Method of forming holes from both sides of substrate
Methods and apparatus for forming holes through a substrate are provided herein. In some embodiments, a method of forming holes in a substrate for use in a process chamber includes: partially forming the plurality of holes in a substrate using a first drill to form a plurality of rough holes through the substrate from a first side of the substrate to an opposite second side of the substrate; positioning the substrate between a second drill and a third drill; using the second drill to finish the plurality of rough holes from the first side of the substrate to a first location at least halfway along the length of each hole of the plurality of rough holes; and using the third drill to finish the plurality of rough holes from the second side of the substrate to at least the first location along the length of each hole of the plurality of rough holes.
1 . A method of forming holes in a substrate for use in a process chamber, comprising:
mounting the substrate on a substrate support in a first position;
while in the first position, forming a plurality of rough holes through the substrate to a first size using a first drill powered by a first power source;
rotating the substrate by about 45 degrees to about 135 degrees to a second position along an elongate axis of the substrate orthogonal to a central axis of the substrate that is substantially parallel to the plurality of rough holes; and
while in the second position, finishing a first set of the plurality of rough holes from a first side of the substrate to a second size using a second drill powered by a second power source different than the first power source while finishing a second set of the plurality of rough holes different than the first set of the plurality of rough holes from a second side of the substrate opposite the first side to the second size using a third drill powered by a third power source different than the first power source and the second power source, wherein the second drill and the third drill are configured to form holes having a reduced roughness or increased concentricity than the holes formed by the first drill.
2 . The method of claim 1 , further comprising moving the second drill after forming the first set of the plurality of rough holes and form a third set of the plurality of rough holes different than the first set of the plurality of rough holes.
3 . The method of claim 2 , wherein finishing the first set of the plurality of rough holes using the second drill is done simultaneously with finishing of the second set of the plurality of rough holes using the third drill.
4 . The method of claim 1 , wherein the first drill, the second drill, and the third drill are laser drills.
5 . The method of claim 1 , wherein the first drill, the second drill, and the third drill are laser drills, rotary drills, water drills, or sonic drills.
6 . The method of claim 1 , wherein finishing the first set and the second set of the plurality of rough holes comprises at least one of reducing a roughness of the plurality of rough holes, increasing a roundness of the plurality of rough holes, increasing a diameter of the plurality of rough holes, or making the plurality of rough holes more uniform in diameter with respect to each other.
7 . The method of claim 1 , further comprising rotating the substrate about a central axis of the substrate while forming the plurality of rough holes using the first drill.
8 . The method of claim 1 , wherein forming the plurality of rough holes through the substrate using the first drill comprises forming the first set of the plurality of rough holes and then moving the first drill to form the second set of the plurality of rough holes.
9 . The method of claim 1 , wherein the first drill and the second drill are capable of operating simultaneously.
10 . The method of claim 1 , wherein a concentricity of the finished first set and second set of the plurality of rough holes is up to about 15% more concentric than a concentricity of the plurality of rough holes.
11 . The method of claim 1 , wherein sidewalls of the finished first set and second set of the plurality of rough holes are more perpendicular with respect to the first side or the second side of the substrate than the plurality of rough holes.
12 . The method of claim 1 , wherein the holes of the finished first set of the plurality of rough holes have a substantially constant diameter from the first side to the second side of the substrate.