Membrane-dehumidification technologies for electronic component protection
An enclosure for housing electronics, including a housing portion defining an inner volume, an aperture formed through the housing portion, and a water selective membrane operationally connected to the aperture and positioned to selectively pass water molecules from the inner volume to an oppositely disposed exterior environment to maintain dried air within the inner volume. The enclosure of may further include an electronics package disposed within the inner volume, a Joule heater disposed within the inner volume, a pump operationally connected to the inner volume to urge water molecules across the membrane, a sensor operationally connected to the inner volume, and/or a microprocessor operationally connected to the sensor, to the pump, and/or to the Joule heater.
1 . An enclosure for housing electronics, comprising:
a housing portion defining an inner volume;
an aperture formed through the housing portion;
a water selective membrane operationally connected to the aperture and positioned to selectively pass water molecules from the inner volume to an oppositely disposed exterior environment to maintain dried air within the inner volume; and
a pump operationally connected to the inner volume to urge water molecules across the membrane.
2 . The enclosure of claim 1 and further comprising an electronics package disposed within the inner volume.
3 . The enclosure of claim 1 and further comprising a Joule heater disposed within the inner volume.
4 . The enclosure of claim 3 and further comprising a sensor operationally connected to the inner volume; and a microprocessor operationally connected to the sensor and to the Joule heater.
5 . The enclosure of claim 1 and further comprising an electronics package disposed within the inner volume; a Joule heater disposed within the inner volume; a sensor operationally connected to the inner volume; and a microprocessor operationally connected to the sensor, to the pump, and to the Joule heater.
6 . The enclosure of claim 1 wherein the water selective membrane is a polymer polyether block amide resin thermoplastic elastomer portion and a graphene oxide portion.
7 . The enclosure of claim 1 wherein the inner volume is airtight.
8 . The enclosure of claim 3 and further comprising a desiccant operationally connected to the inner volume and positioned adjacent the water selective membrane and the Joule heater.
9 . A method of minimizing humidity in an electronics enclosure, comprising:
a) enclosing an electronics package in an inner volume;
b) positioning a water selective membrane between the inner volume and an exterior environment;
c) urging water molecules from the inner volume through the water selective membrane to the exterior environment; and
d) heating the inner volume to urge water molecules through the water selective membrane;
wherein the water selective membrane is in pneumatic communication with the inner volume and the exterior environment; and
wherein the water selective membrane is oriented to allow unidirectional passage of water molecules therethrough to yield dried air in the inner volume.
10 . The method of claim 9 and further comprising:
e) establishing a vapor pressure differential between the inner volume and the exterior environment to urge water molecules through the water selective membrane.
11 . The method of claim 9 wherein the water selective membrane is a polymer polyether block amide resin thermoplastic elastomer portion and a graphene oxide portion.
12 . An enclosure for reducing humidity therein, comprising:
a housing portion defining an inner volume;
an aperture formed through the housing portion;
a water selective membrane operationally connected to the aperture and positioned to selectively pass water molecules from the inner volume to an oppositely disposed exterior environment to maintain dried air within the inner volume; and
a first resistance heater operationally connected within the inner volume for promoting convection;
a sensor operationally connected to the inner volume; and
a microprocessor operationally connected to the sensor and to the first resistance heater.
13 . The enclosure of claim 12 and further comprising a second resistance heater positioned adjacent the water selective membrane and operationally connected to the microprocessor.
14 . The enclosure of claim 12 and further comprising a pump operationally connected to the inner volume to urge water molecules across the membrane.
15 . An enclosure for reducing humidity therein, comprising:
a housing portion defining an inner volume;
an aperture formed through the housing portion;
a water selective membrane operationally connected to the aperture and positioned to selectively pass water molecules from the inner volume to an oppositely disposed exterior environment to maintain dried air within the inner volume;
a first resistance heater operationally connected within the inner volume and positioned adjacent the membrane for increasing the local water vapor partial pressure;
a sensor operationally connected to the inner volume;
a microprocessor operationally connected to the sensor and to the first resistance heater; and
a pump operationally connected to the microprocessor and in fluidic communication with the inner volume to urge water molecules across the membrane.
16 . An electronics housing for reducing humidity therein, comprising:
a housing portion defining an inner volume;
an aperture formed through the housing portion;
a water-selective membrane operationally connected to the aperture and positioned to selectively pass water molecules from the inner volume to an oppositely disposed exterior environment to maintain dried air within the inner volume;
a first resistance heater operationally connected within the inner volume and positioned adjacent the membrane for increasing the local water vapor partial pressure;
a sensor operationally connected to the inner volume;
a microprocessor operationally connected to the sensor and to the first resistance heater; and
a desiccant operationally connected to the housing portion and in positioned adjacent the water-selective membrane and resistance heater;
wherein the desiccant is in fluidic communication with the inner volume to capture water molecules.
17 . The electronics housing of claim 16 and further comprising a fan positioned to urge air across the water-selective membrane.