Electronic package structure and method for manufacturing the same
An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.
1 . An electronic package structure, comprising:
a lower circuit pattern structure;
an upper circuit pattern structure disposed above the lower circuit pattern structure, and including a plurality of upper dielectric layers and a plurality of upper circuit layers;
a first reflowable connector electrically connecting the upper circuit pattern structure and the lower circuit pattern structure, wherein the first reflowable connector extends partially into the upper circuit pattern structure and connects to the plurality of upper circuit layers; and
a first core element and a second core element attached to the first reflowable connector, and arranged substantially vertically between the lower circuit pattern structure and the upper circuit pattern structure, wherein the first core element does not contact the second core element, wherein the first core element and the second core element are spaced apart from the lower circuit pattern structure and the upper circuit pattern structure,
wherein the lower circuit pattern structure includes a plurality of lower dielectric layers and a plurality of lower circuit layers, and the first reflowable connector further extends partially into the lower circuit pattern structure and connects to the plurality of lower circuit layers,
wherein the first reflowable connector has a first edge having a first turning point and a second turning point, wherein a first portion of the first edge above the first turning point is convex and is conformal with an upper portion of the first core element, wherein a third portion of the first edge under the second turning point is convex and is conformal with a lower portion of the second core element.
2 . The electronic package structure of claim 1 , wherein the first reflowable connector further has a second edge opposite to the first edge, wherein a profile of the second edge is different from a profile of the first edge.
3 . The electronic package structure of claim 2 , wherein the first reflowable connector defines a recess recessed toward the first core element, wherein the recess intersects with the first portion of the first edge at the first turning point, and the first turning point is an inflection point.
4 . The electronic package structure of claim 3 , wherein the first reflowable connector includes a main portion, a first protrusion portion and a second protrusion portion, the main portion of the first reflowable connector is located within a region extending between an opening of the upper circuit pattern structure and an opening of the lower circuit pattern structure, the first protrusion portion and the second protrusion portion protrude from the main portion and are located at different sides of the main portion, wherein a width of an entirety of the first protrusion portion is different from a width of an entirety of the second protrusion portion at a same elevation.