IP Library › Granted Patent US 12677691

Granted Patent B2

US 12677691 · App. 17/982,619 · Granted Jul 7, 2026

Electronic package and method for manufacturing the same

Inventors: Zhou Zhou (Nijmegen, NL); Haibo Fan (Nijmegen, NL); Chi Ho Leung (Nijmegen, NL)

Assignee: Nexperia B.V.

H10W74/111 H10W70/429 H10W74/01 H10W72/886 H10W90/736 H10W90/766

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Quick Facts

Patent No.: US 12677691
App. No.: 17/982,619
Granted: Jul 7, 2026
Kind: B2

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Abstract

An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.

Claims (66)

1 . An electronic package comprising:

an electronic component having a terminal;

a body of solidified molding compound that encapsulates the electronic component;

a lead comprising an inner portion and a mounting portion, wherein one end of the inner portion is integrally connected to the mounting portion, wherein another end of the inner portion is electrically connected to the terminal;

wherein the mounting portion has a bottom surface that is exposed and is aligned with a bottom surface of the body of solidified molding compound;

wherein the mounting portion has a top surface that is covered by the body of solidified molding compound;

wherein the top surface and the bottom surface of the mounting portion extend parallel to one another, and wherein the mounting portion has a side surface that extends perpendicularly to the top surface and the bottom surface;

wherein the body of solidified molding compound comprises:

a first recess at or near a perimeter of the bottom surface of the mounting portion, the first recess exposing a portion of a bottom surface of the inner portion arranged near the mounting portion; and/or

a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing at least a portion of the side surface of the mounting portion extending between the top surface and the bottom surface of the mounting portion.

2 . The electronic package according to claim 1 , wherein the first recess and the second recess together form a contiguous recess.

3 . The electronic package according to claim 1 , wherein the exposed bottom surface of the mounting portion and the exposed portion of the bottom surface of the inner portion are contiguous; and/or

wherein the first recess and/or the second recess has a maximum depth relative to a thickness of the mounting portion, the depth and thickness both being taken in a direction perpendicular to the bottom surface of the mounting portion, and lies in a range between 1%-50%.

4 . The electronic package according to claim 1 , wherein the second recess comprises:

a first recess section having a depth of which is constant along a width of the first recess section in a direction parallel to and away from the bottom surface of the mounting portion;

a second recess section having a depth of which decreases along a width of the second recess section in the direction;

wherein the first recess section is directly adjacent to the mounting portion; and wherein the second recess section is spaced apart from the mounting portion

by the first recess section.

5 . The electronic package according to claim 1 , wherein the first recess and/or the second recess has a width relative to a thickness of the mounting portion, the thickness being taken in a direction perpendicular to the bottom surface of the mounting portion and the depth being taken in a direction parallel to and away from the bottom surface of the mounting portion, and lies in a range between 5%-60%; and/or

wherein the lead further comprises a further mounting portion having an exposed top surface and bottom surface and one end thereof being integrally connected to the mounting portion; and

wherein the further mounting portion extends away from the mounting portion in a direction parallel to the bottom surface of the mounting portion.

6 . The electronic package according to claim 1 , wherein the electronic component comprises a semiconductor die having a circuit integrated thereon;

wherein the terminal is a terminal of the circuit; and/or

wherein the electronic component comprises a plurality of the terminals, wherein the electronic package comprises a plurality of the leads, and wherein the body of solidified molding compound comprises a plurality of the first recesses and/or second recesses, each corresponding to a respective lead among the plurality of leads; and/or

wherein the electronic package is of a panel level packaging (PLP) type.

7 . A method for manufacturing an electronic package, comprising the steps of:

a) providing an electronic package comprising:

an electronic component having a terminal;

a body of solidified molding compound that encapsulates the electronic component;

a lead comprising an inner portion and a mounting portion;

wherein one end of the inner portion is integrally connected to the mounting portion;

wherein another end of the inner portion is electrically connected to the terminal;

wherein the mounting portion has a bottom surface that is exposed and is aligned with a bottom surface of the body of solidified molding compound; and

wherein the mounting portion has a top surface that is covered by the body of solidified molding compound;

b) forming, during or after step a):

b1) a first recess in the body of solidified molding compound at or near a perimeter of the bottom surface of the mounting portion, the first recess exposing a portion of a bottom surface of the inner portion arranged near the mounting portion; and/or

b2) a second recess in the body of solidified molding compound at a perimeter of the bottom surface of the mounting portion, the second recess exposing at least a portion of a side surface of the mounting portion extending between the top surface and the bottom surface of the mounting portion.

