3D system and wafer reconstitution with mid-layer interposer
A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while the first package level components can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds. Dies within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.
1 . A three dimensional (3D) system comprising:
a mid-layer interposer;
a first package level underneath the mid-layer interposer, the first package level including a first first-level die directed bonded with the mid-layer interposer; and
a second package level over the mid-layer interposer, the second package level including a first second-level die direct bonded with the mid-layer interposer and a second second-level die direct bonded with the mid-layer interposer;
wherein the mid-layer interposer includes an electrical-to-optical (EO) converter electrically connected with the first second-level die, an optical-to-electrical (OE) converter electrically connected with the second second-level die, and an optical interconnect that connects the EO converter and the OE converter.
2 . The 3D system of claim 1 , wherein the first second-level die and the second second-level die are both hybrid bonded with the mid-layer interposer.
3 . The 3D system of claim 1 , wherein the optical interconnect comprises a waveguide or photonic wire.
4 . The 3D system of claim 1 , wherein the EO converter is connected to a first electromagnetic field communication structure, and the first second-level die includes a second electromagnetic field communication structure.
5 . The 3D system of claim 4 , wherein the first electromagnetic field communication structure and the second electromagnetic field communication structure are vertically aligned.
6 . The 3D system of claim 5 , wherein the first electromagnetic field communication structure and the second electromagnetic field communication structure are coils or capacitors.
7 . The 3D system of claim 1 , wherein the mid-layer interposer includes a plurality of devices selected from the group consisting of capacitors, magnetic elements and active devices.
8 . A three dimensional (3D) system comprising:
a mid-layer interposer;
a first package level underneath the mid-layer interposer, the first package level including a first first-level die directed bonded with the mid-layer interposer; and
a second package level over the mid-layer interposer, the second package level including a first second-level die direct bonded with the mid-layer interposer and a second second-level die direct bonded with the mid-layer interposer;
wherein the first second-level die includes an electrical-to-optical (EO) converter, and the second second-level die includes an optical-to-electrical (OE) converter; and
wherein the mid-layer interposer includes an optical interconnect that is optically connected with the EO converter and the OE converter.
9 . The 3D system of claim 8 , wherein the optical interconnect is selected from the group consisting of a waveguide and a photonic wire.
10 . The 3D system of claim 9 , further comprising a first optical via that optically connects the EO converter to the optical interconnect, and a second optical via that optically connects the optical interconnect to the OE converter.
11 . The 3D system of claim 10 , wherein the first second-level die includes a plurality of sub-chiplets, and the first optical via extends through one or more of the plurality of sub-chiplets.
12 . The 3D system of claim 8 , wherein the mid-layer interposer includes a plurality of devices selected from the group consisting of capacitors, magnetic elements and active devices.
13 . A 3D system comprising:
a mid-layer interposer;
a first package level including a first-level die directed bonded with the mid-layer interposer;
a second package level including a second-level die directed bonded with the mid-layer interposer;
wherein the first-level die or intermediate interposer includes an optical-to-electrical (OE) converter, and the second-level die includes an electrical-to-optical (EO) converters; and
an optical via that optically connects the EO converter with the OE converter.
14 . The 3D system of claim 13 , wherein:
the first-level die includes the OE converter; and
the optical via extends through the mid-layer interposer vertically between the first-level die and the second-level die.
15 . The 3D system of claim 13 , wherein the second-level die includes a plurality of sub-chiplets, and the optical via extends through one or more of the plurality of sub-chiplets.
16 . The 3D system of claim 15 , wherein the mid-layer interposer includes the OE converter.
17 . The 3D system of claim 13 , wherein the mid-layer interposer includes a plurality of devices selected from the group consisting of capacitors, magnetic elements and active devices.