Semiconductor device and methods of manufacturing semiconductor devices

1 . A packaged electronic device, comprising:

an electronic component comprising:

a component face side;

a component base side;

a component lateral side connecting the component face side to the component base side;

a first component terminal on and overlapping the component face side; and

a second component terminal on and overlapping to the component base side;

a first clip structure comprising:

a first clip pad having a first clip pad first face;

a clip bridge extending across the component base side and coupled to the second component terminal; and

a first clip leg connecting the first clip pad and the clip bridge together;

an encapsulant covering the electronic component and at least portions of the first clip structure and having an encapsulant first face, wherein:

the first clip pad first face, the component face side, and the first component terminal are exposed from and substantially coplanar with the encapsulant first face;

a dielectric adjoining the encapsulant first face, the first clip pad first face, the component face side, and the first component terminal, wherein the dielectric comprises:

a first aperture extending through the dielectric, wherein the first clip pad first face is exposed within the first aperture; and

a second aperture extending through the dielectric, wherein the first component terminal is exposed within the second aperture;

a first external interconnect fixed on the first clip pad first face through the first aperture in the dielectric; and

a second external interconnect fixed on the first component terminal through the second aperture in the dielectric.

2 . The packaged electronic device of claim 1 , wherein:

the encapsulant covers the clip bridge; and

the clip bridge is attached to the second component terminal with an electrically conducting interface material.

3 . The packaged electronic device of claim 1 , wherein:

the dielectric comprises a thickness in a range from about 2 microns (μm) to about 30 μm.

4 . The packaged electronic device of claim 1 , wherein:

the dielectric comprises a polymer.

5 . The packaged electronic device of claim 1 , wherein:

the second component terminal comprises a drain terminal.

6 . The packaged electronic device of claim 1 , further comprising:

a third external interconnect,

wherein:

the first clip structure further comprises:

a third clip pad having a third clip pad first face; and

a second clip leg connecting the third clip pad to the clip bridge;

the third clip pad first face is exposed from the encapsulant first face and is substantially coplanar with the encapsulant first face; and

the third external interconnect is coupled to the third clip pad first face through a third aperture in the dielectric.

7 . A packaged electronic device, comprising:

a dielectric comprising a dielectric top side and a dielectric bottom side opposite to the dielectric top side, a first aperture extending from the dielectric top side to the dielectric bottom side; a second aperture extending from the dielectric top side to the dielectric bottom side, and a third aperture extending from the dielectric top side to the dielectric bottom side;

an electronic component comprising:

a component face side adjacent to the dielectric top side;

a component base side opposite to the component face side;

a component lateral side connecting the component face side to the component base side and defining a component perimeter; and

a first component terminal on the component face side and exposed within the second aperture, wherein the first component terminal is located inside the component perimeter;

a clip structure comprising:

a first clip pad having a first clip pad first face adjacent to the dielectric top side;

a clip bridge coupled to the component base side;

a first clip leg connecting the first clip pad and the clip bridge together,

a third clip pad having a third clip pad first face; and

a second clip leg connecting the third clip pad and the clip bridge together;

an encapsulant covering the electronic component, at least portions of the clip structure, and the dielectric top side;

a first external interconnect fixed to the first clip pad through the first aperture in the dielectric;

a second external interconnect fixed to the first component terminal through the second aperture in the dielectric; and

a third external interconnect fixed to the third clip pad through the third aperture.

8 . The packaged electronic device of claim 7 , wherein:

the encapsulant comprises an encapsulant first face adjacent to the dielectric top side; and

the component face side is exposed from the encapsulant first face and is covered by the dielectric.

9 . The packaged electronic device of claim 7 , wherein:

the dielectric comprises a polymer material.

10 . The packaged electronic device of claim 7 , wherein:

the clip structure comprises a copper/stainless steel/copper clad material.

11 . The packaged electronic device of claim 7 , wherein:

the encapsulant comprises an encapsulant first face adjacent to the dielectric top side;

the first component terminal comprises a first component terminal face; and

the first clip pad first face, the encapsulant first face, the first component terminal face, and the third clip pad first face are substantially co-planar.

12 . The packaged electronic device of claim 7 , wherein:

the clip bridge extends completely across the component base side from a first portion of the component lateral side to a second portion of the component lateral side; and

the second portion is opposite to the first portion.

13 . The packaged electronic device of claim 7 , wherein:

the dielectric comprises a dielectric lateral side connecting the dielectric top side to the dielectric bottom side;

the encapsulant comprises an encapsulant lateral side; and

the dielectric lateral side and the encapsulant lateral side are coplanar.

14 . The packaged electronic device of claim 7 , wherein:

the dielectric bottom side defines an outermost dielectric side of the packaged electronic device; and

the dielectric bottom side is devoid of the encapsulant.

15 . The packaged electronic device of claim 7 , further comprising:

a second component terminal adjacent to the component base side; and

the clip bridge is connected to the second component terminal with an electrically conductive interface material.

16 . The packaged electronic device of claim 7 , wherein the encapsulant covers the clip bridge.

17 . A method of manufacturing a packaged electronic device, comprising:

providing a dielectric comprising a dielectric top side and a dielectric bottom side opposite to the dielectric top side, a first aperture extending from the dielectric top side to the dielectric bottom side; a second aperture extending from the dielectric top side to the dielectric bottom side, and a third aperture extending from the dielectric top side to the dielectric bottom side;

providing an electronic component comprising:

a component face side adjacent to the dielectric top side;

a component base side opposite to the component face side;

a component lateral side connecting the component face side to the component base side and defining a component perimeter; and

a first component terminal on the component face side and exposed within the second aperture, wherein the first component terminal is located inside the component perimeter;

providing a clip structure comprising:

a first clip pad having a first clip pad first face adjacent to the dielectric top side;

a clip bridge coupled to the component base side;

a first clip leg connecting the first clip pad and the clip bridge together,

a third clip pad having a third clip pad first face; and

a second clip leg connecting the third clip pad and the clip bridge together;

providing an encapsulant covering the electronic component, at least portions of the clip structure, and the dielectric top side;

providing a first external interconnect fixed to the first clip pad through the first aperture in the dielectric;

providing a second external interconnect fixed to the first component terminal through the second aperture in the dielectric; and

providing a third external interconnect fixed to the third clip pad through the third aperture.

18 . The method of claim 17 , wherein:

the dielectric comprises providing a polymer material.

19 . The method of claim 17 , wherein:

the clip structure comprises a copper/stainless steel/copper clad material.

20 . The method of claim 17 , wherein:

providing the clip structure comprises providing the clip bridge extending completely across the component base side from a first portion of the component lateral side to a second portion of the component lateral side opposite to the first portion.