Bonding apparatus, bonding method and article manufacturing method
A bonding apparatus for bonding a second object to a first object, including a holding unit configured to hold a sheet with the second object stuck thereto, a protrusion mechanism configured to protrude the second object to a side of the first object via the sheet held by the holding unit, a measurement unit configured to measure, with respect to the first object, a position of the second object stuck to the sheet held by the holding unit, and a processing unit configured to perform a process of positioning the first object and the second object based on the position measured by the measurement unit in a state in which the second object is protruded to the side of the first object by the protrusion mechanism.
1 . A bonding apparatus for bonding a second object to a first object, comprising:
a holding unit configured to hold a sheet with the second object stuck thereto;
a protrusion mechanism including a protrusion unit and a separation unit, the protrusion unit being configured to move so as to protrude relative to the sheet in an area of the second object stuck thereby so as to move the second object to a side of the first object and come into contact with the first object, the separation unit being configured to separate the second object from the sheet in a state where the second object and the first object are bonded;
a measurement unit configured to measure, with respect to the first object, a position of the second object stuck to the sheet held by the holding unit in a state where the second object is moved to the side of the first object by the protrusion mechanism and the first object and the second object are spaced apart from each other; and
a processing unit configured to perform a process of positioning the first object and the second object based on the position measured by the measurement unit in the state where the first object and the second object are spaced apart from each other,
wherein the protrusion unit is configured to push an outer peripheral region of the second object to the side of the first object via the sheet, and
wherein the separation unit is configured to separate the second object from the sheet by selectively pushing, to the side of the first object, a plurality of regions in an inner region of the second object, which is inside the outer peripheral region, in the state where the second object and the first object are bonded.
2 . The apparatus according to claim 1 , wherein
the second object is stuck to the sheet via a surface opposite to a bonding surface of the second object with respect to a bonding target portion of the first object, and
the holding unit is configured to hold the sheet in a state in which the bonding target portion of the first object and the bonding surface of the second object face each other.
3 . The apparatus according to claim 2 , wherein
the processing unit is configured to perform the process such that a positional shift between the bonding target portion and the bonding surface is reduced.
4 . The apparatus according to claim 1 , wherein
the separation unit is configured to separate the second object from the sheet by changing a shape of the inner region pushed to the side of the first object in the state in which the second object and the first object are bonded.
5 . The apparatus according to claim 1 , wherein
the separation unit is configured to separate, from the sheet, the second object bonded to the first object by irradiating a sticking surface between the second object and the sheet with light.
6 . The apparatus according to claim 1 , wherein
the separation unit is configured to separate, from the sheet, the second object bonded to the first object by applying heat to a sticking surface between the second object and the sheet.
7 . The apparatus according to claim 1 , wherein
a plurality of second objects are stuck to the sheet, and
the apparatus further comprises a holding mechanism configured to hold, among the plurality of second objects stuck to the sheet, a non-target object excluding a target object to be moved to the side of the first object by the protrusion mechanism.
8 . The apparatus according to claim 4 , wherein
the holding mechanism is configured to hold the non-target object such that a clearance is formed between the target object and the non-target object.
9 . The apparatus according to claim 1 , further comprising
a position measurement device configured to measure a position of the first object,
wherein, in the process, the processing unit is configured to control the position of the first object with respect to the second object based on the position of the first object measured by the position measurement device.
10 . The apparatus according to claim 1 , wherein
the holding unit includes a driving unit configured to drive the sheet with respect to the protrusion mechanism in a plane orthogonal to a direction in which the second object is moved by the protrusion mechanism.
11 . The apparatus according to claim 1 , further comprising
a driving unit configured to drive the protrusion mechanism with respect to the sheet held by the holding unit in a plane orthogonal to a direction in which the second object is moved by the protrusion mechanism.
12 . The apparatus according to claim 1 , wherein
a process for bonding is performed on the bonding surface of the second object in a state in which the second object is stuck to the sheet via a surface opposite to a bonding surface of the second object with respect to a bonding target portion of the first object.
13 . The apparatus according to claim 12 , wherein
the process for bonding includes one of washing the bonding surface, applying an adhesive agent to the bonding surface, and activating the bonding surface.