Electronic package having connector for guiding light carrying medium

1 . An electronic package, comprising:

a carrier;

a photonic component disposed over the carrier and including an input/output (I/O) port at a first surface of the photonic component;

a connector disposed over the first surface of the photonic component and extending beyond a lateral surface of the photonic component, wherein the connector defines an opening configured to accommodate a light carrying medium,

a plurality of conductive pillars disposed between the connector and the carrier, and electrically connecting the connector to the carrier, wherein the plurality of conductive pillars surround all lateral surfaces of the photonic component, and wherein the plurality of conductive pillars and the photonic component are located at substantially same elevation with respect to the carrier;

a soldering material disposed between the connector and the photonic component, wherein the soldering material electrically connects a conductive pad of the connector to a conductive pad of the photonic component; and

an electrically insulating dam disposed between the connector and the photonic component, wherein the plurality of conductive pillars are closer to the soldering material than to the electrically insulating dam,

wherein the photonic component is electrically connected with the carrier through the connector, and

wherein the opening and the light carrying medium extend vertically with respect to the first surface of the photonic component.

2 . The electronic package of claim 1 , further comprising:

an electronic component disposed over the carrier and electrically connected with the photonic component through the carrier and the connector,

wherein the connector has a monolithic structure, and

wherein the I/O port of the photonic component includes a light-emitting diode (LED) or a photodiode (PD).

3 . The electronic package of claim 2 , further comprising:

an encapsulating layer covering the electronic component and the connector, wherein a surface of the encapsulating layer, a surface of the electronic component, and a surface of the connector are substantially coplanar, and wherein the photonic component is configured to receive an optical signal from the light carrying medium and to convert the optical signal into an electrical signal for the electronic component, and wherein the electrically insulating dam is configured to prevent the encapsulating layer from flowing into the opening.

4 . The electronic package of claim 3 , further comprising:

a heat dissipating element contacting the surface of the electronic component, the surface of the encapsulating layer, and the surface of the connector, wherein the photonic component and the connector do not overlap horizontally with respect to the first surface of the photonic component.

5 . The electronic package of claim 4 ,

wherein the electrically insulating dam and the connector collectively define the opening, and wherein the electronic component overlaps horizontally with the photonic component and the connector, with respect to the first surface of the photonic component.

6 . The electronic package of claim 1 , wherein the opening fully penetrates the connector to expose the I/O port of the photonic component and is configure to align the light carrying medium with the I/O port.

7 . The electronic package of claim 6 , wherein the light carrying medium has a lower portion fully surrounded by connector.

8 . The electronic package of claim 1 , wherein the opening fully penetrates the connector and exposes the I/O port, and wherein the I/O port of the photonic component includes a light-emitting diode (LED) or a photodiode (PD).

9 . The electronic package of claim 1 , wherein a lateral surface of the connector and a lateral surface of the electrically insulating dam are substantially coplanar.

10 . The electronic package of claim 1 , further comprising:

a dielectric layer disposed adjacent to the photonic component and surrounding the plurality of conductive pillars; and

an encapsulating layer separating the dielectric layer from the photonic component.

11 . The electronic package of claim 9 , wherein the photonic component includes a second surface opposite the first surface, and the plurality of conductive pillars extend beyond the first surface of the photonic component and the second surface of the photonic component.

12 . An electronic package, comprising:

a carrier;

an optical transceiver disposed over the carrier, the optical transceiver including a surface facing away from the carrier;

a connector disposed over the surface and having an overhang structure over the carrier, wherein the optical transceiver is electrically connected with the carrier through the connector;

a plurality of light carrying mediums disposed over the surface along at least two dimensions, wherein the connector has a monolithic structure and a plurality of openings fully penetrating the connector;

a plurality of conductive pillars disposed between the connector and the carrier, and electrically connecting the connector to the carrier, wherein the plurality of conductive pillars surround all lateral surfaces of the optical transceiver, and wherein the plurality of conductive pillars and the optical transceiver are located at substantially same elevation with respect to the carrier;

a soldering material disposed between the connector and the optical transceiver, wherein the soldering material electrically connects a conductive pad of the connector to a conductive pad of the optical transceiver; and

an electrically insulating dam disposed between the connector and the optical transceiver, wherein the plurality of conductive pillars are closer to the soldering material than to the electrically insulating dam.

