Laser processing device and method for adjusting focal position of laser beam using same

1 . A laser processing device comprising:

a laser oscillator that generates at least a laser beam;

a laser head that irradiates a workpiece with the laser beam; and

an articulated robot on which the laser head is mounted,

wherein the articulated robot includes

a robot arm,

an arm tip shaft that is rotatable about a predetermined axis and provided at a tip of the robot arm, and

a connector component that connects the arm tip shaft and the laser head,

the connector component has a gauge attachment portion to which a gauge is attached removably, and

the gauge is a pillar-shaped member having a reference point corresponding to a focal position of the laser beam, the reference point being formed on a surface of the gauge.

2 . The laser processing device according to claim 1 , wherein

the gauge has a plurality of recesses or protrusions, and

the plurality of recesses or protrusions have an intersection serving as the reference point.

3 . The laser processing device according to claim 1 , wherein

the connector component includes a first component and a second component,

the first component is attached to the arm tip shaft, and

the gauge attachment portion is provided to the first component.

4 . The laser processing device according to claim 3 , wherein the focal position of the laser beam is adjustable by adjusting a positional relationship between the first component and the second component included in the connector component.

5 . The laser processing device according to claim 1 , wherein

a center line formed on a surface of the gauge and extending in a longitudinal direction of the gauge is substantially in alignment with the predetermined axis in a configuration in which the gauge is attached to the gauge attachment portion, and

the reference point is provided on the center line.

6 . A method for adjusting a focal position of a laser beam using a laser processing device, the laser processing device including:

a laser oscillator that generates at least a laser beam;

a laser head that irradiates a workpiece with the laser beam; and

an articulated robot on which the laser head is mounted,

wherein the articulated robot includes

a robot arm,

an arm tip shaft that is rotatable about a predetermined axis and provided at a tip of the robot arm, and

a connector component that connects the arm tip shaft and the laser head,

the connector component has a gauge attachment portion to which a gauge is attached removably, and

the gauge has a reference point corresponding to a focal position of the laser beam,

a center line formed on a surface of the gauge and extending in a longitudinal direction of the gauge is substantially in alignment with the predetermined axis in a configuration in which the gauge is attached to the gauge attachment portion, and

the reference point is provided on the center line, the method comprising:

a first step of attaching the gauge to the connector component that is mounted on the arm tip shaft;

a second step of causing the laser head to emit a guide laser beam after the first step; and

a third step of determining whether a distance between a position irradiated with the guide laser beam on the gauge and the reference point is within a predetermined range while the second step is being performed,

wherein when a determination result in the third step is negative, a position of the laser head with respect to the arm tip shaft is adjusted, and a process goes back to the first step and a series of the first step to the third step is repeated until the determination result in the third step becomes positive.

7 . The laser processing device according to claim 1 , wherein the pillar-shaped member has a circular or polygonal cross section.

8 . The laser processing device according to claim 5 , wherein the pillar-shaped member comprises a cutout, and

the center line is a scribed line formed by scribing a surface of the cutout of the pillar-shaped member.