Optical path structure, optical path system, and transfer method

1 . An optical path system, comprising M optical path structures and M-level optical switches cascaded with each other, wherein each of the M optical path structures comprises:

a beam adjustment module, configured to adjust a diameter of a laser beam and output a first beam;

a beam shaping module, configured to perform energy homogenization on the first beam to obtain a second beam; and

a beam focusing module, configured to focus the second beam and output a target light spot;

wherein the target light spot is used for irradiating a device substrate, allowing a target device to be separated from a carrier substrate because a bonding material, after being irradiated by the target light spot, in the device substrate changes; wherein the bonding material is disposed between the target device and the carrier substrate;

wherein the M optical path structures share one beam adjustment module, the M-level optical switches are respectively disposed in the M optical path structures, and each of optical switches comprises an input terminal, a first output terminal, and a second output terminal;

wherein the input terminal of a first-level optical switch is connected to an output terminal of the beam adjustment module, and the first output terminal of the first-level optical switch is connected to the beam shaping module in the optical path structure to which the first-level optical switch belongs; the input terminal of an i th -level optical switch is connected to the second output terminal of an (i−1) th -level optical switch, the first output terminal of the i th -level optical switch is connected to the beam shaping module in the optical path structure to which the i th -level optical switch belongs, and the second output terminal of the i th -level optical switch is connected to the input terminal of an (i+1) th -level optical switch; the first output terminal of an M th -level optical switch is connected to the beam shaping module in the optical path structure to which the M th level optical switch belongs;

M is a positive integer greater than 1, and i is greater than or equal to 2 and less than or equal to M−1.

2 . The optical path system according to claim 1 , wherein each of the optical switches is a reflective mirror, or each of the optical switches is a half-wave plate and polarizing beam splitter, or each of the optical switches is a half-wave plate and metal wire grid polarizer.

3 . An optical path system, wherein the optical path system comprises a beam splitting module and N optical path structures, wherein each of the N optical path structures comprises:

a beam adjustment module, configured to adjust a diameter of a laser beam and output a first beam;

a beam shaping module, configured to perform energy homogenization on the first beam to obtain a second beam; and

a beam focusing module, configured to focus the second beam and output a target light spot; wherein the target light spot is used for irradiating a device substrate, allowing a target device to be separated from a carrier substrate because a bonding material, after being irradiated by the target light spot, in the device substrate changes; wherein the bonding material is disposed between the target device and the carrier substrate;

wherein the N optical path structures share the one beam adjustment module and the beam splitting module;

wherein the beam splitting module is disposed between the beam adjustment module and the beam shaping module in each of the optical path structures, and is configured to split the first beam into N sub-beams and enable each of the sub-beams to respectively enter one of the beam shaping modules in the optical path structures, wherein N is a positive integer greater than 1.

4 . The optical path system according to claim 3 , wherein the beam splitting module is a diffractive beam splitter.

5 . The optical path system according to claim 1 , wherein the plurality of optical path structures sharing one beam adjustment module form a subsystem, and the optical path system comprises a plurality of the subsystems.

6 . A transfer method, wherein the transfer method adopts an optical path system comprising M optical path structures and M-level optical switches cascaded with each other, wherein each of the optical path structures comprises: a beam adjustment module, configured to adjust a diameter of a laser beam and output a first beam; a beam shaping module, configured to perform energy homogenization on the first beam to obtain a second beam; and a beam focusing module, configured to focus the second beam and output a target light spot;

wherein the transfer method comprises:

providing a device substrate, wherein the device substrate comprises a target device, a carrier substrate, and a bonding material disposed between the target device and the carrier substrate; and

controlling the optical path system to output the target light spot to irradiate the device substrate, allowing the target device to be separated from the carrier substrate because the bonding material, after being irradiated by the target light spot, in the device substrate changes;

wherein the M optical path structures share one beam adjustment module, the M-level optical switches are respectively disposed in the M optical path structures, and each of optical switches comprises an input terminal, a first output terminal, and a second output terminal; wherein the input terminal of a first-level optical switch is connected to an output terminal of the beam adjustment module, and the first output terminal of the first-level optical switch is connected to the beam shaping module in the optical path structure to which the first-level optical switch belongs; the input terminal of an i th -level optical switch is connected to the second output terminal of an (i−1) th -level optical switch, the first output terminal of the i th -level optical switch is connected to the beam shaping module in the optical path structure to which the i th -level optical switch belongs, and the second output terminal of the i th -level optical switch is connected to the input terminal of an (i+1) th -level optical switch; the first output terminal of an M th -level optical switch is connected to the beam shaping module in the optical path structure to which the M th -level optical switch belongs; M is a positive integer greater than 1, and i is greater than or equal to 2 and less than or equal to M−1;

wherein each of the optical switches is a reflective mirror, and the controlling the optical path system to output the target light spot comprises:

acquiring position information of the target device; and

controlling each of the optical switches to operate in a first state or a second state according to the position information;

wherein in the first state, the input terminal and the first output terminal of the optical switch are connected, and the input terminal and the second output terminal of the optical switch are disconnected; and in the second state, the input terminal and the first output terminal of the optical switch are disconnected, and the input terminal and the second output terminal of the optical switch are connected; or

wherein each of the optical switches is a half-wave plate and polarizing beam splitter, or each of the optical switches is a half-wave plate and metal wire grid polarizer, and the controlling the optical path system to output the target light spot comprises:

acquiring position information of the target device; and

controlling each of the optical switches to operate in a first state, a second state or a third state according to the position information;

wherein in the first state, the input terminal and the first output terminal of the optical switch are connected, and the input terminal and the second output terminal of the optical switch are disconnected; in the second state, the input terminal and the first output terminal of the optical switch are disconnected, and the input terminal and the second output terminal of the optical switch are connected; and in the third state, the input terminal and the first output terminal of the optical switch are connected, and the input terminal and the second output terminal of the optical switch are connected.

