IP Library Granted Patent US 12679668
Granted Patent B2
US 12679668 · App. 18/055,899 · Granted Jul 14, 2026

Substrate transfer device and substrate transfer method

Inventor: Takehiro Shindo (Yamanashi, JP)
Assignee: Tokyo Electron Limited
B65G47/90
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Quick Facts
Patent No.
US 12679668
App. No.
18/055,899
Granted
Jul 14, 2026
Kind
B2
Abstract

A substrate transfer device includes a tile-shaped section that includes a coil and a Hall element and that is provided in a transfer chamber, a transfer section that includes a permanent magnet and that is configured to move over the tile-shaped section to transfer a substrate, a temperature sensor configured to detect a temperature in the tile-shaped section, and a controller configured to estimate a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element. The temperature of the Hall element is determined based on the temperature detected by the temperature sensor.

Claims (25)

1 . A substrate transfer device comprising:

a planar motor including a plurality of tile-shaped sections, each of the tile-shaped sections including a coil and a Hall element, the planar motor being provided in a transfer chamber;

a transfer section including a permanent magnet, the transfer section being configured to move over the plurality of tile-shaped sections to transfer a substrate, the plurality of tile-shaped sections including a first tile-shaped section including an accuracy-required area where the transfer section delivers or receives the substrate in the transfer chamber and a second tile-shaped section not including the accuracy-required area;

a temperature sensor configured to detect a temperature in the first tile-shaped section; and

a controller configured to estimate a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element, the temperature of the Hall element being determined based on a temperature distribution of the first tile-shaped section estimated based on the temperature detected by the temperature sensor and an energizing quantity of the coil,

wherein the temperature sensor is provided in the first tile-shaped section, and

wherein the temperature sensor is in contact with the Hall element of the first tile-shaped section.

2 . The substrate transfer device as claimed in claim 1 ,

wherein the transfer chamber has the accuracy-required area where a position of the transfer section is aligned, and

wherein the temperature sensor detects the temperature in the accuracy-required area in the first tile-shaped section.

3 . The substrate transfer device as claimed in claim 1 , wherein the controller estimates a temperature distribution of the first tile-shaped section based on the temperature detected by the temperature sensor, and estimates a temperature of the Hall element based on the estimated temperature distribution.

4 . The substrate transfer device as claimed in claim 1 , wherein the temperature sensor is a thermocouple provided in the first tile-shaped section.

5 . A substrate transfer device comprising:

a planar motor including a plurality of tile-shaped sections, each of the tile-shaped sections including a coil and a Hall element, the planar motor being provided in a transfer chamber;

a transfer section including a permanent magnet, the transfer section being configured to move over the plurality of tile-shaped sections to transfer a substrate, the plurality of tile-shaped sections including a first tile-shaped section including an accuracy-required area where the transfer section delivers or receives the substrate in the transfer chamber and a second tile-shaped section not including the accuracy-required area; and

a controller configured to estimate a position of the transfer section and an orientation of the transfer section based on a detection value of the Hall element,

wherein the transfer chamber includes a position sensor configured to detect a position of the transfer section in the accuracy-required area, and a position alignment of the transfer section is performed in the accuracy-required area, and

wherein the position alignment of the transfer section is performed based on a difference between the estimated position of the transfer section and the detected position of the transfer section and a difference between the estimated orientation of the transfer section and the detected orientation of the transfer section.

6 . The substrate transfer device as claimed in claim 5 , wherein the position sensor is a laser displacement sensor.

7 . A substrate transfer method performed by a substrate transfer device including

a planar motor including a plurality of tile-shaped sections, each of the tile-shaped sections including a coil and a Hall element, the planar motor being provided in a transfer chamber,

a transfer section including a permanent magnet, the transfer section being configured to move over the plurality of tile-shaped sections to transfer a substrate, the plurality of tile-shaped sections including a first tile-shaped section including an accuracy-required area where the transfer section delivers or receives the substrate in the transfer chamber and a second tile-shaped section not including the accuracy-required area, and

a temperature sensor configured to detect a temperature in the first tile-shaped section and provided in the first tile-shaped section, and the temperature sensor being in contact with the Hall element of the first tile-shaped section, the substrate transfer method comprising:

estimating a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element, the temperature of the Hall element being determined based on a temperature distribution of the first tile-shaped section estimated based the temperature detected by the temperature sensor and an energizing quantity of the coil; and

aligning the transfer section based on the estimated position.