Adhesion promoter compositions to eliminate substrate preparation and methods for the same

1 . An adhesion promoter composition, comprising:

a first reactive silane compound;

a second reactive silane compound, wherein the second reactive silane compound is different from the first reactive silane compound;

one or more organic solvents; and

an organic base; and wherein:

the first reactive silane compound is present in an amount of from about 0.1% to about 2.0% by total weight of the adhesion promoter composition; and

the second reactive silane compound is present in an amount of from about 0.1% to about 10.0% by total weight of the adhesion promoter composition;

the organic base comprises phosphazene or 1-methylimidazole and is present in an amount of from about 0.75% to about 1.5% by total weight of the adhesion promoter composition; and

the adhesion promoter composition is substantially free of photoinitiators and is substantially free of reactive titanate, reactive zirconate, or reactive aluminates.

2 . The adhesion promoter composition of claim 1 , wherein the first reactive silane compound comprises an epoxy functional group, a mercapto functional group, an amino functional group, an acrylate functional group, an isocyanate functional group, or a combination thereof.

3 . The adhesion promoter composition of claim 2 , wherein the first reactive silane compound comprises glycidoxypropyltrimethoxysilane.

4 . The adhesion promoter composition of claim 1 , wherein the second reactive silane compound comprises mercaptopropyltrimethoxysilane.

5 . The adhesion promoter composition of claim 1 , wherein the organic base further comprises histidine, pyridine, alkanamine, aniline, benzimidazole, quinoline, or a combination thereof.

6 . The adhesion promoter composition of claim 1 , wherein the organic base further comprises imidazole.

7 . The adhesion promoter composition of claim 1 , wherein:

the first reactive silane compound comprises glycidoxypropyltrimethoxy silane;

the second reactive silane compound comprises mercaptopropyltrimethoxysilane; and

the one or more organic solvents comprises methyl ethyl ketone (MEK), methyl propyl ketone (MPK), methyl isobutyl ketone (MIBK), acetone, or combinations thereof.

8 . The adhesion promoter composition of claim 1 , wherein the organic base comprises phosphazene.

9 . The adhesion promoter composition of claim 1 , wherein the first reactive silane compound comprises a mercapto functional group.

10 . An adhesion promoter composition, comprising:

a first reactive silane compound comprising an epoxy functional group, a mercapto functional group, an amino functional group, an acrylate functional group, an isocyanate functional group, or a combination thereof;

a second reactive silane compound comprising an epoxy functional group, a mercapto functional group, an amino functional group, an acrylate functional group, an isocyanate functional group, or a combination thereof; and

wherein the second reactive silane is different from the first;

one or more organic solvents; and

an organic base; and wherein:

the first reactive silane compound is present in an amount of from about 0.1% to about 2.0% by total weight of the adhesion promoter composition;

the second reactive silane compound is present in an amount of from about 0.1% to about 10.0% by total weight of the adhesion promoter composition;

the organic base comprises phosphazene or 1-methylimidazole and is present in an amount of from about 0.75% to about 1.5% by total weight of the adhesion promoter composition; and

the adhesion promoter composition is substantially free of photoinitiators and is substantially free of reactive titanate, reactive zirconate, or reactive aluminates.

11 . The adhesion promoter composition of claim 10 , wherein the first reactive silane compound comprises glycidoxypropyltrimethoxysilane.

12 . The adhesion promoter composition of claim 10 , wherein the second reactive silane compound comprises mercaptopropyltrimethoxysilane.

13 . The adhesion promoter composition of claim 10 , wherein:

the first reactive silane compound comprises glycidoxypropyltrimethoxysilane;

the second reactive silane compound comprises mercaptopropyltrimethoxysilane;

the one or more organic solvents comprises methyl ethyl ketone (MEK), methyl propyl ketone (MPK), methyl isobutyl ketone (MIBK), acetone, or combinations thereof; and

the organic base further comprises aniline.

14 . A method for applying an adhesion promoter composition, comprising:

contacting a first reactive silane compound comprising glycidoxypropyltrimethoxysilane, a second reactive silane compound comprising mercaptopropyltrimethoxysilane, and one or more organic solvents comprising methyl ethyl ketone (MEK), methyl propyl ketone (MPK), methyl isobutyl ketone (MIBK), acetone, or combinations thereof, to prepare a first part of the adhesion promoter composition;

contacting an organic base with the first part of the adhesion promoter composition;

combining the first part of the adhesion promoter composition with the organic base;

applying the adhesion promoter composition to a substrate; and

applying a polymer formulation layer over the adhesion promoter composition; and wherein:

the first reactive silane compound is present in an amount of from about 0.1% to about 2.0% by total weight of the adhesion promoter composition; and

the second reactive silane compound is present in an amount of from about 0.1% to about 10.0% by total weight of the adhesion promoter composition;

the organic base comprises phosphazene or 1-methylimidazole and is present in an amount of from about 0.75% to about 1.5% by total weight of the adhesion promoter composition; and

the adhesion promoter composition is substantially free of photoinitiators and is substantially free of reactive titanate, reactive zirconate, or reactive aluminates.

15 . The method of claim 14 , further comprising pausing after applying the adhesion promoter composition to the substrate to allow the adhesion promoter time to react with the substrate, the organic solvents to evaporate from the adhesion promoter composition, or a combination thereof.

16 . The method of claim 14 , wherein the substrate is a carbon fiber composite substrate.

17 . The method of claim 14 , wherein the polymer formulation layer comprises an epoxy-based polymer formulation, a polyurethane-based polymer formulation, a polysulfide-based polymer formulation, or a combination thereof.

18 . The method of claim 14 , further comprising no mechanical processing of the substrate.

19 . The method of claim 14 , wherein a shelf life of the first part of the adhesion promoter composition prior to combining the first part of the adhesion promoter composition with the organic base is from about 1 day to about 730 days when stored at or below a temperature of 25° C.

20 . The method of claim 14 , wherein a shelf life of the adhesion promoter composition after combining the first part of the adhesion promoter composition with the organic base is from about 0.5 days to about 14 days when stored at or below a temperature of 25° C.