7 . The transfer method according to claim 6 , wherein the controlling the optical path system to output the target light spot to irradiate the device substrate comprises at least one of:

adjusting the size and position of the target light spot, allowing an orthographic projection of the target light spot on the device substrate to cover the target device and not overlap with other devices on the device substrate; and

adjusting the energy of the target light spot, allowing the energy density of the target light spot to be greater than or equal to a first energy density and less than a second energy density; wherein the first energy density is an energy density enabling the bonding material to be decomposed or gasified, and the second energy density is an energy density enabling the bonding material to be denatured.

8 . The optical path system according to claim 3 , wherein the plurality of optical path structures sharing one beam adjustment module form a subsystem, and the optical path system comprises a plurality of the subsystems.

9 . The optical path system according to claim 1 , wherein the beam adjustment module is a beam expander or a beam reducer.

10 . The optical path system according to claim 1 , wherein the beam shaping module comprises at least one of an optical diffractive element, an optical refractive element, and an optical reflective element.

11 . The optical path system according to claim 1 , wherein the beam focusing module is a focusing lens or a lens group consisting of a plurality of focusing lenses.

12 . The optical path system according to claim 1 , wherein the optical path structure further comprises:

a position adjustment module, disposed between the beam adjustment module and the beam shaping module, or disposed between the beam shaping module and the beam focusing module, or disposed on a light emitting side of the beam focusing module; wherein the position adjustment module is configured to change a propagation direction of a beam incident to the position adjustment module, allowing an orthographic projection of the target light spot on the device substrate to cover the target device.

13 . The optical path system according to claim 12 , wherein the position adjustment module comprises an optical reflective element.

14 . The optical path system according to claim 1 , wherein the optical path structure further comprises at least one of:

a laser device, configured to generate the laser beam;

at least one direction adjustment module, disposed between the beam adjustment module and the beam shaping module and configured to adjust a propagation direction of the first beam; and

an energy adjustment module, disposed between the beam adjustment module and the beam shaping module and configured to adjust energy of the first beam.

15 . The optical path system according to claim 14 , wherein at least one of the following is met:

the direction adjustment module comprises a reflective mirror; and

the energy adjustment module comprises a half-wave plate and a polarizing beam splitter.

16 . The optical path system according to claim 1 , wherein a size of the target light spot is greater than a size of the target device, and a boundary of the orthographic projection of the target light spot on the device substrate is protruded by a preset threshold relative to a boundary of the target device;

wherein the preset threshold is greater than or equal to zero and less than or equal to a half of a distance between the target device and an adjacent device, and the adjacent device is a device next to the target device in the device substrate.

17 . The optical path system according to claim 1 , wherein an energy density of the target light spot is greater than or equal to a first energy density and less than a second energy density;

wherein the first energy density is an energy density enabling the bonding material to be decomposed or gasified, and the second energy density is an energy density enabling the bonding material to be denatured.

18 . The optical path system according to claim 3 , wherein the beam adjustment module is a beam expander or a beam reducer; the beam shaping module comprises at least one of an optical diffractive element, an optical refractive element, and an optical reflective element; the beam focusing module is a focusing lens or a lens group consisting of a plurality of focusing lenses;

wherein the optical path structure further comprises: a position adjustment module, disposed between the beam adjustment module and the beam shaping module, or disposed between the beam shaping module and the beam focusing module, or disposed on a light emitting side of the beam focusing module; wherein the position adjustment module is configured to change a propagation direction of a beam incident to the position adjustment module, allowing an orthographic projection of the target light spot on the device substrate to cover the target device; wherein the position adjustment module comprises an optical reflective element;

wherein the optical path structure further comprises at least one of: a laser device, configured to generate the laser beam; at least one direction adjustment module, disposed between the beam adjustment module and the beam shaping module and configured to adjust a propagation direction of the first beam; and an energy adjustment module, disposed between the beam adjustment module and the beam shaping module and configured to adjust energy of the first beam;

wherein at least one of the following is met:

the direction adjustment module comprises a reflective mirror; and

the energy adjustment module comprises a half-wave plate and a polarizing beam splitter;

wherein a size of the target light spot is greater than a size of the target device, and a boundary of the orthographic projection of the target light spot on the device substrate is protruded by a preset threshold relative to a boundary of the target device; wherein the preset threshold is greater than or equal to zero and less than or equal to a half of a distance between the target device and an adjacent device, and the adjacent device is a device next to the target device in the device substrate;

wherein an energy density of the target light spot is greater than or equal to a first energy density and less than a second energy density;

wherein the first energy density is an energy density enabling the bonding material to be decomposed or gasified, and the second energy density is an energy density enabling the bonding material to be denatured.