Acoustic element integrated circuit, probe, and diagnosis device
An acoustic element integrated circuit includes cells, being arrayed two-dimensionally on a same curved surface, wherein capacitive acoustic-elements having vibration membranes are allocated by unit number in each of the cells. Each of the cells encompasses an intra-cell circuit, which includes an exciting circuit for driving collectively portions by the unit number, the portions having transmitting functions of the acoustic-elements, and a reception circuit for processing collectively received signals transferred from portions by the unit number, the portions having reception functions in the acoustic-elements. Here, the exciting circuits are sorted into a chip in which high-voltage drivers for exciting the vibration membranes are merged and a chip in which circuits operated at voltages lower than the high-voltage drivers are merged, and the cells are operated two-dimensionally, by individually controlling the intra-cell circuits so that cells can be driven independently.
1 . An acoustic element integrated circuit including a plurality of cells, being arrayed two-dimensionally on a same curved surface, wherein capacitive acoustic-elements having vibration membranes are allocated by unit number in each of the cells, each of the cells comprising an intra-cell circuit including:
an exciting circuit configured to drive collectively portions by a set of the unit number, each of the portions having a transmitting function of each of the capacitive acoustic-elements, and
a reception circuit configured to process collectively received signals transferred from portions by a set of the unit number, each of the portions having a reception function in each of the capacitive acoustic-elements, and
wherein the exciting circuits are sorted into a chip in which high-voltage drivers for exciting the vibration membranes are merged and a chip in which circuits operated at voltages lower than the high-voltage drivers are merged, and the plurality of the cells are operated two-dimensionally, by individually controlling the intra-cell circuits so that the plurality of cells can be driven independently from each other.
2 . The integrated circuit of claim 1 , wherein the capacitive acoustic-elements are merged in a first chip, the high-voltage drivers are merged in a second chip, and circuits for the exciting circuits operating at voltages lower than the high-voltage driver and the reception circuits are merged in a third chip in a pattern corresponding to an array of the plurality of cells in the first chip.
3 . The integrated circuit of claim 1 , wherein the capacitive acoustic-elements and the high-voltage drivers are merged in a first chip, the circuits for the exciting circuits operated at voltages lower than the high-voltage drivers and the reception circuits are merged in a second chip in a pattern corresponding to an array of the plurality of cells in the first chip.
4 . The integrated circuit of claim 2 , wherein each of the capacitive acoustic-elements is an element having a single vibration-cavity and has the transmitting function and the reception function, and a switch for changing connections between the exciting circuit and the capacitive acoustic-elements and for changing connections between the capacitive acoustic-elements and the reception circuit are arrayed in the second chip, in correspondence with the two-dimensional array included in each of the cells.
5 . The integrated circuit of claim 3 , wherein each of the capacitive acoustic-elements is an element having a single vibration-cavity and has the transmitting function and the reception function, and a switch for changing connections between the exciting circuit and the capacitive acoustic-elements and for changing connections between the capacitive acoustic-elements and the reception circuit are arrayed in the second chip, in correspondence with the two-dimensional array included in each of the cells.
6 . The integrated circuit of claim 2 , wherein each of the capacitive acoustic-elements has a vibration-cavity for transmitting and another vibration-cavity for receiving ultrasonic waves.
7 . The integrated circuit of claim 3 , wherein each of the capacitive acoustic-elements has a vibration-cavity for transmitting and another vibration-cavity for receiving ultrasonic waves.
8 . The integrated circuit of claim 2 , wherein circuits of large-signal levels of 20 volts or more are merged in the second chip, and circuits of small-signal levels of less than 20 volts are merged in the third chip.
9 . The integrated circuit of claim 2 , wherein a delay circuit or a waveform generator constructing each of the exciting circuits, and the reception circuits are merged in the third chip.
10 . The integrated circuit of claim 8 , wherein a delay circuit or a waveform generator constructing each of the exciting circuits, and the reception circuits are merged in the third chip.
11 . The integrated circuit of claim 2 , wherein a transmission/reception controller for driving the plurality of cells to be operated independently from each other is merged in the third chip as a common circuit for the plurality of cells.
12 . The integrated circuit of claim 8 , wherein a transmission/reception controller for driving the plurality of cells to be operated independently from each other is merged in the third chip as a common circuit for the plurality of cells.
13 . The integrated circuit of claim 10 , wherein a transmission/reception controller for driving the plurality of cells to be operated independently from each other is merged in the third chip as a common circuit for the plurality of cells.
14 . The integrated circuit of claim 3 , wherein circuits of large-signal levels of 20 volts or more are merged in the first chip, and circuits of small-signal levels of less than 20 volts are merged in the second chip.
15 . The integrated circuit of claim 14 , wherein a delay circuit or a waveform generator constructing each of the exciting circuits, and the reception circuits are merged in the second chip.
16 . The integrated circuit of claim 3 , wherein a transmission/reception controller for driving the plurality of cells to be operated independently from each other are merged in the second chip as a common circuit for the plurality of cells.
17 . The integrated circuit of claim 14 , wherein a transmission/reception controller for driving the plurality of cells to be operated independently from each other are merged in the second chip as a common circuit for the plurality of cells.
18 . A probe comprising:
an acoustic element integrated circuit including a plurality of cells, being arrayed two-dimensionally on a same curved surface, wherein capacitive acoustic-elements having vibration membranes are allocated in unit number in each of the cells, each of the cells comprising an intra-cell circuit including:
an exciting circuit configured to drive collectively portions by a set of the unit number, each of the portions having a transmitting function of each of the capacitive acoustic-elements, and
a reception circuit configured to process collectively received signals transferred from portions by a set of the unit number, each of the portions having a reception function in each of the capacitive acoustic-elements; and
a probe enclosure for accommodating the capacitive acoustic-elements integrated circuit,
wherein the exciting circuits are sorted into a chip in which high-voltage drivers for exciting the vibration membranes are merged and a chip in which circuits operated at voltages lower than the high-voltage drivers are merged, and the plurality of the cells are operated two-dimensionally, by individually controlling the intra-cell circuits so that the plurality of cells can be driven independently from each other.
19 . The probe of claim 18 , further comprising a transmission/reception controller for operating the plurality of cells independently from each other in the probe enclosure as a common circuit for the plurality of the cells.
20 . A diagnosis device comprising:
an acoustic element integrated circuit including a plurality of cells, being arrayed two-dimensionally on a same curved surface, wherein capacitive acoustic-elements having vibration membranes are allocated in unit number in each of the cells, each of the cells comprising an intra-cell circuit including:
an exciting circuit configured to drive collectively portions by a set of the unit number, each of the portions having a transmitting function of each of the capacitive acoustic-elements, and
a reception circuit configured to process collectively received signals transferred from portions by a set of the unit number, each of the portions having a reception function in each of the capacitive acoustic-elements;
a transmission/reception controller for operating the plurality of cells independently from each other, as a common circuit for the plurality of cells; and
a display for displaying an image based upon signals transferred from the transmission/reception controller, and
wherein the exciting circuits are sorted into a chip in which high-voltage drivers for exciting the vibration membranes are merged and a chip in which circuits operated at voltages lower than the high-voltage drivers are merged, and the plurality of the cells are operated two-dimensionally, by individually controlling the intra-cell circuits so that the plurality of cells can be driven independently from each other.