Coaxial inductors fabricated through a drill-less via process
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.
1 . An electronic package, comprising:
a substrate, wherein the substrate comprises glass; a via opening through the substrate,
wherein a region of the substrate adjacent to the via opening has an inner hourglass shaped profile and an outer vertical sidewall, the region of the substrate having a first microstructure different than a second microstructure of a remainder of the substrate adjacent to the outer vertical sidewall of the region, wherein the second microstructure is an amorphous microstructure, and wherein the first microstructure is a crystalline microstructure; a magnetic layer that fills the via opening, the magnetic layer having an outer hourglass sidewall adjacent to the inner hourglass shaped profile of the region of the substrate, and an inner vertical sidewall; and a via through the magnetic layer and adjacent to the vertical sidewall of the magnetic layer, wherein sidewalls of the via are substantially vertical.
2 . The electronic package of claim 1 , wherein the magnetic layer is a paste printed material.
3 . The electronic package of claim 1 , wherein a diameter of the via is approximately 100 μm or smaller.
4 . The electronic package of claim 3 , wherein the diameter of the via is approximately 10 μm or smaller.
5 . The electronic package of claim 1 , wherein a diameter of the via opening is approximately 1,000 μm or less.
6 . The electronic package of claim 1 , further comprising:
a second via opening through the substrate, wherein the second via opening has the hourglass shaped profile;
a second magnetic layer filling the second via opening; and
a second via through the second magnetic layer, wherein sidewalls of the second via are substantially vertical.
7 . The electronic package of claim 6 , wherein the second via is electrically coupled to the first via by a trace over or under the substrate.
8 . A method of forming an inductor in a glass substrate, comprising:
forming a via opening through the glass substrate, wherein a region of the glass substrate adjacent to the via opening has an inner hourglass shaped profile and an outer vertical sidewall, the region of the glass substrate having a first microstructure different than a second microstructure of a remainder of the substrate adjacent to the outer vertical sidewall of the region, wherein the second microstructure is an amorphous microstructure, and wherein the first microstructure is a crystalline microstructure;
placing the substrate on a carrier, wherein a template structure extends up from the carrier and is inserted into the via opening;
disposing a magnetic material in the via opening around the template structure, the magnetic material having an outer hourglass sidewall adjacent to the inner hourglass shaped profile of the region of the glass substrate, and an inner vertical sidewall;
removing the template structure to provide a void in the magnetic material; and
filling the void with a conductive material adjacent to the vertical sidewall of the magnetic layer.
9 . The method of claim 8 , wherein template structure is mechanically pulled out from the magnetic material.
10 . The method of claim 8 , wherein the template structure is melted.
11 . The method of claim 8 , wherein the template structure is etched.
12 . The method of claim 8 , wherein the template structure is a post.
13 . The method of claim 12 , wherein sidewalls of the post are substantially vertical.
14 . The method of claim 13 , wherein sidewalls of the magnetic material are tapered.
15 . The method of claim 8 , wherein the via opening is formed with a laser-assisted etching process.
16 . An electronic system, comprising: a board; a package substrate coupled to the board, wherein the package substrate comprises: a substrate, wherein the substrate comprises glass; a via opening through the substrate, wherein a region of the substrate adjacent to the via opening has an inner hourglass shaped profile and an outer vertical sidewall, the region of the substrate having a first microstructure different than a second microstructure of a remainder of the substrate adjacent to the outer vertical sidewall of the region, wherein the second microstructure is an amorphous microstructure, and wherein the first microstructure is a crystalline microstructure; a magnetic layer that fills the via opening, the magnetic layer having an outer hourglass sidewall adjacent to the inner hourglass shaped profile of the region of the substrate, and an inner vertical sidewall; and a via through the magnetic layer and adjacent to the vertical sidewall of the magnetic layer, wherein sidewalls of the via are substantially vertical; and a die coupled to the package substrate.
17 . The electronic system of claim 16 , further comprising:
a second via opening through the substrate, wherein the second via opening has the hourglass shaped profile;
a second magnetic layer filling the second via opening; and
a second via through the second magnetic layer, wherein sidewalls of the second via are substantially vertical.
18 . The electronic system of claim 17 , wherein the second via is electrically coupled to the first via by a trace over or under the substrate.