Methods for reducing vibration of semiconductor manufacturing apparatuses and semiconductor manufacturing apparatuses
A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
1 . A method, comprising:
measuring a vibration associated with an operation of a semiconductor manufacturing apparatus,
determining a first source of the vibration,
coupling a first weight to a first external surface of the apparatus proximate to the first source of the vibration,
remeasuring the vibration, and
when the remeasured vibration is above an acceptable level, coupling an additional weight to the first weight on the first external surface of the apparatus, wherein the first weight includes an attachment part configured to receive and retain the additional weight.
2 . The method of claim 1 , wherein the first source of the vibration comprises a section of the apparatus where a wafer boat is loaded and unloaded.
3 . The method of claim 2 , wherein the first external surface is within 1 cm to 10 cm of the section of the apparatus where the wafer boat is loaded and unloaded.
4 . The method of claim 1 , further comprising determining a second source of the vibration.
5 . The method of claim 4 , further comprising coupling a second weight to a second external surface of the apparatus proximate to the second source of the vibration.
6 . The method of claim 5 , wherein the second source of the vibration comprises a portion of the apparatus where users interact with the apparatus.
7 . The method of claim 6 , wherein the portion of the apparatus comprises a graphical user interface.
8 . A method, comprising:
measuring a vibration associated with an operation of a semiconductor manufacturing apparatus,
determining a source of the vibration,
coupling a plurality of weights at different locations on an exterior of the apparatus to provide a balanced distribution of the plurality of weights,
remeasuring the vibration, and
when the remeasured vibration is above an acceptable level, coupling additional weights to the plurality of weights at the different locations on the exterior of the apparatus, wherein the plurality of weights include attachment parts configured to receive and retain the additional weights.
9 . The method of claim 8 , wherein the different locations comprise a first location on a first lateral wall and a second location on a second lateral wall opposite the first wall.
10 . The method of claim 9 , wherein the plurality of weights comprises a first weight coupled to the first wall and a second weight coupled to the second wall.
11 . The method of claim 10 , wherein a weight value of the first weight is the same as a weight value of the second weight.
12 . The method of claim 9 , wherein a height of the first location from a floor on which the apparatus is disposed is the same as a height of the second location from the floor.
13 . The method of claim 12 , wherein a distance from the first location to an end of the first wall is the same as a distance from the second location to an end of the second wall.
14 . The method of claim 9 , wherein the first location faces away from the second location.
15 . The method of claim 9 , wherein the first location faces the second location.
16 . A semiconductor manufacturing apparatus, comprising:
external surfaces; and
a plurality of weights attached to balanced locations on the external surfaces, wherein the plurality of weights are configured to maximize a reduction in vibration of the semiconductor manufacturing apparatus, and the plurality of weights attached to the external surfaces include structures configured to receive and retain additional weights.
17 . The apparatus of claim 16 , wherein the external surfaces comprise a first surface and a second surface facing away from the first surface.
18 . The apparatus of claim 17 , wherein the first surface and the second surface are proximate to a semiconductor substrate transport path inside the apparatus.
19 . The apparatus of claim 17 , wherein the external surfaces further comprise a third surface and a fourth surface facing the third surface.
20 . The apparatus of claim 19 , wherein the third surface and the fourth surface are proximate to a user control interface on an exterior of the apparatus.