13 . The electronic package of claim 12 , wherein the optical transceiver and the connector do not overlap horizontally with respect to the surface of the optical transceiver, wherein the connector extends beyond opposite sides of the optical transceiver, wherein the connector is configure to align the plurality of light carrying mediums with light-emitting diodes (LEDs) or photodiodes (PDs) of the optical transceiver, and wherein each of the plurality of light carrying mediums is disposed in one corresponding opening of the plurality of openings.

14 . The electronic package of claim 12 , further comprising:

an electronic component disposed over the carrier and electrically connected with the optical transceiver through the carrier and the connector, wherein the optical transceiver is configured to receive an optical signal from one of the plurality of light carrying mediums and to convert the optical signal into an electrical signal, wherein the electronic component is configured to receive the electrical signal, and wherein the electronic component overlaps horizontally with the optical transceiver and the connector, with respect to the surface of the optical transceiver.

15 . The electronic package of claim 12 , wherein the connector has a conductive trace in the overhang structure of the connector, wherein the conductive pad of the optical transceiver is electrically connected with the conductive trace.

16 . The electronic package of claim 15 , wherein a lateral surface of the connector and a lateral surface of the electrically insulating dam are substantially coplanar.

17 . An electronic package, comprising:

a carrier;

a photonic component disposed over the carrier and having an I/O port;

a connector disposed over the photonic component and defining an opening, wherein the I/O port is within the opening from a top view; and

a plurality of conductive pillars disposed between the connector and the carrier, and electrically connecting the connector to the carrier, wherein the plurality of conductive pillars surround all lateral surfaces of the photonic component, and wherein the plurality of conductive pillars and the photonic component are located at substantially same elevation with respect to the carrier;

a soldering material disposed between the connector and the photonic component, wherein the soldering material electrically connects a conductive pad of the connector to a conductive pad of the photonic component; and

an electrically insulating dam disposed between the connector and the photonic component, wherein the plurality of conductive pillars are closer to the soldering material than to the electrically insulating dam,

wherein a height of the plurality of conductive pillars is greater than a thickness of the photonic component, and

wherein the photonic component is electrically connected with the carrier through the connector and the plurality of conductive pillars.

18 . The electronic package of claim 17 , further comprising:

a first dielectric layer encapsulating a first set of the plurality of conductive pillars;

a second dielectric layer encapsulating a second set of the plurality of conductive pillars, wherein the photonic component is disposed between the first dielectric layer and the second dielectric layer; and

an encapsulating layer separating the photonic component from the first dielectric layer and the second dielectric layer, and wherein the electrically insulating dam is configured to prevent the encapsulating layer from flowing into the opening.

19 . The electronic package of claim 17 , wherein the connector is spaced apart from the photonic component and electrically connected with the photonic component, and wherein the I/O port of the photonic component includes a light-emitting diode (LED) or a photodiode (PD), and wherein the electronic package further comprises:

an electronic component disposed over the carrier and electrically connected with the photonic component through the carrier and the connector;

an encapsulating layer covering the electronic component and the connector, wherein a top surface of the encapsulating layer, a top surface of the electronic component, and a top surface of the connector are substantially coplanar; and

a heat dissipating element contacting the top surface of the encapsulating layer, the top surface of the electronic component, and the top surface of the connector.

20 . The electronic package of claim 19 , wherein the opening fully penetrates the connector to expose the I/O port of the photonic component and is configure to align a light carrying medium with the I/O port,

wherein the electrically insulating dam is configured to maintain a gap between the photonic component and the connector, and wherein a lateral surface of the connector and a lateral surface of the electrically insulating dam are substantially coplanar.