Integrated circuit packages and methods of forming the same

1 . A method comprising:

attaching a first package component to a package substrate, the first package component comprising:

a first die being disposed over an interposer;

a second die being disposed over the interposer and laterally adjacent to the first die; and

an encapsulant being disposed around the first die and the second die;

attaching a second package component to the package substrate;

attaching a thermal interface material to the first die and the second die; and

attaching a lid structure to the package substrate, the lid structure comprising:

a lid cap being disposed over the thermal interface material, the lid cap comprising a cavity forming a loop, wherein in a plan view the loop is around the first package component and the second package component; and

a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the first package component and the second package component.

2 . The method of claim 1 , wherein the plurality of lid feet comprises a first foot and a second foot disposed proximal to the first die and the second die, and wherein a groove between the first foot and the second foot is aligned with a gap region between the first die and the second die.

3 . The method of claim 1 , wherein the plurality of lid feet comprises corner lid feet, and wherein each of the corner lid feet has an L-shape.

4 . The method of claim 3 , further comprising an underfill being disposed between the interposer and the package substrate, wherein the underfill is at least 3 mm from each of the corner lid feet.

5 . The method of claim 1 , wherein the lid structure further comprises a protrusion extending from the lid cap, and wherein the protrusion is disposed between the first package component and the second package component.

6 . The method of claim 5 , wherein the protrusion comprises a first protrusion foot and a second protrusion foot, and wherein a groove between the first protrusion foot and the second protrusion foot is aligned with a gap region between the first die and the second die.

7 . A method comprising:

forming a first package component, the first package component comprising a first plurality of dies attached over a first interposer;

bonding the first package component to a package substrate, the package substrate comprising:

a substrate core;

redistribution structures on opposite sides of the substrate core; and

through vias extending through the substrate core and coupling the redistribution structures to one another;

bonding a second package component to the package substrate, the second package component comprising a second plurality of dies attached over a second interposer;

attaching a lid structure over the first package component and to a first surface of the package substrate, the lid structure comprising:

a plurality of lid feet adjacent a perimeter of the package substrate; and

a lid cap over and connecting the plurality of lid feet.

8 . The method of claim 7 , further comprising

forming the second package component.

9 . The method of claim 8 , wherein the first package component and the second package component are laterally displaced from one another along the first surface of the package substrate.

10 . The method of claim 9 , wherein the lid structure comprises an additional foot interposed between the first package component and the second package component.

11 . The method of claim 9 , wherein the lid structure comprises an additional plurality of feet interposed between the first package component and the second package component.

12 . The method of claim 7 , further comprising, before attaching the lid structure, attaching a thermal interface material over the first package component.

13 . A method comprising:

bonding a first die and a second die to a first interposer to form a first package component, a first gap region separating the first die from the second die;

attaching the first package component to a package substrate using solder regions;

dispensing an underfill material around the solder regions;

attaching a thermal interface material over the first package component;

attaching a lid structure to the package substrate and over the thermal interface material, attaching the lid structure comprising:

adhering a first lid foot and a second lid foot of the lid structure to an outer region of the package substrate using an adhesive material, a second gap region separating the first lid foot from the second lid foot, wherein the second gap region is aligned with the first gap region; and

placing a lid cap of the lid structure in contact with the thermal interface material.

14 . The method of claim 13 , further comprising attaching a second package component to the package substrate, wherein the lid structure is attached over the second package component, and wherein a third gap region separates the first package component from the second package component.

15 . The method of claim 14 , further comprising adhering a third lid foot to the package substrate within the third gap region.

16 . The method of claim 13 , wherein the thermal interface material is in contact with the first die and the second die.

17 . The method of claim 16 , wherein placing the lid cap of the lid structure in contact with the thermal interface material is performed after adhering the first lid foot and the second lid foot of the lid structure to the package substrate.

18 . The method of claim 13 , wherein the lid cap comprises a vapor chamber.

19 . The method of claim 18 , wherein the vapor chamber comprises:

an internal chamber;

a working fluid inside of the internal chamber; and

a wick structure inside of the internal chamber and configured for the working fluid to pass through.

20 . The method of claim 7 , wherein the lid structure comprises a cavity located where the lid cap and the lid feet meet, and wherein the cavity forms a continuous loop.