IP Library Granted Patent US 12,679,087
Granted Patent B2
US 12,679,087 · App. 18/552,901 · Granted Jul 14, 2026

Liquid discharge head, discharge head structure, and recording device

Inventor: Daiki Furuzawa (Kirishima, JP)
Assignee: KYOCERA CORPORATION
B41J2/1408B41J2/175B41J2202/08
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,679,087
App. No.
18/552,901
Granted
Jul 14, 2026
Kind
B2
Abstract

A liquid discharge head includes a heat dissipation plate, a head body, a supply pipe, and a shielding portion. The heat dissipation plate is in contact with a heat generation source. The head body includes a discharge hole configured to discharge a liquid. The supply pipe supplies a liquid to the head body. The shielding portion is provided between the heat dissipation plate and the supply pipe and is separated from the heat dissipation plate and the supply pipe.

Claims (47)

1 . A liquid discharge head comprising:

a heat dissipation plate in contact with a heat generation source;

a head body comprising a discharge hole configured to discharge a liquid;

a supply pipe configured to supply the liquid to the head body; and

a shielding portion provided between the heat dissipation plate and the supply pipe and positioned away from an outer surface of the supply pipe.

2 . The liquid discharge head according to claim 1 , further comprising:

a recovery pipe configured to recover the liquid from the head body, wherein

the shielding portion is not located between the heat dissipation plate and the recovery pipe.

3 . The liquid discharge head according to claim 1 , wherein

the shielding portion is bent or curved in a plan view.

4 . The liquid discharge head according to claim 1 , wherein

an emissivity of the shielding portion is less than an emissivity of the heat dissipation plate.

5 . The liquid discharge head according to claim 1 , wherein

an emissivity of the shielding portion is greater on a heat dissipation plate side than on a supply pipe side.

6 . The liquid discharge head according to claim 1 , wherein

a height of the shielding portion from the head body is higher than a height of the heat dissipation plate from the head body.

7 . A discharge head structure comprising:

the liquid discharge head according to claim 1 ; and

a frame configured to fix the liquid discharge heat to the frame, wherein

the shielding portion is a part of the frame.

8 . The liquid discharge head according to claim 1 , wherein

the shielding portion is positioned away from the heat dissipation plate.

9 . The liquid discharge head according to claim 1 , wherein

the supply pipe is positioned away from the heat dissipation plate.

10 . The liquid discharge head according to claim 1 , wherein

an air layer is located between the outer surface of the supply pipe and an outer surface of the heat dissipation plate.

11 . A discharge head structure comprising:

a heat dissipation plate in contact with a heat generation source;

a head body comprising a discharge hole configured to discharge a liquid;

a supply pipe configured to supply the liquid to the head body; and

a box-shaped body provided between the heat dissipation plate and the supply pipe, the box-shaped body comprising a shielding portion positioned away from an outer surface of the supply pipe, the box-shaped body surrounding the heat dissipation plate.

12 . A recording device comprising:

the liquid discharge head structure according to claim 11 ; and

a transport portion configured to transport a recording medium to the discharge head structure.

13 . A recording device comprising:

the discharge head structure according to claim 11 ; and

an applicator configured to apply a coating agent to a recording medium.

14 . A recording device comprising:

the discharge head structure according to claim 11 ; and

the discharge head structure according to claim 11 ; and

a dryer configured to dry a recording medium.

15 . The liquid discharge head structure according to claim 11 , wherein

the shielding portion is positioned away from the heat dissipation plate.

16 . The liquid discharge head structure according to claim 11 , wherein

the supply pipe is positioned away from the heat dissipation plate.

17 . The liquid discharge head structure according to claim 11 , wherein

an air layer is located between the outer surface of the supply pipe and an outer surface of the heat dissipation plate.