IP Library Granted Patent US 12680005
Granted Patent B2
US 12680005 · App. 18/279,058 · Granted Jul 14, 2026

Co-modified organopolysiloxane and curable organopolysiloxane composition including same

Inventors: Yuki Yokouchi (Ichihara, JP); Tomohiro Iimura (Ichihara, JP); Tadashi Okawa (Ichihara, JP)
Assignee: DOW TORAY CO., LTD.
C09J7/38C08G77/08C08G77/12C08G77/20C08G77/38C09J5/06C08G77/70C09J2301/302C09J2301/414C09J2301/416C09J2483/00
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Quick Facts
Patent No.
US 12680005
App. No.
18/279,058
Granted
Jul 14, 2026
Kind
B2
Abstract

Provided is an organopolysiloxane compound serving as a raw material of an organopolysiloxane pressure-sensitive adhesive which has necessary and sufficient pressure-sensitive adhesive strength in a step such as temporary fixing or the like and can be easily peeled off from a substrate in a subsequent step; an organopolysiloxane pressure-sensitive adhesive composition containing the same; and a method for using the same. A chain co-modified organopolysiloxane containing a silicon-bonded functional group (R A ) that contains a specific (meth)acrylic group and at least one aliphatic unsaturated carbon-carbon bond (R Vi ) (but excluding the functional group serving as R A above); a curable organopolysiloxane composition containing the same, further containing a crosslinking agent, a hydrosilylation reaction catalyst, and a photo-radical polymerization initiator, and having both heat curability and photo-curability.

Claims (33)

1 . A chain co-modified organopolysiloxane, comprising in a molecule:

a silicon-bonded functional group (R A ) containing an acrylic group or methacrylic group, as expressed by the following General Formula (1-1); and

a silicon-bonded functional group (R Vi ) containing at least one aliphatic unsaturated carbon-carbon bond, but excluding the functional group serving as R A above;

where R 1 mutually independently represents a hydrogen atom, a methyl group, or a phenyl group; R 2 mutually independently represents an alkyl group or an aryl group; Z 1 represents —O(CH 2 ) m — where m is a number within a range of 0 to 3; and Z 2 represents a divalent organic group expressed by —(CH 2 ) n — where n is a number within a range of 2 to 10, bonded to a silicon atom configuring a main chain of a polysiloxane represented by *.

2 . The co-modified organopolysiloxane according to claim 1 , wherein the functional group (R Vi ) is an alkenyl group having 2 to 20 carbon atoms.

3 . The co-modified organopolysiloxane according to claim 1 , wherein the functional group (R Vi ) is a hexenyl group.

4 . The co-modified organopolysiloxane according to claim 1 , wherein two or more of the functional groups (R Vi ) are provided in a molecule.

5 . The co-modified organopolysiloxane according to claim 1 , wherein m is a number within a range of 1 to 3 and n is a number within a range of 3 to 6.

6 . The co-modified organopolysiloxane according to claim 1 , comprising in a molecule the silicon-bonded functional group (R A ) containing an acrylic group or methacrylic group per mol of the silicon-bonded functional group (RV 1 ) containing at least one aliphatic unsaturated carbon-carbon bond but excluding the functional group serving as R A above, in a range at which the average amount thereof is 2.0 to 50.0 mols.

7 . The co-modified organopolysiloxane according to claim 1 , wherein in a molecule, the amount of the silicon-bonded functional group (R A ) containing an acrylic group or methacrylic group is within a range of 0.10 to 10.0 mol % with respect to all functional groups bonded to a silicon atom configuring a polysiloxane molecule.

8 . The co-modified organopolysiloxane according to claim 1 , wherein the main chain of the polysiloxane is a straight chain.

9 . A curable organopolysiloxane composition, comprising:

(A) 100 parts by mass of the co-modified organopolysiloxane according to claims 1 ;

(B) 0.1 to 5 parts by mass of an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule;

(C) a hydrosilylation reaction catalyst in an amount at which the amount of a platinum-based metal in the catalyst is 0.01 to 1000 pm; and

(D) 0.1 to 20 parts by mass of a photo-radical polymerization initiator.

10 . The curable organopolysiloxane composition according to claim 9 , further comprising:

(E) 0.5 to 150 parts by mass of an organopolysiloxane resin containing a siloxane unit (M unit) expressed by R 3 SiO 1/2 where R mutually independently represents a monovalent organic group and a siloxane unit (Q unit) expressed by SiO 4/2, such that the ratio of the M unit to the Q unit is within a range of 0.5 to 2.0.

11 . The curable organopolysiloxane composition according to claim 9 , further comprising:

(F) a polydimethylsiloxane which may optionally have an alkenyl group.

12 . The curable organopolysiloxane composition according to claim 9 , having both heat curability and photo-curability by irradiation with a high energy beam.

13 . The curable organopolysiloxane composition according to claim 9 , wherein when an organopolysiloxane semi-cured product obtained by a heat curing reaction of the curable organopolysiloxane composition is closely adhered to another substrate, the pressure-sensitive adhesive strength to the substrate decreases by 50% or more before and after a photo-curing reaction by irradiation with a high energy beam.

14 . An organopolysiloxane pressure-sensitive adhesive composition, comprising the co-modified organopolysiloxane according to claim 1 .

15 . An organopolysiloxane pressure-sensitive adhesive layer obtained by curing or semi-curing the curable organopolysiloxane composition according to claim 9 .

16 . A method for using the organopolysiloxane pressure-sensitive adhesive composition, comprising:

(I): a step of applying the organopolysiloxane pressure-sensitive adhesive composition according to claim 14 on a substrate;

(II): a step of semi-curing the organopolysiloxane pressure-sensitive adhesive composition applied in step (I) by a heat curing reaction; and

(III): a step of irradiating a semi-cured product obtained in step (II) with a high energy beam to further cure the semi-cured product by a photo-curing reaction;

wherein the pressure-sensitive adhesive strength of the semi-cured product obtained in step (II) to another substrate is reduced by the irradiation with the high energy beam in step (III).

17 . The curable organopolysiloxane composition according to claim 9 , further comprising:

(G) an organic solvent.

18 . The co-modified organopolysiloxane according to claim 1 , wherein the functional groups (R Vi ) are pendant functional groups.

19 . The co-modified organopolysiloxane according to claim 18 , wherein the functional groups (R A ) are pendant functional groups.