Substrate liquid processing method and substrate liquid processing apparatus
A technique of improving an adhesion between a metal precipitated in a recess of a substrate and a surface partitioning the recess in an electroless plating processing in which a plated metal is deposited from the bottom of the recess is provided. A substrate liquid processing method includes preparing a substrate including a recess and a wiring exposed at a bottom of the recess; forming a self-assembled monolayer on a side wall of the recess; attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer; and burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into close contact with the intermolecular binder.
1 . A substrate liquid processing method, comprising:
preparing a substrate including a recess and a wiring exposed at a bottom of the recess;
forming a self-assembled monolayer on a side wall of the recess;
attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer;
burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into contact with the intermolecular binder;
heating the self-assembled monolayer on the side wall of the recess at a first temperature before attaching the intermolecular binder to the self-assembled monolayer;
removing a part of the self-assembled monolayer from the side wall of the recess after heating the self-assembled monolayer at the first temperature and before attaching the intermolecular binder to the self-assembled monolayer; and
heating the self-assembled monolayer on the side wall of the recess at a second temperature, which is higher than the first temperature, after removing the part of the self-assembled monolayer from the side wall of the recess and before attaching the intermolecular binder to the self-assembled monolayer,
wherein the first temperature promotes bonding between the side wall of the recess and the self-assembled monolayer while suppressing completion of a curing reaction throughout the self-assembled monolayer, and
wherein the second temperature increases reactivity of the self-assembled monolayer to the intermolecular binder while suppressing completion of a curing reaction throughout the self-assembled monolayer.
2 . The substrate liquid processing method of claim 1 ,
wherein the self-assembled monolayer is formed on the side wall of the recess that is formed of a silicon-containing material.
3 . The substrate liquid processing method of claim 1 ,
wherein the self-assembled monolayer contains an organic compound having a silanol group.
4 . The substrate liquid processing method of claim 1 ,
wherein the intermolecular binder contains an organic compound having at least one of an amino group or a thiol group.
5 . The substrate liquid processing method of claim 1 , further comprising:
heating the intermolecular binder attached to the self-assembled monolayer before supplying the electroless plating solution to the recess.
6 . The substrate liquid processing method of claim 1 , further comprising:
heating the intermolecular binder attached to the self-assembled monolayer at a third temperature before supplying the electroless plating solution to the recess;
removing a part of the intermolecular binder from the self-assembled monolayer after heating the intermolecular binder at the third temperature and before supplying the electroless plating solution to the recess; and
heating the intermolecular binder at a fourth temperature, which is higher than the third temperature, after removing the part of the intermolecular binder from the self-assembled monolayer and before supplying the electroless plating solution to the recess.