Cleaning assembly

1 . A cleaning assembly for use in a processing apparatus including a holding unit that holds a workpiece, and a processing unit that processes the workpiece, the cleaning assembly comprising:

a conveying unit that has a suction surface for holding the workpiece under suction and that conveys the workpiece;

a substrate having a constant thickness and a lower surface which is held under suction on an upper surface of a chuck table of the holding unit, wherein the lower surface of the substrate is held in contacting relationship with the upper surface of the chuck table; and

a cleaning member formed from a brush implanted in an upper surface of the substrate,

wherein the suction surface of the conveying unit is cleaned by an action of the cleaning member in a state in which the cleaning assembly is held on the holding unit.

2 . The cleaning assembly according to claim 1 , wherein the lower surface of the substrate has a size corresponding to a size of a suction chuck of the chuck table.

3 . The cleaning assembly according to claim 1 , wherein the cleaning member is formed with at least one suction hole.

4 . The cleaning assembly according to claim 3 , wherein the cleaning assembly is conveyed to the chuck table by a conveying arm with an arm member and at least one suction member disposed at a tip part of the arm member, such that the at least one suction member is positioned at the at least one suction hole.

5 . The cleaning assembly according to claim 1 , further comprising a cleaning water supply nozzle for supplying cleaning water to the cleaning member.

6 . The cleaning assembly according to claim 1 , wherein a diameter of the substrate is the same as a diameter of the cleaning member.

7 . The cleaning assembly according to claim 1 , wherein a center of the cleaning member is aligned with a center of the substrate.

8 . The cleaning assembly according to claim 1 , wherein the substrate is a hard resin circular plate.

9 . A cleaning assembly for use in a processing apparatus including a holding unit that holds a workpiece, and a processing unit that processes the workpiece, the cleaning assembly comprising:

a conveying unit that has a suction surface for holding the workpiece under suction and that conveys the workpiece;

a substrate having a constant thickness and a lower surface which is held under suction on an upper surface of a chuck table of the holding unit, wherein the lower surface of the substrate is held in contacting relationship with the upper surface of the chuck table; and

a cleaning member disposed on an upper surface of the substrate,

wherein the suction surface of the conveying unit is cleaned by an action of the cleaning member in a state in which the cleaning assembly is held on the holding unit, and

wherein the cleaning member is formed with at least one suction hole, such that the cleaning assembly is conveyed to the chuck table by a conveying arm with an arm member and at least one suction member disposed at a tip part of the arm member, such that the at least one suction member is positioned at the at least one suction hole.

10 . A cleaning assembly for use in a processing apparatus including a holding unit that holds a workpiece, and a processing unit that processes the workpiece, the cleaning assembly comprising:

a conveying unit that has a suction surface for holding the workpiece under suction and that conveys the workpiece;

a substrate having a constant thickness and a lower surface which is held under suction on an upper surface of a chuck table of the holding unit, wherein the lower surface of the substrate is held in contacting relationship with the upper surface of the chuck table; and

a cleaning member formed from a sponge pad adhered to an upper surface of the substrate,

wherein the suction surface of the conveying unit is cleaned by an action of the cleaning member in a state in which the cleaning assembly is held on the holding unit.