Resin composition, resin cured product, and fiber reinforced resin
Provided are a resin composition, a resin cured product, and a fiber reinforced resin capable of shortening a stress relaxation time. In order to solve this problem, the resin composition contains an epoxy compound having two or more epoxy groups in a molecule, an acid anhydride, and a complex in which an organic ligand is coordinated to manganese (III). The resin cured product contains a resin having an ester group and a hydroxy group, and a complex in which an organic ligand is coordinated to manganese (III). A fiber reinforced resin 101 contains a resin 1 having an ester group and a hydroxy group, fibers 2 impregnated with at least the resin, and a complex 3 in which an organic ligand is coordinated to manganese (III).
1 . A resin composition comprising:
an epoxy compound having two or more epoxy groups in a molecule;
an acid anhydride including at least one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and derivatives thereof; and
a complex in which an organic ligand is coordinated to manganese (III), the complex contains at least one of manganese (III) acetylacetonate, manganese (III) acetate, and manganese (III) naphthenate,
wherein a content of the complex is 15 mol % or more and 30 mol % or less relative to the epoxy groups, and
wherein a content of the acid anhydride is 40 mol % or more and 70 mol % or less relative to the epoxy groups.
2 . The resin composition according to claim 1 , wherein
the epoxy compound is bisphenol A diglycidyl ether or an epoxy novolac resin.
3 . A resin cured product comprising:
a resin having an ester group and a hydroxy group obtained by a reaction between an epoxy compound having two or more epoxy groups in a molecule and an acid anhydride including at least one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and derivatives thereof, wherein a content of the acid anhydride is 40 mol % or more and 70 mol % or less relative to the epoxy groups; and
a complex in which an organic ligand is coordinated to manganese (III), wherein the complex contains at least one of manganese (III) acetylacetonate, manganese (III) acetate, and manganese (III) naphthenate,
wherein a content of the complex is 15 mol % or more and 30 mol % or less relative to the hydroxy group.
4 . The resin cured product according to claim 3 , wherein
when a time during which, based on a stress applied to a test piece containing the resin and the complex, a stress remaining in the test piece decreases to 30% of the applied stress is defined as a stress relaxation time,
the stress relaxation time is 11 min or shorter.
5 . The resin cured product according to claim 4 , wherein
the stress relaxation time is 9 min or shorter.
6 . A fiber reinforced resin comprising:
a resin having an ester group and a hydroxy group obtained by a reaction between an epoxy compound having two or more epoxy groups in a molecule and an acid anhydride including at least one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and derivatives thereof, wherein a content of the acid anhydride is 40 mol % or more and 70 mol % or less relative to the epoxy groups;
a fiber impregnated with at least the resin; and
a complex in which an organic ligand is coordinated to manganese (III), wherein the complex contains at least one of manganese (III) acetylacetonate, manganese (III) acetate, and manganese (III) naphthenate,
wherein a content of the complex is 15 mol % or more and 30 mol % or less relative to the hydroxy group.
7 . The fiber reinforced resin according to claim 6 , wherein
the fiber includes at least one of aramid fibers, glass fibers, and carbon fibers.
8 . The resin composition according to claim 1 , wherein a content of the complex is 25 mol % or more and 30 mol % or less relative to the epoxy groups.
9 . The resin cured product according to claim 3 , wherein a content of the complex is 25 mol % or more and 30 mol % or less relative to the epoxy groups.
10 . The fiber reinforced resin according to claim 6 , wherein a content of the complex is 25 mol % or more and 30 mol % or less relative to the epoxy groups.