IP Library Granted Patent US 12681196
Granted Patent B2
US 12681196 · App. 18/286,808 · Granted Jul 14, 2026

Methods and apparatuses for enhancing scintillation with optical nanostructures for scintillators, LEDs, and laser sources

Inventors: John Joannopoulos (Belmont, MA); Steven Johnson (Arlington, MA); Marin Soljacic (Belmont, MA); Steven Kooi (Lexington, MA); Justin Beroz (Cambridge, MA); Ido Kaminer (Haifa, IL); Nicholas Rivera (Somerville, MA); Yi Yang (Cambridge, MA); Charles Roques-Carmes (Cambridge, MA); Ali Ghorashi (Boston, MA); Zin Lin (Boston, MA); Nicolas Romeo (Somerville, MA)
Assignees: Massachusetts Institute of Technology; TECHNION RESEARCH & DEVELOPMENTAL FOUNDATION LIMITED
G01T1/2018G01N23/04G01N23/083G01N23/2251
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Quick Facts
Patent No.
US 12681196
App. No.
18/286,808
Granted
Jul 14, 2026
Kind
B2
Abstract

Methods and systems are disclosed that enhance the yield and speed of emission and control the spectral and angular emission of light emitted by materials under irradiation by high-energy particles through a process known as scintillation. In each case, a photonic structure (of nano- or micron-scale feature sizes) is integrated with a scintillating material, and the photonic structure enhances the yield or controls the spectrum of the material. Various embodiments of this technology and practical demonstrations are disclosed.

Claims (29)

1 . A scintillating device, comprising a substrate having a thickness, wherein the substrate is patterned such that a scintillation yield of the scintillating device is at least 10% greater than a device comprising the substrate having the thickness that is not patterned.

2 . The scintillating device of claim 1 , wherein the scintillation yield is at least 50% greater than the device comprising the substrate having the thickness that is not patterned.

3 . The scintillating device of claim 1 , wherein the scintillation yield is at least 100% greater than the device comprising the substrate having the thickness that is not patterned.

4 . The scintillating device of claim 1 , where the substrate pattern comprises a single hole, square or other shape with features having dimensions between 10 nm and 10 microns, or a periodic or aperiodic array of holes, squares, or other shapes with features having dimensions between 10 nm and 10 microns, wherein the features comprise radius, side length or other geometric parameters.

5 . The scintillating device of claim 4 , wherein a depth of the holes, squares or other shapes is between 10 nm and 10 microns.

6 . The scintillating device of claim 1 , where the substrate pattern comprises a single cylinder, post or other extruding structure having dimensions between 10 nm and 10 microns, or a periodic or aperiodic array of cylinders, posts, or other extruding structures having dimensions between 10 nm and 10 microns.

7 . The scintillating device of claim 1 , where the substrate is patterned in a three-dimensional, periodic or aperiodic fashion.

8 . The scintillating device of claim 1 , where a metallic thin film is deposited on a surface of the substrate and patterned.

9 . The scintillating device of claim 8 , wherein the thickness of the metallic thin film is between 1 nm and 1000 nm.

10 . The scintillating device of claim 1 , where the substrate is patterned in a one-dimensional fashion in a periodic or aperiodic fashion, resulting in an arrangement of multiple layers of materials, where each layer has a thickness of 10 nm to 10 microns.

11 . The scintillating device of claim 1 , where the substrate comprises one or more layers of materials disposed on a metallic substrate.

12 . The scintillating device of claim 11 , wherein a top layer is patterned, where a top layer comprises single hole, square, post, cylinder or other extruded structure or a periodic or aperiodic array of holes, squares, posts, cylinders or other extruded structures having a dimension of 10 nm to 10 microns.

13 . The scintillating device of claim 1 , where one or multiple layers of a two-dimensional material are deposited on the substrate.

14 . The scintillating device of claim 13 , wherein the two-dimensional material comprises hexagonal boron nitride, graphene, or molybdenum disulphide.

15 . The scintillating device of claim 13 , wherein the two-dimensional material comprises a single hole, square, post, cylinder or other extruded structure or a periodic or aperiodic array of holes, squares, posts, cylinders or other extruded structures having a dimension of 10 nm to 10 microns.

16 . A system to display and reconstruct scintillation emission, comprising:

a light detection system; and

the scintillating device of claim 1 ;

wherein the system is used to detect high energy particles from a known source in an HEP imaging system or from an environment.

17 . An X-Ray imaging system, comprising:

a light detection system; and

the scintillating device of claim 1 .

18 . A system comprising:

a light detection system;

an HEP source;

the scintillating device of claim 1 ; and

a specimen, wherein the specimen is located between the scintillating device and the HEP source.

19 . The system of claim 18 , wherein the system is enclosed in a vacuum chamber, to image the specimen using charged HEPs such as free electrons.

20 . The system of claim 19 , wherein the system comprises a cathodoluminescence detector in an electron microscope.