IP Library Granted Patent US 12679985
Granted Patent B2
US 12679985 · App. 18/598,227 · Granted Jul 14, 2026

Resin composition, aqueous ink for ink jet recording, ink jet recording device, and ink jet recording method

Inventors: Keisuke Yuhara (Nagoya, JP); Hiroyuki Tanaka (Inazawa, JP); Makito Iguchi (Nagoya, JP)
Assignee: BROTHER KOGYO KABUSHIKI KAISHA
C09D11/322C09D11/033
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12679985
App. No.
18/598,227
Granted
Jul 14, 2026
Kind
B2
Abstract

A resin composition includes: resin particles including a resin; water; a first solvent having a boiling point of less than 250° C.; and a second solvent having a boiling point of 250° C. or more. A relative energy difference (RED), R a /R 0 , in the Hansen solubility parameter (HSP) system between the second solvent and the resin is 3 or less. R a is an HSP distance between the second solvent and the resin. R 0 is a radius of a Hansen sphere of the resin. The Hansen sphere is determined so as to include coordinates of solvents having a boiling point of 250° C. or more in which the resin is dissolvable. A mass ratio of the second solvent to a solid component the resin particles in the resin composition is 0.7 to 2.3.

Claims (35)

1 . A resin composition comprising:

resin particles comprising a resin;

water;

a first solvent having a boiling point of less than 250° C.; and

a second solvent having a boiling point of 250° C. or more,

wherein:

a relative energy difference (RED), R a /R 0 , in the Hansen solubility parameter (HSP) system between the second solvent and the resin is 3 or less;

R a is an HSP distance between the second solvent and the resin;

R 0 is a radius of a Hansen sphere of the resin, the Hansen sphere being determined so as to include coordinates of solvents having a boiling point of 250° C. or more in which the resin is dissolvable;

a mass ratio of the second solvent to a solid component of the resin particles in the resin composition is 0.7 to 2.3; and

an amount of the second solvent in the resin composition relative to a total mass of the resin composition is 7% by mass or more.

2 . The resin composition according to claim 1 ,

wherein a mass ratio of the second solvent to the first solvent in the resin composition is 0.3 to 3.0.

3 . The resin composition according to claim 2 ,

wherein mass ratio of the second solvent to the solid component of the resin particles in the resin composition is 0.9 to 2.0, and

wherein a total amount the first solvent and the second solvent in the resin composition relative to the total mass of the resin composition is 30% by mass or less.

4 . An aqueous ink for ink jet recording, comprising:

the resin composition according to claim 1 ; and

a pigment.

5 . An ink jet recording device comprising:

the resin composition according to claim 1 ;

a flow path through which the resin composition flows; and

an applying unit connecting to the flow path and configured to apply the resin composition onto an object for recording.

6 . An ink jet recording device comprising:

the aqueous ink according to claim 4 ;

a flow path through which the aqueous ink flows; and

an applying unit connecting to the flow path and configured to apply the aqueous ink onto an object for recording.

7 . An ink jet recording method comprising:

applying the resin composition according to claim 1 onto a recording medium by an ink jet method.

8 . An ink jet recording method comprising:

applying the aqueous ink according to claim 4 onto a recording medium by an ink jet method.

9 . The ink jet recording method according to claim 7 , further comprising:

heating a portion of the recording medium on which the resin composition is applied at a temperature of 90° C. or more to dry the portion.

10 . The ink jet recording method according to claim 8 , further comprising:

heating a portion of the recording medium on which the resin composition is applied at a temperature of 90° C. or more to dry the portion.