Peeling system and peeling method for flexible fingerprint component

1 . A peeling system for a flexible fingerprint component, wherein the flexible fingerprint component is formed on a rigid substrate, the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially on the flexible substrate, a first chip-on film, on a first side of the optical film, bonded to the photosensitive device layer, and a second chip-on film, on a second side of the optical film, bonded to the photosensitive device layer; wherein the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is on a side opposite to the extension portion, and the first side of the optical film is on a side adjacent to the extension portion; and

the peeling system comprises:

a first vacuum adsorption platform, configured to adsorb and fix the rigid substrate;

a clamp, configured to clamp the extension portion; and

a control mechanism, configured to adjust an angle of a pulling force applied by the clamp to the extension portion to a peeling angle that is preset, and control the clamp to lift the extension portion at the peeling angle, so as to drive the flexible substrate to be peeled off from the rigid substrate according to a preset peeling speed;

wherein the clamp comprises a first clamping plate and a second clamping plate, the control mechanism comprises a first rotating shaft, a second rotating shaft, a first manipulator and a second manipulator, the first clamping plate is connected with the first manipulator through the first rotating shaft, and the second clamping plate is connected with the second manipulator through the second rotating shaft.

2 . The peeling system according to claim 1 , further comprising: an auxiliary peeling mechanism, wherein

the auxiliary peeling mechanism is configured to perform auxiliary peeling on the first chip-on film in a peeling direction at the peeling speed when peeling the flexible fingerprint component to a bonding zone of the first chip-on film.

3 . The peeling system according to claim 1 , further comprising: a first transmission mechanism, configured to place the rigid substrate bearing the flexible fingerprint component onto the first vacuum adsorption platform in an aligning mode.

4 . The peeling system according to claim 3 , further comprising: a second transmission mechanism and a second vacuum adsorption platform, wherein

the second transmission mechanism is configured to place the flexible fingerprint component on the second vacuum adsorption platform in an aligning mode, so as to adsorb and fix the flexible substrate through the second vacuum adsorption platform; and a vacuum adsorption hole of the second vacuum adsorption platform is smaller than a vacuum adsorption hole of the first vacuum adsorption platform.

5 . The peeling system according to claim 4 , further comprising: a cutting mechanism, configured to cut off the extension portion of the flexible fingerprint component on the second vacuum adsorption platform.

6 . The peeling system according to claim 1 , further comprising an ionizing air blower, configured to blow air to remove static electricity between the flexible substrate and the rigid substrate in a peeling process.

7 . A peeling method for a flexible fingerprint component, comprising:

providing a flexible fingerprint component formed on a rigid substrate, wherein the flexible fingerprint component is formed on the rigid substrate, the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially on the flexible substrate, a first chip-on film, on a first side of the optical film, bonded to the photosensitive device layer, and a second chip-on film, on a second side of the optical film, bonded to the photosensitive device layer, the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is on a side opposite to the extension portion, and the first side of the optical film is on a side adjacent to the extension portion;

adsorbing and fixing the rigid substrate by using a first vacuum adsorption platform;

clamping the extension portion by using a clamp; and

adjusting, by using a control mechanism, an angle of a pulling force applied by the clamp to the extension portion to a peeling angle that is preset, and controlling the clamp to lift the extension portion at the peeling angle, so as to drive the flexible substrate to be peeled off from the rigid substrate according to a preset peeling speed;

wherein the clamping the extension portion by using the clamp, and the adjusting, by using the control mechanism, the angle of the pulling force applied by the clamp to the extension portion to the peeling angle that is preset, and controlling the clamp to lift the extension portion at the peeling angle specifically comprise:

clamping the extension portion by a first clamping plate and a second clamping plate, and after adjusting, by a first manipulator and a second manipulator, the first clamping plate and the second clamping plate to rotate to the peeling angle respectively through a first rotating shaft and a second rotating shaft, maintaining the peeling angle by the first manipulator and the second manipulator, and continuing to control the first clamping plate and the second clamping plate to lift the extension portion at the peeling angle in a pulling force mode.

8 . The peeling method according to claim 7 , wherein the peeling angle is less than or equal to 30°, and a peeling speed is less than or equal to 5 mm/s.

9 . The peeling method according to claim 7 , further comprising: performing, by an auxiliary peeling mechanism, auxiliary peeling on the first chip-on film in a peeling direction at the peeling speed when peeling the flexible fingerprint component to a bonding zone of the first chip-on film.

10 . The peeling method according to claim 7 , after providing the flexible fingerprint component formed on the rigid substrate and before adsorbing and fixing the rigid substrate by using the first vacuum adsorption platform, further comprising:

placing, by a first transmission mechanism, the rigid substrate bearing the flexible fingerprint component onto the first vacuum adsorption platform in an aligning mode.

11 . The peeling method according to claim 10 , after peeling the flexible fingerprint component from the rigid substrate, further comprising:

placing, by a second transmission mechanism, the flexible fingerprint component on a second vacuum adsorption platform in an aligning mode, so as to adsorb and fix the flexible substrate through the second vacuum adsorption platform, a vacuum adsorption hole of the second vacuum adsorption platform being smaller than a vacuum adsorption hole of the first vacuum adsorption platform.

12 . The peeling method according to claim 11 , after adsorbing and fixing the flexible substrate through the second vacuum adsorption platform, further comprising:

cutting off, by a cutting mechanism, the extension portion of the flexible fingerprint component on the second vacuum adsorption platform.