Photonic alignment device and method
An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic die and at least one optical fiber. Devices and methods are shown that include an optical coupler and one or more correction regions to align a beam between the photonic die and the optical fiber.
1 . A photonic device, comprising:
a photonic die having an optical port;
an optical fiber having an end adjacent to the optical port;
an optical coupler located between the optical fiber and the optical port, the optical coupler including a transparent material having a first index of refraction;
a beam path through the transparent material of the optical coupler; and
one or more correction regions along the beam path, the one or more correction regions having a second index of refraction different than the first index of refraction wherein the second index of refraction is capable of being modified in the photonic device to increase coupling efficiency between the optical fiber and the optical port.
2 . The photonic device of claim 1 , wherein the optical fiber is part of an optical fiber array.
3 . The photonic device of claim 1 , further including a first lens at an interface between the optical coupler and the optical port.
4 . The photonic device of claim 3 , further including a second lens at an interface between the optical coupler and the optical fiber.
5 . The photonic device of claim 1 , wherein the one or more correction regions includes two correction regions.
6 . The photonic device of claim 1 , wherein the one or more correction regions includes a tapered cross section.
7 . The photonic device of claim 1 , wherein the one or more correction regions includes a gradient of refractive index.
8 . A semiconductor device, comprising:
a photonic die coupled to a substrate, the photonic die having an optical port;
an electronic die coupled to the substrate and electrically connected to the photonic die;
an optical fiber having an end adjacent to the optical port;
an optical coupler located between the optical fiber and the optical port, the optical coupler including a transparent material having a first index of refraction;
a beam path through the transparent material of the optical coupler; and
one or more correction regions along the beam path, the one or more correction regions having a second index of refraction different than the first index of refraction wherein the second index of refraction is capable of being modified in the semiconductor device to increase coupling efficiency between the optical fiber and the optical port.
9 . The semiconductor device of claim 8 , further including one or more capacitors coupled to the substrate.
10 . The semiconductor device of claim 8 , wherein the photonic die and the electronic die are on a first side of the substrate.
11 . The semiconductor device of claim 8 , further including solder connections on a second side of the substrate opposite the photonic die and the electronic die.
12 . The semiconductor device of claim 8 , wherein the one or more correction regions includes two correction regions.
13 . The semiconductor device of claim 8 , wherein the one or more correction regions includes a tapered cross section.
14 . The semiconductor device of claim 8 , wherein the one or more correction regions includes a gradient of refractive index.
15 . A method of forming a semiconductor device, comprising:
placing an optical fiber adjacent to an optical port of a photonic die;
placing an optical coupler between the optical fiber and the optical port; and
after placing the optical fiber and the optical coupler, forming one or more correction regions between a first end and a second end of the optical coupler to modify a beam path between the optical port and the optical fiber.
16 . The method of claim 15 , wherein forming one or more correction regions includes using a laser to modify an index of refraction in the optical coupler locally at the one or more correction regions.
17 . The method of claim 15 , wherein forming one or more correction regions includes forming two correction regions.
18 . The method of claim 16 , wherein forming one or more correction regions includes modifying an index of refraction in the optical coupler to form a gradient of index of refraction within the one or more correction regions.
19 . The method of claim 16 , wherein forming one or more correction regions includes modifying an index of refraction in the optical coupler to form a wedge shaped correction region.
20 . The method of claim 16 , wherein forming one or more correction regions includes modifying an index of refraction within an interior of the optical coupler.