Substrate processing apparatus

1 . A substrate processing apparatus comprising:

a frame with an opening at a bottom of the frame, the frame including an internal space;

a first plate below the frame;

and a second plate below the first plate and completely spaced apart from the first plate,

wherein the first plate includes a plurality of first holes,

the second plate includes a plurality of second holes, and at least one second dam surrounding at least one of the plurality of second holes and protruding toward the internal space, the second plate being downwardly inclined from a central point toward an edge,

the plurality of first holes are staggered with respect to the plurality of second holes in a vertical direction, and

the second plate further includes depressions configured to collect liquefied fumes.

2 . The substrate processing apparatus of claim 1 , wherein a first imaginary plane extended along the first plate and a second imaginary plane extended along the second plate intersect each other at an acute angle.

3 . The substrate processing apparatus of claim 2 , wherein

the first imaginary plane intersects a horizontal plane at a first angle,

the second imaginary plane intersects the horizontal plane at a second angle, and

the second angle is greater than the first angle.

4 . The substrate processing apparatus of claim 1 , wherein

the second plate has a first region, and a second region outside the first region, and

a first distance from the first region to the first plate is less than a second distance from the second region to the first plate.

5 . The substrate processing apparatus of claim 4 , wherein

the second plate further has a third region outside the second region, and

the second distance from the second region to the first plate is less than a third distance from the third region to the first plate.

6 . The substrate processing apparatus of claim 1 , wherein

the second plate has a central region, and an edge region outside the central region,

the at least one second dam includes a central dam in the central region and an edge dam in the edge region, and

a height of the central dam is greater than a height of the edge dam.

7 . The substrate processing apparatus of claim 1 , further comprising: a suction unit configured to remove the liquefied fumes collected in the depressions.

8 . The substrate processing apparatus of claim 1 , wherein

the frame has a plurality of sidewalls,

the plurality of sidewalls include a first sidewall at a location where substrates are introduced into the substrate processing apparatus, and

the substrate processing apparatus further includes a wing connected to the second plate, the wing protruding beyond the first sidewall of the frame toward a direction along which the substrates are introduced.

9 . The substrate processing apparatus of claim 1 , wherein the first plate further includes at least one first dam surrounding at least one of the plurality of first holes, the at least one first dam protruding toward the internal space.

10 . The substrate processing apparatus of claim 9 , wherein

the at least one first dam surrounds a single first hole from among the plurality of first holes, and

the at least one second dam surrounds a single second hole from among the plurality of second holes.

11 . The substrate processing apparatus of claim 1 , wherein

the internal space is configured to cool gas therein, and

the substrate processing apparatus is configured to provide the gas cooled in the internal space onto substrates by sequentially passing through the plurality of first holes and the plurality of second holes.

12 . A substrate processing apparatus comprising:

a transport unit configured to transport substrates in one direction;

a plurality of heating zones sequentially on the transport unit along the one direction; and

at least one cooling zone on the transport unit along the one direction, the at least one cooling zone downstream of the plurality of heating zones,

wherein the at least one cooling zone includes a frame, a first plate below the frame, and a second plate below the first plate and completely spaced apart from the first plate, the frame including an internal space and an opening at a bottom of the frame, the first plate includes a plurality of first holes and at least one first dam, the at least one first dam surrounding at least one of the plurality of first holes and protruding toward the internal space, the second plate includes a plurality of second holes and at least one second dam, the at least one second dam surrounding at least one of the plurality of second holes and protruding toward the internal space, the second plate being downwardly inclined from a central point toward an edge,

the plurality of first holes are staggered with respect to the plurality of second holes in a vertical direction, and

the second plate further includes depressions configured to collect liquefied fumes.

13 . The substrate processing apparatus of claim 12 , further comprising:

a buffer zone between the at least one cooling zone and the plurality of heating zones; and

an exhaust box connected to the buffer zone, the exhaust box configured to discharge gas within the plurality of heating zones or within the at least one cooling zone.

14 . The substrate processing apparatus of claim 12 , wherein a first imaginary plane extended along the first plate and a second imaginary plane extended along the second plate intersect each other at an acute angle.

15 . The substrate processing apparatus of claim 12 , wherein

the second plate has a first region, and a second region outside the first region, and

a first distance from the first region to the first plate is less than a second distance from the second region to the first plate.

16 . The substrate processing apparatus of claim 12 , wherein

solder balls are on one surface of each of the substrates, and

the substrate processing apparatus is configured to perform a reflow process on the substrates as the substrates sequentially pass through the plurality of heating zones and the at least one cooling zone.

17 . The substrate processing apparatus of claim 12 , wherein

the at least one cooling zone includes a first cooling zone and a second cooling zone,

the first cooling zone is closer than the second cooling zone to the plurality of heating zones, and

a number of the plurality of second holes in the first cooling zone is less than a number of the plurality of second holes in the second cooling zone.

18 . A substrate processing apparatus comprising:

a frame with an opening at a bottom of the frame, the frame including an internal space;

a first plate below the frame; and

a second plate below the first plate and completely spaced apart from the first plate,

wherein

the first plate includes a plurality of first holes, and a plurality of first dams surrounding the plurality of first holes and protruding toward the internal space,

the second plate includes a plurality of second holes, and a plurality of second dams surrounding the plurality of second holes and protruding toward the internal space,

the plurality of first holes are staggered with respect to the plurality of second holes in a vertical direction,

the second plate has a first region, and a second region outside the first region,

a first distance from the first region to the first plate is less than a second distance from the second region to the first plate,

the second plate further includes depressions configured to collect liquefied fumes, and

the substrate processing apparatus further includes a suction unit configured to remove the liquefied fumes collected in the depressions.