8 . The method according to claim 7 , wherein step a) comprises:

a1) providing the electronic component and the lead, the lead being electrically connected to the terminal of the electronic component; and

a2) applying a molding compound and allowing the molding compound to solidify to form a body of solidified molding compound encapsulating the electronic component and to cover at least part of the inner portion and the top surface of the mounting portion, wherein the bottom surface of the body of solidified molding compound is aligned with the bottom surface of the mounting portion.

9 . The method according to claim 8 , wherein the first recess and/or the second recess is at least partially formed during step a2) using a molding tool.

10 . The method according to claim 7 , wherein the first recess and/or the second recess is at least partially formed by a method selected from the group consisting of: etching, cutting, and drilling, a portion of the body of solidified molding compound.

11 . The method according to claim 7 , wherein the first recess and the second recess are formed so that they together form a contiguous recess.

12 . The method according to claim 7 , wherein the exposed bottom surface of the mounting portion and the exposed portion of the bottom surface of the inner portion are contiguous; and/or

wherein the first recess and/or the second recess have a maximum depth relative to a thickness of the mounting portion, the depth and thickness both being taken in a direction perpendicular to the bottom surface of the mounting portion, and lies in a range between 1%-50%.

13 . The method according to claim 7 , wherein the second recess comprises:

a first recess section, having a depth which is constant along a width of the first recess section in a direction parallel to and away from the bottom surface of the mounting portion; and

a second recess section, having a depth which decreases along a width of the second recess section in the direction;

wherein the first recess section is directly adjacent to the mounting portion; and wherein the second recess section is spaced apart from the mounting portion by the first recess section.

14 . The method according to claim 7 , wherein the first recess and/or the second recess have a width relative to a thickness of the mounting portion, the thickness being taken in a direction perpendicular to the bottom surface of the mounting portion and the depth being taken in a direction parallel to and away from the bottom surface of the mounting portion, and lies in a range between 5%-60%; and/or

wherein the lead further comprises a further mounting portion having an exposed top surface and bottom surface, one end thereof being integrally connected to the mounting portion, wherein the further mounting portion extends away from the mounting portion in a direction parallel to the bottom surface of the mounting portion.

15 . The method according to claim 7 , wherein the electronic component comprises a semiconductor die having a circuit integrated thereon;

wherein the terminal is a terminal of the circuit; and/or

wherein the electronic component comprises a plurality of the terminals, wherein step a) comprises providing a plurality of the leads, and wherein step b) comprises forming a plurality of the first recesses and/or second recesses, each corresponding to a respective lead among the plurality of leads; and/or

wherein the electronic package is of a panel level packaging (PLP) type.

16 . The method according to claim 7 , wherein the exposed bottom surface of the mounting portion and the exposed portion of the bottom surface of the inner portion are contiguous; and/or

wherein the top surface and the bottom surface of the mounting portion extend parallel to one another, and wherein the side surface of the mounting portion extends perpendicularly to the top surface and bottom surface; and/or

17 . The method according to claim 7 , wherein the exposed bottom surface of the mounting portion and the exposed portion of the bottom surface of the inner portion are contiguous; and/or

18 . The method according to claim 7 , wherein the first recess and/or the second recess have a width relative to a thickness of the mounting portion, the thickness being taken in a direction perpendicular to the bottom surface of the mounting portion and the depth being taken in a direction parallel to and away from the bottom surface of the mounting portion, and lies in a range between 20%-50%; and/or

19 . The method according to claim 7 , wherein the first recess and/or the second recess have a width relative to a thickness of the mounting portion, the thickness being taken in a direction perpendicular to the bottom surface of the mounting portion and the depth being taken in a direction parallel to and away from the bottom surface of the mounting portion, and lies in a range between 35%-45%; and/or