IP Library › Granted Patent US 12679720
Granted Patent B2
US 12679720 · App. 18/701,569 · Granted Jul 14, 2026

Micro-electromechanical system (MEMS) structure and mems microphone comprising same

Inventors: Genlan Rong (Suzhou, CN); Kai Sun (Suzhou, CN); Yanzi Meng (Suzhou, CN); Wei Hu (Suzhou, CN)
Assignee: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.
B81B7/0022H04R19/005H04R19/04B81B2201/0257B81B2203/0127B81B2203/0315B81B2203/0338B81B2203/0353B81B2203/0361H04R2201/003
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Quick Facts
Patent No.
US 12679720
App. No.
18/701,569
Granted
Jul 14, 2026
Kind
B2
Abstract

Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

Claims (44)

1 . A micro-electromechanical system structure, wherein the micro-electromechanical system structure comprises:

a back plate;

a diaphragm, the diaphragm is located on one side of the back plate, wherein the diaphragm and the back plate form a variable capacitor, the diaphragm comprises a plurality of first through holes and one or more air release structures corresponding to the first through holes;

wherein the diaphragm further comprises one or more second through holes penetrating through the diaphragm;

wherein the second through hole is located at a center of the diaphragm and serves as a main air release channel; the first through hole is located around the diaphragm and serves as an auxiliary air release channel, wherein a gap is existed between the air release structure and the first through hole; and the air release structure is configured to deform based on external sound pressure to expand the gap between the air release structure and the first through hole.

2 . The micro-electromechanical system structure according to claim 1 , wherein the micro-electromechanical system structure further comprises a plurality of connecting pillars, one end of the connecting pillar is fixedly connected to the back plate, and the other end of the connecting pillar is connected to the air release structure, wherein the air release structure is separated from the diaphragm, and the gap between the air release structure and the first through hole is configured to facilitate gas flow.

3 . The micro-electromechanical system structure according to claim 2 , wherein the connecting pillar comprises a supporting pillar and a side part, the side part is set around the supporting pillar, wherein the supporting pillar is set corresponding to one of the air release structures, one end of the supporting pillar is fixedly connected to the back plate, and the other end of the supporting pillar is fixedly connected to the air release structure, one end of the side part is fixedly connected to the air release structure, and the other end of the side part is fixedly connected to the back plate;

wherein an inner surface of the side part is in contact with an outer surface of the corresponding supporting pillar.

4 . The micro-electromechanical system structure according to claim 2 , wherein the connecting pillar comprises a bottom part and a side part, the bottom part is fixedly connected to the back plate, the side part is set around the bottom part, and the side part is connected to the bottom part, the bottom part and the side part form a cavity.

5 . The micro-electromechanical system structure according to claim 1 , wherein a plurality of sound inlet holes are set on the back plate, the sound inlet hole is set corresponding to the first through hole;

the projection of the first through hole partly overlaps with the projection of the corresponding sound inlet hole on a plane perpendicular to the thickness direction of the diaphragm.

6 . The micro-electromechanical system structure according to claim 5 , wherein the first through hole is shaped as a polygon, the projection of one part of a ring-shaped edge area of the polygon overlaps with the projection of the back plate on a plane perpendicular to the thickness direction of the diaphragm, the projection of the other part of the edge area overlaps with the projection of the sound inlet hole.

7 . The micro-electromechanical system structure according to claim 1 , wherein the shape of the air release structure comprises cylinder or prism, the shape of the air release structure matches with the shape of the first through hole.

8 . The micro-electromechanical system structure according to claim 7 , wherein the air release structure comprises at least one groove and/or at least one air release groove, the at least one groove extends radially inward from the cylindrical surface of the air release structure, and the at least one groove penetrates through the top surface and the bottom surface of the air release structure;

the at least one air release groove penetrates through the top surface and the bottom surface of the air release structure.

9 . The micro-electromechanical system structure according to claim 1 , wherein the micro-electromechanical system structure further comprises:

a substrate, the substrate comprises a back cavity penetrating through the substrate;

a first supporting structure, the first supporting structure is located between the diaphragm and the substrate;

a second supporting structure, the second supporting structure is located between the back plate and the diaphragm.

10 . The micro-electromechanical system structure according to claim 1 , wherein the micro-electromechanical system structure further comprises:

a substrate, the substrate comprises a back cavity penetrating through the substrate;

a first supporting structure, the first supporting structure is located between the back plate and the substrate;

a second supporting structure, the second supporting structure is located between the diaphragm and the back plate.

11 . The micro-electromechanical system structure according to claim 1 , wherein the back plate comprises a first back plate and a second back plate, the diaphragm is located between the first back plate and the second back plate.

12 . The micro-electromechanical system structure according to claim 11 , wherein the micro-electromechanical system structure further comprises:

a substrate, the substrate comprises a back cavity penetrating through the substrate;

a third supporting structure, the third supporting structure is located between the substrate and the second back plate;

a first supporting structure, the first supporting structure is located between the diaphragm and the second back plate;

a second supporting structure, the second supporting structure is located between the first back plate and the diaphragm.

13 . The micro-electromechanical system structure according to claim 11 , wherein the first back plate and the second back plate respectively comprises sound inlet holes.

14 . The micro-electromechanical system structure according to claim 1 , wherein the diaphragm comprises a first diaphragm and a second diaphragm, the back plate is located between the first diaphragm and the second diaphragm.

15 . The micro-electromechanical system structure according to claim 14 , wherein the micro-electromechanical system structure further comprises:

a substrate, the substrate comprises a back cavity penetrating through the substrate;

a third supporting structure, the third supporting structure is located between the substrate and the first diaphragm;

a first supporting structure, the first supporting structure is located between the first diaphragm and the back plate;

a second supporting structure, the second supporting structure is located between the back plate and the second diaphragm.

16 . The micro-electromechanical system structure according to claim 1 , wherein the second through hole is distributed within a circular area, the center of the circular area is the center of the diaphragm, and the radius of the circular area is half the distance from the center to the edge of the diaphragm.

17 . The micro-electromechanical system structure according to claim 1 , wherein the shape of the first through hole and the shape of the second through hole are both circle or polygon.

18 . The micro-electromechanical system structure according to claim 17 , wherein the first through hole is located in the surrounding area of the diaphragm.

19 . A MEMS microphone, wherein the MEMS microphone comprises a micro-electromechanical system structure, comprising:

a back plate;

a diaphragm, the diaphragm is located on one side of the back plate, wherein the diaphragm and the back plate form a variable capacitor, the diaphragm comprises a plurality of first through holes and one or more air release structures corresponding to the first through holes;

wherein the diaphragm further comprises one or more second through holes penetrating through the diaphragm;

wherein the second through hole is located at a center of the diaphragm and serves as a main air release channel; the first through hole is located around the diaphragm and serves as an auxiliary air release channel, wherein a gap is existed between the air release structure and the first through hole; and the air release structure is configured to deform based on external sound pressure to expand the gap between the air release structure and the first through hole.