IP Library Granted Patent US 12680975
Granted Patent B2
US 12680975 · App. 18/685,558 · Granted Jul 14, 2026

Small-sized, reconfigurable, multi-measurement potentiostat circuitry and method

Inventors: José Ilton De Oliveira Filho (Thuwal, SA); Khaled Nabil Salama (Thuwal, SA)
Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
G01N27/02G01N33/49G01N27/48
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Quick Facts
Patent No.
US 12680975
App. No.
18/685,558
Granted
Jul 14, 2026
Kind
B2
Abstract

Potentiostat circuitry for performing electrical tests on a biological material includes an integrated circuit having a processor; a power source configured to supply power to the integrated circuit; a reference electrode pad (RE) electrically connected to the integrated circuit and configured to electrically connect to a reference electrode of a sensor; a counter electrode pad (CE) electrically connected to the integrated circuit and configured to electrically connect to a counter electrode of the sensor; first to third working electrode pads electrically connected to the integrated circuit and configured to electrically connect to first to third working electrode of the sensor, respectively, and a communication module configured to exchange data and/or commands with a smart device. The electrode pads are configured to measure a characteristic of the biological material.

Claims (59)

1 . Potentiostat circuitry for performing electrical tests on a biological material, the potentiostat circuitry comprising:

an integrated circuit having a processor;

a power source configured to supply power to the integrated circuit;

a reference electrode pad (RE) electrically connected to the integrated circuit and configured to electrically connect to a reference electrode of a sensor;

a counter electrode pad (CE) electrically connected to the integrated circuit and configured to electrically connect to a counter electrode of the sensor;

a first working electrode pad (WE 0 ) electrically connected to the integrated circuit and configured to electrically connect to a first working electrode of the sensor;

a second working electrode pad (WE 1 ) electrically connected to the integrated circuit and configured to electrically connect to a second working electrode of the sensor or to a first working electrode of another sensor;

a third working electrode (WE 2 ) pad electrically connected to the integrated circuit and configured to electrically connect to a third working electrode of the sensor or to a second working electrode of the another sensor;

a wireless communication interface configured to exchange data and/or commands with a smart device; and

a first tri-state multiplexer device electrically coupled between the first working electrode pad and plural internal circuit blocks of the integrated circuit,

wherein the processor is configured to select one of three states for the first tri-state multiplexer device such that:

in a first state 0, the first tri-state multiplexer device electrically connects the first working electrode pad to a first internal circuit block of the plural internal circuit blocks,

in a second state 1, the first tri-state multiplexer device electrically connects the first working electrode pad to a second internal circuit block of the plural internal circuit blocks, and

in a third state 2, the first tri-state multiplexer device electrically connects the first working electrode pad to a third internal circuit block of the plural internal circuit blocks.

2 . The potentiostat circuitry of claim 1 , further comprising:

second and third tri-state multiplexer devices configured to connect the second working electrode pad and the third working electrode pad to the plural internal circuit blocks,

wherein each of the second and third tri-state multiplexer devices has three distinct states.

3 . The potentiostat circuitry of claim 2 , wherein the processor of the integrated circuitry is configured to select a corresponding state of each of the second and third tri-state multiplexer devices.

4 . The potentiostat circuitry of claim 3 , wherein the first internal circuit block is a first transimpedance amplifier, the second internal circuit block is an analog to digital converter, and the third internal circuit block is a voltage digital-to-analog converter.

5 . The potentiostat circuitry of claim 4 , wherein for a first state 0, the second tri-state multiplexer device electrically connects the second working electrode pad to a second transimpedance amplifier, for a second state 1, the second tri-state multiplexer device electrically connects the second working electrode pad to the analog to digital converter, and for a third state 2, the second tri-state multiplexer device electrically connects the second working electrode pad to the voltage digital-to-analog converter.

6 . The potentiostat circuitry of claim 5 , wherein for a first state 0, the third tri-state multiplexer device electrically connects the third working electrode pad to a third transimpedance amplifier, for a second state 1, the third tri-state multiplexer device electrically connects the third working electrode pad to the analog to digital converter, and for a third state 2, the third tri-state multiplexer device electrically connects the third working electrode pad to the voltage digital-to-analog converter.

7 . The potentiostat circuitry of claim 6 , further comprising:

a fourth tri-state multiplexer device that is configured to connect a selected output of the first to third transimpedance amplifiers to a sigma-delta analog-to-digital converter.

