IP Library Granted Patent US 12678850
Granted Patent B2
US 12678850 · App. 18/412,925 · Granted Jul 14, 2026

Molding device

Inventors: Kei Yamauchi (Niihama, JP); Eiji Kouyama (Niihama, JP); Hiroyuki Kan (Niihama, JP); Norieda Ueno (Niihama, JP)
Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
B21D26/041B21D26/039
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Quick Facts
Patent No.
US 12678850
App. No.
18/412,925
Granted
Jul 14, 2026
Kind
B2
Abstract

A molding device supplies a fluid and performs expansion molding of a metal material using at least a part of members of an existing press device.

Claims (22)

1 . A molding device configured to perform expansion molding of a metal material by supplying a fluid to the metal material and configured to be installed in an existing press device, the molding device comprising:

a first die and a second die facing each other; and

a load receiver configured to receive, from a slide of the existing press device, a load to stop a die closing operation during die closing of the first die and the second die, the slide being configured to move the first die toward the second die,

wherein the load receiver is configured to

stop the die closing operation at a predetermined position between a die closing start position and a die closing completion position when a first pressure is applied to the load receiver, and

allow the die closing operation when a second pressure higher than the first pressure is applied to the load receiver.

2 . The molding device according to claim 1 ,

wherein the fluid is a gas.

3 . The molding device according to claim 1 ,

wherein expansion molding of a heated metal material is performed.

4 . The molding device according to claim 1 ,

wherein a first driver configured to move the first die is accommodated in a crown of the existing press device, and

a second driver configured to move the second die is accommodated in a bed of the existing press device.

5 . The molding device according to claim 4 ,

wherein the first die is attached to the slide via a die holder.

6 . The molding device according to claim 1 ,

wherein the load receiver includes a load receiving member provided on an upper surface of a base stage of the existing press device and a contact member provided on a lower surface of the slide, and the contact member is provided at a position facing the load receiving member on an upper side of the load receiving member.

7 . The molding device according to claim 1 , further comprising a holder, a heater, and a fluid supplier.

8 . The molding device according to claim 7 ,

wherein the fluid supplier includes a nozzle configured to supply a fluid from an opening portion of an end portion of the metal material to an inside of the metal material, a driver configured to move the nozzle back and forth with respect to the opening portion of the metal material, and a supply source configured to supply a high-pressure fluid into the metal material via the nozzle.

9 . The molding device according to claim 7 ,

wherein the fluid supplier is provided on both end sides of the first die and the second die in an extending direction.