Resins for use in toys and methods of making the same
Resins for use in toys and methods for making the same are provided. In preferred embodiments, the resins comprise 30% to 55% w/w of Ethoxylated (10) Bisphenol A Diacrylate; 20% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked; 20% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked; 1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone; 0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate; 0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide; and less than 0.19% w/w of 2-hydroxyethyl acrylate.
1 . A resin for use in toy kits comprising:
30% to 55% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
20% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
20% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide; and
less than 0.19% w/w of 2-hydroxyethyl acrylate.
2 . The resin of claim 1 , wherein the Ethoxylated (10) Bisphenol A Diacrylate is 40% to 50% w/w.
3 . The resin of claim 2 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 20% to 25% w/w.
4 . The resin of claim 3 , wherein the Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked is 20% to 25% w/w.
5 . The resin of claim 1 , further comprising 1%-5% silicon dioxide w/w and wherein the Ethoxylated (10) Bisphenol A Diacrylate is 30% to 35% w/w.
6 . The resin of claim 5 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 30% to 35% w/w.
7 . The resin of claim 6 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 25% to 30% w/w.
8 . The resin of claim 1 , further comprising 5%-9% silicon dioxide and wherein the Ethoxylated (10) Bisphenol A Diacrylate is 30% to 35% w/w.
9 . The resin of claim 5 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 25% to 30% w/w.
10 . The resin of claim 6 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 25% to 30% w/w.
11 . The resin of claim 1 , wherein the Ethoxylated (10) Bisphenol A Diacrylate is 45% to 55% w/w.
12 . The resin of claim 2 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 20% to 25% w/w.
13 . The resin of claim 3 , wherein the Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatomethyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked is 20% to 25% w/w.
14 . A resin for use in toy kits comprising:
30% to 35% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
25% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
25% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide;
1%-9% w/w silicon dioxide;
and
less than 0.19% w/w of 2-hydroxyethyl acrylate.
15 . The resin of claim 14 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 30% to 35% w/w.
16 . The resin of claim 15 , wherein the silicone dioxide is 1%-5% w/w of the resin.
17 . The resin of claim 14 , wherein the 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked is 25% to 30% w/w.
18 . The resin of claim 15 , wherein the silicone dioxide is 5%-9% w/w of the resin.
19 . A resin for use in toy kits consisting essentially of:
40% to 50% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
20% to 25% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
20% to 25% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide;
1%-9% w/w silicon dioxide;
and
less than 0.19% w/w of 2-hydroxyethyl acrylate.