Device and method for optimizing control parameter of solder printing apparatus

1 . An electronic device comprising:

a communication circuit that is communicatively connected to a solder printing apparatus configured to print solder on each of a plurality of substrates based on a plurality of control parameters and a solder paste inspection apparatus configured to measure a state of the solder printed on each of the plurality of substrates transferred from the solder printing apparatus;

one or more memories; and

one or more processors that are operatively connected to the communication circuit and the one or more memories,

wherein the one or more processors are configured to:

acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate;

transmit information indicating the first control parameter set to the solder printing apparatus;

acquire, from the solder paste inspection apparatus, first solder measurement information indicating a state of the solder printed on the first substrate;

determine a first yield for the first substrate based on the first solder measurement information;

generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield; and

acquire, from the model, a second control parameter set of the solder printing apparatus for printing solder on a second substrate on which solder is to be printed next in order of the first substrate, and

wherein the second control parameter set is determined based on a variance value indicating uncertainty of a predicted yield being largest among a plurality of points included on a multidimensional parameter space defined by the plurality of control parameters.

2 . The electronic device of claim 1 , wherein the one or more processors are configured to:

transmit information indicating the second control parameter set to the solder printing apparatus;

acquire, from the solder paste inspection apparatus, second solder measurement information indicating a state of the solder printed on the second substrate;

determine a second yield for the second substrate based on the second solder measurement information; and

update the model based on the first data pair and a second data pair including the second control parameter set and the second yield.

3 . The electronic device of claim 2 , wherein the model outputs, based on the first data pair, the second control parameter set that enables the second yield to be greater than or equal to a preset or automatically set threshold value.

4 . The electronic device of claim 2 , wherein the model outputs, based on the first data pair, the second control parameter set that enables the second yield to increase over the first yield.

5 . The electronic device of claim 2 , wherein the one or more processors are configured to update the model until a predetermined number of control parameter sets are searched for.

6 . The electronic device of claim 5 , wherein the one or more processors are configured to:

determine a control parameter set having a highest corresponding yield among the predetermined number of control parameter sets as the optimal control parameter set after searching for the predetermined number of control parameter sets; and

transmit information indicating the optimal control parameter set to the solder printing apparatus.

7 . The electronic device of claim 1 , wherein the plurality of control parameters include a control parameter for adjusting a print pressure of the solder printing apparatus, a control parameter for adjusting a print speed, and a control parameter for adjusting a substrate separating speed.

8 . The electronic device of claim 2 , wherein each of the first control parameter set and the second control parameter set corresponds to one point on the multidimensional parameter space defined by the plurality of control parameters.

9 . The electronic device of claim 8 , wherein the model outputs, based on the first data pair, the second control parameter set corresponding to an unsearched arbitrary point among a plurality of points included in the multidimensional parameter space.

10 . The electronic device of claim 9 , wherein the arbitrary point is a point at which uncertainty of a predicted yield is greatest among the plurality of points.

11 . The electronic device of claim 2 , wherein the first yield and the second yield are determined as a probability distribution by a probabilistic modeling methodology.

12 . The electronic device of claim 1 , wherein the first control parameter set is set by a user.

13 . A method of optimizing a control parameter of an electronic device that is communicatively connected to a solder printing apparatus configured to print solder on each of a plurality of substrates based on a plurality of control parameters and a solder paste inspection apparatus configured to measure a state of the solder printed on each of the plurality of substrates transferred from the solder printing apparatus, the method comprising:

acquiring a first control parameter set of the solder printing apparatus for printing solder on a first substrate;

transmitting information indicating the first control parameter set to the solder printing apparatus;

acquiring, from the solder paste inspection apparatus, first solder measurement information indicating a state of the solder printed on the first substrate;

determining a first yield for the first substrate based on the first solder measurement information;

generating a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield;

acquiring, from the model, a second control parameter set of the solder printing apparatus for printing solder on a second substrate on which solder is to be printed next in order of the first substrate,

wherein the second control parameter set is determined based on a variance value indicating uncertainty of a predicted yield being largest among a plurality of points included on a multidimensional parameter space defined by the plurality of control parameters.

14 . The method of claim 13 , further comprising:

transmitting information indicating the second control parameter set to the solder printing apparatus;

acquiring, from the solder paste inspection apparatus, second solder measurement information indicating a state of the solder printed on the second substrate;

determining a second yield for the second substrate based on the second solder measurement information; and

updating the model based on the first data pair and a second data pair including the second control parameter set and the second yield.

15 . The method of claim 14 , wherein the model outputs, based on the first data pair, the second control parameter set that enables the second yield to be greater than or equal to a preset threshold value.

16 . The method of claim 14 , wherein the model outputs, based on the first data pair, the second control parameter set that enables the second yield to increase over the first yield.

17 . The method of claim 13 , wherein the plurality of control parameters include a control parameter for adjusting a print pressure of the solder printing apparatus, a control parameter for adjusting a print speed, and a control parameter for adjusting a substrate separating speed.

18 . The method of claim 14 , wherein each of the first control parameter set and the second control parameter set corresponds to one point on the multidimensional parameter space defined by the plurality of control parameters.

19 . The method of claim 18 , wherein the model outputs, based on the first data pair, the second control parameter set corresponding to an unsearched arbitrary point among a plurality of points included in the multidimensional parameter space.

20 . The method of claim 14 , wherein the first yield and the second yield are determined as a probability distribution by a probabilistic modeling methodology.