Diagnostic detection chip devices and methods of manufacture and assembly
Diagnostic detection chip device designs that reduce cost of fabrication and assembly are described herein. Such chip device designs include features that facilitate use of the chip within a chip carrier device with integrated fluid flow control features and compatibility with conventional sample cartridges and sample processing systems. Associated methods of manufacture and assembly of the chip devices are also provided herein.
1 . A method of fabricating a diagnostic detection chip for use within a diagnostic chip device assembly, the method comprising:
forming an active surface on one side of a diagnostic detection chip, wherein the active surface includes one or more biologically sensitive optical detectors configured to detect the presence of one or more analyte in a fluid sample;
forming a plurality of probe contact pads on the same one side as the active surface;
electrically connecting the active surface to the plurality of probe contact pads of an electrical interface defined within the diagnostic detection chip without any wire bonds, and
securing the diagnostic detection chip to a thermally conductive metal substrate to facilitate thermal cycling of the fluid sample.
2 . The method of claim 1 , wherein the diagnostic detection chip comprises any of CMOS, ISFET, bulk acoustic, non-bulk acoustic, piezo-acoustic and pore array sensor chips.
3 . The method of claim 1 , wherein each of the plurality of probe contact pads are electrically connected to a plurality of electrical contacts defined on the diagnostic detection chip along the same side as the active surface.
4 . The method of claim 1 , wherein the diagnostic detection chip is without any rigid support substrate separate from a silicon wafer in which the diagnostic detection chip is defined.
5 . The method of claim 1 , wherein the plurality of probe contact pads are defined within the diagnostic detection chip itself.
6 . The method of claim 5 , wherein the plurality of probe contact pads are defined along the same side of the diagnostic detection chip as the active surface.
7 . The method of claim 5 , wherein the plurality of probe contact pads are arranged within one or more rows along or near one edge of the diagnostic detection chip.
8 . The method of claim 1 , further comprising:
securing the diagnostic detection chip within a diagnostic chip carrier so as to sealingly engage the active face of the diagnostic detection chip within a flowcell chamber of the diagnostic chip carrier.
9 . The method of claim 8 , wherein the diagnostic detection chip is positioned such that the probe contacts pads are accessible through a window of the diagnostic chip carrier.
10 . The method of claim 1 , wherein the thermally conductive metal substrate is copper.
11 . The method of claim 1 , wherein the diagnostic detection chip is defined to be operable without requiring any via connections through any rigid PCB support substrate underlying substantially the entire diagnostic detection chip.