IP Library Granted Patent US 12679721
Granted Patent B2
US 12679721 · App. 18/464,876 · Granted Jul 14, 2026

Micromechanical device comprising a hydrogen drainage layer

Inventors: Johannes Boy (Moessingen, DE); Leo Rizzi (Reutlingen, DE)
Assignee: ROBERT BOSCH GMBH
B81B7/0038B81B2203/0315B81B2207/012
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Quick Facts
Patent No.
US 12679721
App. No.
18/464,876
Granted
Jul 14, 2026
Kind
B2
Abstract

A micromechanical device. The device includes a MEMS chip which comprises a cavity; an IC chip which includes an IC substrate and at least one IC functional layer, wherein the IC chip is connected to the MEMS chip such that the IC functional layer is disposed between the IC substrate and the cavity. The IC chip includes a hydrogen drainage layer which is disposed between the IC functional layer and the cavity.

Claims (8)

1 . A micromechanical device, comprising:

a MEMS chip which includes a cavity;

an IC chip which includes an IC substrate and at least one IC functional layer, wherein the IC chip is connected to the MEMS chip such that the IC functional layer is disposed between the IC substrate and the cavity;

wherein the IC chip includes a hydrogen drainage layer which is disposed between the IC functional layer and the cavity, and wherein the hydrogen drainage layer is configured to discharge hydrogen to outside the device.

2 . The micromechanical device according to claim 1 , wherein the IC chip includes a hydrogen barrier layer which is disposed between the hydrogen drainage layer and the cavity.

3 . The micromechanical device according to claim 1 , further comprising:

at least one sealing ring which is made of metal and seals an inner region of the IC functional layer against an outer region, the at least one sealing ring being disposed at least in the IC functional layer.

4 . The micromechanical device according to claim 3 , wherein the sealing ring extends through the hydrogen drainage layer and includes perforations in the hydrogen drainage layer.