wherein the first and second integrated circuit chips are assembled together with the back side of the second integrated circuit facing with the peripheral edge of the first integrated circuit chip so that the back side of the second integrated circuit chip closes said single cavity and is attached by the binder material filling the single cavity to the first integrated circuit chip;
substrate contacts on the substrate;
solder connections between the first plurality of electrical contacts present on the front side of the first integrated circuit chip and substrate contacts of the substrate; and
conductive wires electrically connecting the second plurality of electrical contacts present on the front side of the second integrated circuit chip to the substrate contacts.
2 . The assembly of claim 1 , wherein front sides of the first and second integrated circuit chips each include electronic functions.
3 . The assembly of claim 1 , wherein the binder material is an adhesive glue.
4 . The assembly of claim 1 , further comprising a molecular bond between the peripheral edge at the back side of the first integrated circuit chip and the back side of the second integrated circuit chip.