Organic solid crystal encapsulation
A structure includes an organic solid crystal and an encapsulation layer disposed over at least one surface of the organic solid crystal. The encapsulation layer is configured to inhibit mechanical and chemical degradation of the organic solid crystal and may include an organic or inorganic compound, such as silicon dioxide.
1 . A structure comprising:
an organic solid crystal layer; and
an encapsulation layer disposed over top, bottom, and sidewall surfaces of the organic solid crystal layer, wherein a thickness of the encapsulation layer ranges from approximately 100 nm to approximately 1 mm.
2 . The structure of claim 1 , wherein the organic solid crystal layer comprises a hydrocarbon selected from the group consisting of anthracene, phenanthrene, tolane, thiophene, pyrene, corannulene, fluorene, biphenyl, and ter-phenyl.
3 . The structure of claim 1 , wherein the organic solid crystal layer comprises a single crystal layer.
4 . The structure of claim 1 , wherein the organic solid crystal layer comprises a polycrystalline layer.
5 . The structure of claim 1 , wherein the organic solid crystal layer is configured as a thin film.
6 . The structure of claim 1 , wherein the encapsulation layer comprises a polymer.
7 . The structure of claim 1 , wherein the encapsulation layer comprises an inorganic compound.
8 . The structure of claim 1 , wherein the encapsulation layer comprises silicon dioxide.
9 . A structure comprising:
an organic solid crystal layer; and
an encapsulation layer disposed over top and sidewall surfaces of the organic solid crystal layer, wherein a thickness of the encapsulation layer ranges from approximately 100 nm to approximately 1 mm.
10 . The structure of claim 9 , wherein the organic solid crystal layer comprises a hydrocarbon selected from the group consisting of anthracene, phenanthrene, tolane, thiophene, pyrene, corannulene, fluorene, biphenyl, and ter-phenyl.
11 . The structure of claim 9 , wherein the encapsulation layer comprises a polymer.
12 . The structure of claim 9 , wherein the encapsulation layer comprises an inorganic compound.
13 . A method comprising:
forming an organic solid crystal layer; and
forming an encapsulation layer over top, bottom, and sidewall surfaces of the organic solid crystal layer, wherein a thickness of the encapsulation layer ranges from approximately 100 nm to approximately 1 mm.
14 . The method of claim 13 , wherein forming the encapsulation layer comprises chemical vapor deposition, physical vapor deposition, spin-coating, dip-coating, spray coating, or 3D-printing.
15 . The method of claim 13 , wherein the encapsulation layer entirely envelops the organic solid crystal.
16 . The method of claim 13 , wherein the encapsulation layer comprises a polymer.
17 . The method of claim 13 , wherein the encapsulation layer comprises an inorganic compound.
18 . The method of claim 13 , wherein the encapsulation layer comprises silicon dioxide.