8 . The potentiostat circuitry of claim 7 , wherein the processor of the integrated circuitry is configured to select one of the first to third states for each of the first to fourth tri-state multiplexer devices based on a test to be performed.

9 . The potentiostat circuitry of claim 8 , further comprising:

a first operational amplifier; and

a dual-state multiplexer device that electrically connects the reference electrode pad and the counter electrode pad to an input the first operational amplifier.

10 . The potentiostat circuitry of claim 6 , further comprising:

a voltage up-converter module connected to the power source and configured to increase a voltage generated by the power source; and

a voltage conditioning circuit electrically connected to the first to third transimpedance amplifiers.

11 . The potentiostat circuitry of claim 6 , further comprising:

an impedance converter circuit electrically connected to the integrated circuit through an inter-integrated circuit bus.

12 . The potentiostat circuitry of claim 11 , wherein the impedance converter circuit comprises:

a frequency generator unit that generates a frequency for exciting the sensor; and

a digital signal processor configured to analyze a received frequency and determine an impedance of the biological material.

13 . A point of contact testing device for determining a characteristic of a biological material, the point of contact testing device comprising:

a sensor having a reference electrode (R), a counter electrode (C), and at least one working electrode (W 1 ), the sensor being configured to receive the biological material; and

potentiostat circuitry including,

an integrated circuit having a processor,

a reference electrode pad (RE) electrically connected to the integrated circuit and configured to electrically connect to the reference electrode (R) of the sensor,

a counter electrode pad (CE) electrically connected to the integrated circuit and configured to electrically connect to the counter electrode (C) of the sensor,

a first working electrode pad (WE 0 ) electrically connected to the integrated circuit and configured to electrically connect to the first working electrode (W 1 ) of the sensor,

a second working electrode pad (WE 1 ) electrically connected to the integrated circuit and configured to electrically connect to a second working electrode of the sensor or to a first working electrode of another sensor,

a third working electrode pad (WE 2 ) electrically connected to the integrated circuit and configured to electrically connect to a third working electrode of the sensor or to a second working electrode of the another sensor,

a wireless communication interface configured to exchange data and/or commands with a smart device,

a first tri-state multiplexer device electrically coupled between the first working electrode pad and plural internal circuit blocks of the integrated circuit,

wherein the processor is configured to select one of three states for the first tri-state multiplexer device such that:

in a first state 0, the first tri-state multiplexer device electrically connects the first working electrode pad to a first internal circuit block of the plural internal circuit blocks,

in a second state 1, the first tri-state multiplexer device electrically connects the first working electrode pad to a second internal circuit block of the plural internal circuit blocks, and

in a third state 2, the first tri-state multiplexer device electrically connects the first working electrode pad to a third internal circuit block of the plural internal circuit blocks.

14 . The point of contact testing device of claim 13 , further comprising:

second and third tri-state multiplexer devices configured to connect the second working electrode pad and the third working electrode pad to the plural internal circuit blocks,

wherein each of the second and third tri-state multiplexer devices has three distinct states.

15 . The point of contact testing device of claim 14 , wherein the processor of the integrated circuitry is configured to select a corresponding state of each of the second and third tri-state multiplexer device.

16 . The point of contact testing device of claim 15 , wherein the first internal circuit block is a first transimpedance amplifier, the second internal circuit block is an analog to digital converter, and the third internal circuit board is a voltage digital-to-analog converter.

17 . The point of contact testing device of claim 16 , wherein for a first state 0, the second tri-state multiplexer device electrically connects the second working electrode pad to a second transimpedance amplifier, for a second state 1, the second tri-state multiplexer device electrically connects the second working electrode pad to the analog to digital converter, and for a third state 2, the second tri-state multiplexer device electrically connects the second working electrode pad to the voltage digital-to-analog converter.

18 . The point of contact testing device of claim 17 , wherein for a first state 0, the third tri-state multiplexer device electrically connects the third working electrode pad to a third transimpedance amplifier, for a second state 1, the third tri-state multiplexer device electrically connects the third working electrode pad to the analog to digital converter, and for a third state 2, the third tri-state multiplexer device electrically connects the third working electrode pad to the voltage digital-to-analog converter.

19 . The point of contact testing device of claim 13 , wherein the sensor includes three working electrodes.

20 . The point of contact testing device of claim 13 , wherein the sensor includes three electrodes and the another sensor also includes three electrodes and the potentiostat circuitry is configured to simultaneously connect to both the sensor and the another sensor.